Wafa wa P-type SiC 4H/6H-P 3C-N 6inch makulidwe 350 μm yokhala ndi Primary Flat Orientation
Kufotokozera4H/6H-P Mtundu SiC Composite Substrates Common parameter table
6 Chigawo cha Silicon Carbide (SiC) cha mainchesi awiri Kufotokozera
| Giredi | Kupanga kwa MPD KopandaGiredi (Z) Giredi) | Kupanga KokhazikikaGiredi (P) Giredi) | Giredi Yopanda Chilungamo (D Giredi) | ||
| M'mimba mwake | 145.5 mm ~ 150.0 mm | ||||
| Kukhuthala | 350 μm ± 25 μm | ||||
| Kuwongolera kwa Wafer | -Offmzere wozungulira: 2.0°-4.0° kulowera [1120] ± 0.5° pa 4H/6H-P, Pa mzere wozungulira:〈111〉± 0.5° pa 3C-N | ||||
| Kuchuluka kwa mapaipi ang'onoang'ono | 0 cm-2 | ||||
| Kusakhazikika | mtundu wa p 4H/6H-P | ≤0.1 Ωꞏcm | ≤0.3 Ωꞏcm | ||
| n-mtundu 3C-N | ≤0.8 mΩꞏcm | ≤1 m Ωꞏcm | |||
| Kuyang'ana Kwambiri Pang'onopang'ono | 4H/6H-P | -{1010} ± 5.0° | |||
| 3C-N | -{110} ± 5.0° | ||||
| Utali Woyamba Wathyathyathya | 32.5 mm ± 2.0 mm | ||||
| Utali Wachiwiri Wathyathyathya | 18.0 mm ± 2.0 mm | ||||
| Kuyang'ana Kwachiwiri Kwapafupi | Silikoni yoyang'ana mmwamba: 90° CW. kuchokera ku Prime flat ± 5.0° | ||||
| Kupatula Mphepete | 3 mm | 6 mm | |||
| LTV/TTV/Uta/Warp | ≤2.5 μm/≤5 μm/≤15 μm/≤30 μm | ≤10 μm/≤15 μm/≤25 μm/≤40 μm | |||
| Kuuma | Chipolishi Ra≤1 nm | ||||
| CMP Ra≤0.2 nm | Ra≤0.5 nm | ||||
| Ming'alu ya Mphepete Yopangidwa ndi Kuwala Kwakukulu Kwambiri | Palibe | Kutalika kokwanira ≤ 10 mm, kutalika kamodzi ≤2 mm | |||
| Mbale za Hex Ndi Kuwala Kwakukulu Kwambiri | Malo osonkhanitsidwa ≤0.05% | Malo osonkhanitsidwa ≤0.1% | |||
| Malo Opangidwa ndi Polytype Ndi Kuwala Kwambiri | Palibe | Malo osonkhanitsidwa ≤3% | |||
| Kuphatikizidwa kwa Kaboni Yowoneka | Malo osonkhanitsidwa ≤0.05% | Malo osonkhanitsidwa ≤3% | |||
| Kukanda kwa Silicon Pamwamba Ndi Kuwala Kwambiri | Palibe | Kutalika kokwanira ≤1 × m'mimba mwake wa wafer | |||
| Ma Chips a M'mphepete Okhala ndi Mphamvu Yaikulu | Palibe chololedwa m'lifupi ndi kuya kwa ≥0.2mm | 5 zololedwa, ≤1 mm iliyonse | |||
| Kuipitsidwa kwa Silicon pamwamba ndi Mphamvu Yaikulu | Palibe | ||||
| Kulongedza | Kaseti ya ma wafer ambiri kapena chidebe chimodzi cha ma wafer | ||||
Zolemba:
※ Malire a zolakwika amagwiritsidwa ntchito pamwamba pa wafer yonse kupatulapo malo olekanitsidwa ndi m'mphepete. # Mikwingwirima iyenera kuwonedwa pa nkhope ya Si o
