Silicon carbide diamondi waya kudula makina 4/6/8/12 inchi SiC ingot processing

Silicon carbide diamondi kudula waya makina 4/6/8/12 inchi SiC ingot processing

Kufotokozera Kwachidule:

Silicon carbide Diamond Wire kudula makina ndi mtundu wa zida mkulu-mwatsatanetsatane processing operekedwa kwa pakachitsulo carbide (SiC) kagawo ingot, ntchito Diamond Waya Saw luso, kudzera mkulu-liwiro kusuntha diamondi waya (mzere m'mimba mwake 0.1 ~ 0.3mm) kwa SiC ingot Mipikisano kudula mawaya, kukwaniritsa mkulu-mwatsatanetsatane, otsika kuwonongeka yopyapyala kukonzekera. Zipangizozi zimagwiritsidwa ntchito kwambiri mu SiC power semiconductor (MOSFET/SBD), radio frequency device (GaN-on-SiC) ndi optoelectronic device substrate processing, ndi zida zofunika kwambiri pamakampani a SiC.

Titumizireni imelo

Tsatanetsatane wa Zamalonda

Zogulitsa Tags

Ntchito mfundo:

1. Kukonzekera kwa Ingot: SiC ingot (4H / 6H-SiC) imayikidwa pa nsanja yodula kudzera muzitsulo kuti zitsimikizire kuti malowa ali olondola (± 0.02mm).

2. Kuyenda kwa mzere wa diamondi: mzere wa diamondi (tinthu tating'ono ta diamondi ta electroplated pamtunda) umayendetsedwa ndi kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe kake.

3. Kudula chakudya: ingot imadyetsedwa motsatira njira yokhazikitsidwa, ndipo mzere wa diamondi umadulidwa nthawi imodzi ndi mizere yambiri yofanana (mizere 100 ~ 500) kuti apange mapepala ambiri.

4. Kuziziritsa ndi kuchotsa tchipisi: Utsireni zoziziritsa kukhosi (madzi a deionized + zowonjezera) m’malo odulidwa kuti muchepetse kutentha ndi kuchotsa tchipisi.

Zofunikira zazikulu:

1. Kudula liwiro: 0.2 ~ 1.0mm / min (malingana ndi kristalo malangizo ndi makulidwe a SiC).

2. Kuvuta kwa mzere: 20 ~ 50N (kwapamwamba kwambiri kosavuta kuthyola mzere, kutsika kwambiri kumakhudza kudulidwa molondola).

3.Wafer makulidwe: muyezo 350 ~ 500μm, mtanda akhoza kufika 100μm.

Zofunikira zazikulu:

(1) Kudula molondola
Kulolera makulidwe: ± 5μm (@350μm wafer), kuposa kudula matope wamba (± 20μm).

Pamwamba roughness: Ra<0.5μm (palibe akupera zina zofunika kuchepetsa kuchuluka kwa processing wotsatira).

Warpage: <10μm (kuchepetsa zovuta za kupukuta kotsatira).

(2) Kukonzekera bwino
Mipikisano mizere kudula: kudula 100 ~ 500 zidutswa pa nthawi, kuwonjezera mphamvu kupanga 3 ~ 5 nthawi (vs. Single mzere kudula).

Moyo wa mzere: Mzere wa diamondi ukhoza kudula 100 ~ 300km SiC (malingana ndi kuuma kwa ingot ndi kukhathamiritsa kwa ndondomeko).

(3) Low kuwonongeka processing
Kusweka kwa m'mphepete: <15μm (kudula kwachikhalidwe> 50μm), sinthani zokolola za mkate.

Zosanjikiza zowonongeka zapansi panthaka: <5μm (chepetsani kuchotsa kupukuta).

(4) Kuteteza chilengedwe ndi chuma
Palibe kuwononga matope: Kuchepetsa mtengo wotaya zinyalala poyerekeza ndi kudula matope.

Kugwiritsa ntchito zinthu: Kudula kutaya <100μm / chodula, kupulumutsa SiC zopangira.

Kuchepetsa zotsatira:

1. Wafer khalidwe: palibe ming'alu yaikulu pamwamba, zochepa zazing'ono zolakwika (controllable dislocation extension). Angathe mwachindunji kulowa akhakula kupukuta ulalo, kufupikitsa ndondomeko otaya.

2. Kusasinthika: kupatuka kwa makulidwe a mtanda mu mtanda ndi <± 3%, koyenera kupanga zokha.

3.Kugwiritsidwa ntchito: Kuthandizira 4H / 6H-SiC ingot kudula, kumagwirizana ndi mtundu wa conductive / semi-insulated.

Mafotokozedwe aukadaulo:

Kufotokozera	Tsatanetsatane
Makulidwe (L × W × H)	2500x2300x2500 kapena makonda
Processing zinthu kukula osiyanasiyana	4, 6, 8, 10, 12 mainchesi a silicon carbide
Pamwamba roughness	Ra≤0.3u
Avereji yodula liwiro	0.3mm/mphindi
Kulemera	5.5t
Kudula ndondomeko kukhazikitsa masitepe	≤30 masitepe
Zida phokoso	≤80 dB
Kuvuta kwa waya wachitsulo	0~110N(0.25 waya wovuta ndi 45N)
Kuthamanga kwa waya wachitsulo	0 ~ 30m/S
Mphamvu zonse	50kw pa
Diamondi waya awiri	≥0.18mm
Kuthetsa flatness	≤0.05mm
Kudula ndi kuswa mtengo	≤1% (kupatula pazifukwa zaumunthu, zinthu za silicon, mzere, kukonza ndi zifukwa zina)

Ntchito za XKH:

XKH amapereka ntchito lonse ndondomeko ya pakachitsulo carbide diamondi waya kudula makina, kuphatikizapo zida kusankha (waya m'mimba mwake / waya liwiro lofananira), ndondomeko chitukuko (kudula chizindikiro kukhathamiritsa), consumables kotunga (diamondi waya, gudumu lowongolera) ndi pambuyo-zogulitsa thandizo (zokonza zida, kudula khalidwe kusanthula), kuthandiza makasitomala kukwaniritsa zokolola zambiri (> 95%), mtengo wotsika mtengo SiC yopyapyala kupanga misa. Imaperekanso zosintha makonda (monga kudula kocheperako, kutsitsa ndi kutsitsa) ndi nthawi yotsogolera ya 4-8 sabata.