Wafer wa Silicon Wokutidwa ndi Chitsulo wa Ti/Cu (Titanium/Copper)

Kufotokozera Kwachidule:

ZathuMa wafer a silikoni okhala ndi zokutidwa ndi chitsulo a Ti/CuIli ndi silicon yapamwamba kwambiri (kapena galasi/quartz yosankha) yokutidwa ndiwosanjikiza wa titaniyamundiwosanjikiza wa mkuwakugwiritsa ntchitokupopera kwa magnetron kokhazikika. Chigawo cha Ti chimathandiza kwambiri kumamatira ndi kukhazikika kwa njira, pomwe gawo la pamwamba la Cu limapereka malo osagwirizana komanso oyenera kugwiritsidwa ntchito pamagetsi komanso kupanga zinthu zazing'ono pansi pa madzi.


Mawonekedwe

Chidule

ZathuMa wafer a silikoni okhala ndi zokutidwa ndi chitsulo a Ti/CuIli ndi silicon yapamwamba kwambiri (kapena galasi/quartz yosankha) yokutidwa ndiwosanjikiza wa titaniyamundiwosanjikiza wa mkuwakugwiritsa ntchitokupopera kwa magnetron kokhazikika. Chigawo cha Ti chimathandiza kwambiri kumamatira ndi kukhazikika kwa njira, pomwe gawo la pamwamba la Cu limapereka malo osagwirizana komanso oyenera kugwiritsidwa ntchito pamagetsi komanso kupanga zinthu zazing'ono pansi pa madzi.

Ma wafer awa amapangidwira kafukufuku komanso ntchito zoyeserera, amapezeka m'makulidwe osiyanasiyana komanso m'malo osiyanasiyana otetezera, ndipo amatha kusinthidwa malinga ndi makulidwe, mtundu wa substrate, komanso mawonekedwe a chophimba.

Zinthu Zofunika Kwambiri

  • Kumamatira mwamphamvu ndi kudalirika: Ti bonding layer imathandizira kutsata kwa filimu ku Si/SiO₂ ndikuwonjezera kulimba kwa magwiridwe antchito

  • Pamwamba pa conductivity yapamwamba: Kuphimba kwa Cu kumapereka magwiridwe antchito abwino kwambiri amagetsi pamakina olumikizirana ndi zida zoyesera

  • Mitundu yosiyanasiyana yosinthira: kukula kwa wafer, resistivity, location, substrate makulidwe, ndi film makulidwe zilipo ngati mukufuna

  • Ma substrates okonzeka kukonzedwa: imagwirizana ndi njira zodziwika bwino zoyezera ndi ntchito zokongoletsa (lithography, electroplating build-up, metrology, ndi zina zotero)

  • Mndandanda wazinthu zomwe zilipoKupatula Ti/Cu, timaperekanso ma wafers okhala ndi zokutira zitsulo a Au, Pt, Al, Ni, Ag.

Kapangidwe ndi Kuyika Kwachizolowezi

  • Dulani: Gawo lapansi + Ti guluu wosanjikiza + Cu wokutira wosanjikiza

  • Njira yokhazikika: Kutulutsa kwa Magnetron

  • Njira zosankha: Kutentha kwa kutentha / Kupaka Electroplating (pazofunikira za Cu yokhuthala)

Kapangidwe ka Makina a Galasi la Quartz

Chinthu Zosankha
Kukula kwa chidebe 2", 4", 6", 8"; 10 × 10 mm; kukula kodula mwamakonda
Mtundu wa ma conductivity Mtundu wa P / Mtundu wa N / Kulimba kwamphamvu kwamkati (Un)
Kuyang'ana <100>, <111>, ndi zina zotero.
Kusakhazikika <0.0015 Ω·cm; 1-10 Ω·cm; >1000–10000 Ω·cm
Kukhuthala (µm) 2": 200/280/400/500; 4": 450/500/525; 6": 625/650/675; 8": 650/700/725/775; mwamakonda
Zipangizo zapansi panthaka Silicon; quartz yosankha, galasi la BF33, ndi zina zotero.
Kukhuthala kwa filimu 10 nm / 50 nm / 100 nm / 150 nm / 300 nm / 500 nm / 1 µm (yosinthika)
Zosankha za filimu yachitsulo Ti/Cu; komanso Au, Pt, Al, Ni, Ag zilipo

 

Ti/Cu Silicon Wafer Yokutidwa ndi Chitsulo (Titanium/Copper)4

Mapulogalamu

  • Ma substrates olumikizana ndi ohmicpa kafukufuku ndi chitukuko cha chipangizo ndi kuyesa magetsi

  • Zigawo za mbewu zopangira ma electroplating(RDL, kapangidwe ka MEMS, kupangika kwa Cu kokhuthala)

  • Sol-gel ndi zinthu zina zomwe zikukulakafukufuku wa nano ndi thin-film

  • Microscopy & metrology pamwamba(Kukonzekera ndi kuyeza chitsanzo cha SEM/AFM/SPM)

  • Malo a bio/mankhwalamonga nsanja zokulitsa maselo, ma microarray a mapuloteni/DNA, ndi ma substrates a reflectometry

FAQ (Ti/Cu Zophika Zachitsulo Zokutira Silicon)

Q1: N’chifukwa chiyani Ti wosanjikiza imagwiritsidwa ntchito pansi pa Cu?
A: Titanium imagwira ntchito ngatigulu lomamatira (lomangirira), kukonza kulumikizidwa kwa mkuwa ku substrate ndikuwonjezera kukhazikika kwa mawonekedwe, zomwe zimathandiza kuchepetsa kusweka kapena kusweka kwa chitsulo panthawi yogwira ntchito ndi kukonza.

Q2: Kodi kasinthidwe ka makulidwe a Ti/Cu kamakhala kotani?
A: Kuphatikiza kofala kumaphatikizapoTi: makumi a nm (mwachitsanzo, 10–50 nm)ndiCu: 50–300 nmkwa mafilimu otulutsa madontho. Zigawo zokhuthala za Cu (µm-level) nthawi zambiri zimapezeka ndikuyika ma electroplating pa gawo la mbewu ya Cu yothira madzi, kutengera ndi ntchito yanu.

Q3: Kodi mungathe kupaka mbali zonse ziwiri za wafer?
A: Inde.Chophimba cha mbali imodzi kapena ziwiriimapezeka ngati mupempha. Chonde tchulani zomwe mukufuna mukamayitanitsa.

Zambiri zaife

XKH imagwira ntchito kwambiri pakupanga, kupanga, ndi kugulitsa magalasi apadera a kuwala ndi zinthu zatsopano zamakristalo. Zogulitsa zathu zimapereka zinthu zamagetsi, zamagetsi, ndi zankhondo. Timapereka zinthu za Sapphire optical, zophimba ma lens a foni yam'manja, Ceramics, LT, Silicon Carbide SIC, Quartz, ndi ma crystal wafers a semiconductor. Ndi ukatswiri waluso komanso zida zamakono, timachita bwino kwambiri pokonza zinthu zosakhazikika, cholinga chathu ndi kukhala kampani yotsogola kwambiri yaukadaulo wamagetsi.

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