Wafer ya P-type SiC, 4H/6H-P 3C-N, yokhala ndi kukula kwake kwa mainchesi 6 ndi makulidwe a 350 μm, imagwira ntchito yofunika kwambiri popanga zamagetsi zamagetsi zamagetsi ogwira ntchito kwambiri m'mafakitale. Kutulutsa kwake kwabwino kwambiri kwa kutentha komanso mphamvu zamagetsi zomwe zimawonongeka zimapangitsa kuti ikhale yoyenera kupanga zinthu monga ma switch amagetsi, ma diode, ndi ma transistors omwe amagwiritsidwa ntchito m'malo otentha kwambiri monga magalimoto amagetsi, ma gridi amagetsi, ndi makina amagetsi obwezerezedwanso. Kuthekera kwa wafer kugwira ntchito bwino m'malo ovuta kumatsimikizira magwiridwe antchito odalirika m'mafakitale omwe amafunikira mphamvu zambiri komanso kugwiritsa ntchito bwino mphamvu. Kuphatikiza apo, mawonekedwe ake oyambira osalala amathandizira kulinganiza bwino panthawi yopanga chipangizocho, kukulitsa magwiridwe antchito komanso kusinthasintha kwa zinthu.
Ubwino wa substrates za N-type SiC composite ndi monga
- Kutentha Kwambiri: Ma wafer a mtundu wa P SiC amachotsa kutentha bwino, zomwe zimapangitsa kuti akhale abwino kwambiri pakugwiritsa ntchito kutentha kwambiri.
- Kuwonongeka Kwambiri kwa Voliyumu: Yokhoza kupirira ma voltage okwera, kuonetsetsa kuti zipangizo zamagetsi zamagetsi ndi zamagetsi amphamvu zimadalirana.
- Kukana Malo Ovuta: Kulimba bwino kwambiri m'malo ovuta kwambiri, monga kutentha kwambiri komanso malo owononga.
- Kutembenuka Kwamphamvu Kwabwino: Kugwiritsira ntchito mankhwala osokoneza bongo a mtundu wa P kumathandiza kuti magetsi azigwiritsidwa ntchito bwino, zomwe zimapangitsa kuti wafer ikhale yoyenera kugwiritsa ntchito makina osinthira mphamvu.
- Kuyang'ana Kwambiri Pang'onopang'ono: Zimaonetsetsa kuti chipangizocho chikugwirizana bwino popanga zinthu, kupititsa patsogolo kulondola kwa chipangizocho komanso kusinthasintha kwake.
- Kapangidwe Koonda (350 μm): Kukhuthala kwabwino kwa wafer kumathandiza kuti iphatikizidwe mu zipangizo zamagetsi zapamwamba komanso zocheperako.
Ponseponse, wafer ya P-type SiC, 4H/6H-P 3C-N, imapereka zabwino zambiri zomwe zimapangitsa kuti ikhale yoyenera kwambiri kugwiritsidwa ntchito m'mafakitale ndi zamagetsi. Mphamvu yake yotenthetsera kutentha kwambiri komanso mphamvu yophwanyika imalola kugwira ntchito modalirika m'malo otentha kwambiri komanso amphamvu kwambiri, pomwe kukana kwake kumadera ovuta kumatsimikizira kulimba. Kugwiritsa ntchito mankhwala osokoneza bongo a P-type kumalola kusintha mphamvu moyenera, zomwe zimapangitsa kuti ikhale yoyenera kugwiritsa ntchito zamagetsi zamagetsi ndi machitidwe amphamvu. Kuphatikiza apo, mawonekedwe oyamba a wafer amatsimikizira kulumikizana kolondola panthawi yopanga, ndikuwonjezera kusinthasintha kwa kupanga. Ndi makulidwe a 350 μm, ndi yoyenera kugwiritsidwa ntchito m'zida zapamwamba komanso zazing'ono.
Chithunzi Chatsatanetsatane
