Zipangizo Zochepetsera Ma Wafer za 4 Inch-12 Inch Sapphire/SiC/Si Wafers

Zipangizo Zochepetsera Ma Wafer a 4 Inch-12 Inch Sapphire/SiC/Si Wafers Processing Chithunzi Chodziwika

Kufotokozera Kwachidule:

Zipangizo Zothira Ma Wafer ndi chida chofunikira kwambiri popanga ma semiconductor kuti achepetse makulidwe a wafer kuti azitha kuyendetsa bwino kutentha, magwiridwe antchito amagetsi, komanso kugwiritsa ntchito bwino ma paketi. Zipangizozi zimagwiritsa ntchito makina opukutira, kupukuta kwa makina a chemical (CMP), ndi ukadaulo wouma/wonyowa kuti zikwaniritse kuwongolera makulidwe kolondola kwambiri (± 0.1 μm) komanso kugwirizana ndi ma wafer a mainchesi 4–12. Makina athu amathandizira kuyang'ana kwa C/A-plane ndipo amapangidwa kuti azigwiritsidwa ntchito pa ntchito zapamwamba monga ma 3D IC, zida zamagetsi (IGBT/MOSFET), ndi masensa a MEMS.

XKH imapereka mayankho athunthu, kuphatikizapo zida zosinthidwa (2–12-inch wafer processing), kukonza njira (defect defect density <100/cm²), ndi maphunziro aukadaulo.

Tumizani imelo kwa ife

Mawonekedwe

Mfundo Yogwirira Ntchito

Njira yochepetsera wafer imagwira ntchito m'magawo atatu:
Kupera Kovuta: Gudumu la diamondi (kukula kwa grit 200–500 μm) limachotsa 50–150 μm ya zinthu pa liwiro la 3000–5000 rpm kuti lichepetse msanga makulidwe.
Kupera Mopyapyala: Gudumu lopyapyala (kukula kwa grit 1–50 μm) limachepetsa makulidwe kufika pa 20–50 μm pa <1 μm/s kuti lichepetse kuwonongeka kwa pansi pa nthaka.
Kupukuta (CMP): Dothi lopangidwa ndi mankhwala ndi makina limachotsa kuwonongeka kotsala, zomwe zimapangitsa kuti Ra <0.1 nm ifike.

Zipangizo Zogwirizana

Silicon (Si): Yoyenera ma wafer a CMOS, yochepetsedwa kufika 25 μm kuti igwiritsidwe ntchito mu 3D stacking.
Silicon Carbide (SiC): Imafuna mawilo apadera a diamondi (80% kuchuluka kwa diamondi) kuti kutentha kukhale kolimba.
Sapphire (Al₂O₃): Yochepetsedwa kufika 50 μm kuti igwiritsidwe ntchito ndi UV LED.

Zigawo Zapakati pa Dongosolo

1. Dongosolo Lopera
Chopukusira cha Dual-Axis: Chimaphatikiza kupukusira kosalala/kosalala mu nsanja imodzi, kuchepetsa nthawi yozungulira ndi 40%.
Spindle Yozungulira: liwiro la 0–6000 rpm ndi liwiro la radial <0.5 μm.

2. Njira Yogwiritsira Ntchito Wafer
Chotsukira Chosalowa: >50 N yokhala ndi mphamvu yogwirira ntchito yokhala ndi ±0.1 μm yolondola.
Robotic Arm: Imanyamula ma wafer a mainchesi 4–12 pa liwiro la 100 mm/s.

3. Dongosolo Lolamulira
Laser Interferometry: Kuwunika makulidwe a nthawi yeniyeni (resolution 0.01 μm).
Kuwongolera kwa AI: Kumaneneratu kuwonongeka kwa mawilo ndikusintha magawo okha.

4. Kuziziritsa ndi Kuyeretsa
Kuyeretsa kwa Ultrasonic: Kuchotsa tinthu tating'onoting'ono toposa 0.5 μm ndi mphamvu ya 99.9%.
Madzi Opanda Ioni: Amaziziritsa chidebe cha wafer kufika pa <5°C pamwamba pa mlengalenga.

Ubwino Waukulu

1. Kulondola Kwambiri: TTV (Kusiyana Kwa Kukhuthala Konse) <0.5 μm, WTW (Kusiyana Kwa Kukhuthala Kwamkati mwa Wafer) <1 μm.

2. Kuphatikizika kwa Njira Zambiri: Kumaphatikiza kugaya, CMP, ndi plasma etching mu makina amodzi.

3. Kugwirizana kwa Zinthu:
Silikoni: Kuchepetsa makulidwe kuchokera pa 775 μm kufika pa 25 μm.
SiC: Imakwaniritsa <2 μm TTV pa ntchito za RF.
Ma Wafer Opangidwa ndi Doped: Ma wafer a InP okhala ndi Phosphorus okhala ndi resistivity drift <5%.

4. Smart Automation: Kuphatikiza kwa MES kumachepetsa zolakwika za anthu ndi 70%.

5. Kugwiritsa Ntchito Mphamvu Moyenera: Kugwiritsa ntchito mphamvu kocheperako ndi 30% kudzera mu regenerative braking.

Mapulogalamu Ofunika

1. Kupaka Kwapamwamba
• Ma IC a 3D: Kuchepetsa ma wafer kumathandiza kuyika ma logic/memory chips molunjika (monga ma HBM stacks), kukwaniritsa bandwidth yapamwamba ya 10× komanso kuchepetsa mphamvu zomwe zimagwiritsidwa ntchito ndi 50% poyerekeza ndi mayankho a 2.5D. Zipangizozi zimathandiza hybrid bonding ndi TSV (Through-Silicon Via) integration, yofunika kwambiri kwa ma processor a AI/ML omwe amafunikira <10 μm interconnect pitch. Mwachitsanzo, ma wafer a mainchesi 12 ochepetsedwa kufika pa 25 μm amalola kuyika ma layers 8+ pamene akusunga <1.5% warpage, yofunika kwambiri pamakina a LiDAR a magalimoto.

• Kupaka Fan-Out: Mwa kuchepetsa makulidwe a wafer kufika pa 30 μm, kutalika kwa kulumikizana kumafupikitsidwa ndi 50%, kuchepetsa kuchedwa kwa chizindikiro (<0.2 ps/mm) ndikulola ma chiplets a 0.4 mm opyapyala kwambiri a SoCs zam'manja. Njirayi imagwiritsa ntchito ma algorithms opukutira omwe amalipidwa ndi kupsinjika kuti apewe kupotoza (>50 μm TTV control), ndikuwonetsetsa kuti kudalirika kwa ma RF applications kumawonjezeka.

2. Zamagetsi Zamagetsi
• Ma Module a IGBT: Kuchepetsa kutentha kufika pa 50 μm kumachepetsa kukana kutentha kufika pa <0.5°C/W, zomwe zimathandiza kuti ma MOSFET a 1200V SiC agwire ntchito pa kutentha kwa 200°C. Zipangizo zathu zimagwiritsa ntchito kupukusa kwa magawo ambiri (kopyapyala: 46 μm grit → fine: 4 μm grit) kuti athetse kuwonongeka kwa pansi pa nthaka, zomwe zimapangitsa kuti pakhale kudalirika kwa kutentha kwa ma cycle opitilira 10,000. Izi ndizofunikira kwambiri kwa ma EV inverters, pomwe ma wafer a SiC okhuthala 10 μm amawongolera liwiro la kusintha ndi 30%.
• Zipangizo Zamagetsi za GaN-on-SiC: Kuchepetsa kwa wafer kufika pa 80 μm kumawonjezera kuyenda kwa ma elekitironi (μ > 2000 cm²/V·s) kwa ma 650V GaN HEMTs, kuchepetsa kutayika kwa conduction ndi 18%. Njirayi imagwiritsa ntchito laser-assisted dicing kuti ipewe kusweka panthawi yochepetsa, zomwe zimapangitsa kuti <5 μm edge chipping ya ma amplifiers amphamvu a RF igwire ntchito.

3. Zipangizo zamagetsi
• Ma LED a GaN-on-SiC: Ma substrates a safiro a 50 μm amathandiza kuti kuwala kutuluke bwino (LEE) kufika pa 85% (motsutsana ndi 65% ya ma wafer a 150 μm) pochepetsa kutsekeka kwa photon. Kulamulira kwa TTV kochepa kwambiri kwa zida zathu (<0.3 μm) kumatsimikizira kuti LED imatuluka mofanana pa ma wafer a mainchesi 12, zomwe ndizofunikira kwambiri pa mawonetsero a Micro-LED omwe amafuna kufanana kwa ma wavelength a <100nm.
• Silicon Photonics: Ma wafer a silicon okhuthala 25μm amalola kutayika kwa kufalikira kwa 3 dB/cm mu ma waveguides, ofunikira kwambiri pa ma transceivers optical a 1.6 Tbps. Njirayi imagwirizanitsa CMP smoothing kuti ichepetse kukhwima kwa pamwamba pa Ra <0.1 nm, ndikuwonjezera mphamvu yolumikizira ndi 40%.

4. Masensa a MEMS
• Accelerometers: Ma wafer a silicon a 25 μm amafika pa SNR >85 dB (mosiyana ndi 75 dB ya ma wafer a 50 μm) powonjezera mphamvu yothamangitsidwa ndi mphamvu. Dongosolo lathu logaya la dual-axis limathandizira kusinthasintha kwa mphamvu, kuonetsetsa kuti mphamvu yothamangitsidwa ndi <0.5% imadutsa pamwamba pa -40°C mpaka 125°C. Mapulogalamuwa akuphatikizapo kuzindikira ngozi zamagalimoto ndi kutsatira kayendedwe ka AR/VR.

• Masensa Olimbitsa Thupi: Kuchepetsa mpaka 40 μm kumathandiza kuti muyese mipiringidzo ya 0–300 bar ndi <0.1% FS hysteresis. Pogwiritsa ntchito bonding ya kanthawi kochepa (zonyamula magalasi), njirayi imapewa kusweka kwa wafer panthawi yocheka kumbuyo, zomwe zimapangitsa kuti masensa a IoT a mafakitale azitha kupirira kupsinjika kwambiri kwa <1 μm.

• Kugwirizana kwaukadaulo: Zipangizo zathu zochepetsera ma wafer zimagwirizanitsa kupukusa kwa makina, CMP, ndi plasma kuti zithetse mavuto osiyanasiyana azinthu (Si, SiC, Sapphire). Mwachitsanzo, GaN-on-SiC imafuna kupukusa kosakanikirana (mawilo a diamondi + plasma) kuti igwirizane ndi kuuma ndi kukula kwa kutentha, pomwe masensa a MEMS amafuna kukhwima kwa pamwamba pa sub-5 nm kudzera mu kupukuta kwa CMP.

• Zotsatira za Makampani: Mwa kuyambitsa ma wafers owonda komanso ogwira ntchito bwino, ukadaulo uwu umayendetsa zatsopano mu ma chips a AI, ma module a 5G mmWave, ndi zamagetsi osinthasintha, okhala ndi ma TTV tolerances <0.1 μm pazowonetsera zopindika ndi <0.5 μm zama sensor a LiDAR zamagalimoto.

Ntchito za XKH

1. Mayankho Opangidwa Mwamakonda
Makonzedwe Osasinthika: Mapangidwe a chipinda cha mainchesi 4–12 okhala ndi kukweza/kutsitsa zokha.
Chithandizo cha Doping: Maphikidwe apadera a makristalo opangidwa ndi Er/Yb ndi ma wafer a InP/GaAs.

2. Thandizo Lochokera Kumapeto
Kupanga Njira: Kuyesa kwaulere kumachitika bwino kwambiri.
Maphunziro Padziko Lonse: Misonkhano yaukadaulo pachaka yokhudza kukonza ndi kuthetsa mavuto.

3. Kukonza Zinthu Zambiri
SiC: Kuchepa kwa Wafer kufika pa 100 μm ndi Ra <0.1 nm.
Safira: makulidwe a 50μm a mawindo a UV laser (transmittance >92%@200 nm).

4. Ntchito Zowonjezera Mtengo
Zogwiritsidwa Ntchito: Mawilo a diamondi (ma wafer opitilira 2000/moyo wonse) ndi ma CMP slurry.

Mapeto

Zipangizo zochepetsera ma wafer izi zimapereka kulondola kwambiri kwa mafakitale, kugwiritsa ntchito zinthu zosiyanasiyana, komanso kudzipangira zinthu mwanzeru, zomwe zimapangitsa kuti zikhale zofunikira kwambiri pakuphatikiza kwa 3D ndi zamagetsi zamagetsi. Ntchito zambiri za XKH—kuyambira kusintha mpaka kukonza pambuyo pake—zimaonetsetsa kuti makasitomala akupeza bwino ndalama komanso magwiridwe antchito popanga zinthu za semiconductor.