Zida za Semiconductor Laser Lift-Off Equipment

Semiconductor Laser Lift-Off Equipment Chithunzi Chowonetsedwa

Kufotokozera Kwachidule:

Semiconductor Laser Lift-Off Equipment imayimira njira ya m'badwo wotsatira pakupatulira kwa ingot mu semiconductor material processing. Mosiyana ndi njira zamawotchi zomwe zimadalira mawotchi akupera, machedwe a waya wa diamondi, kapena kupanga makina opangira mankhwala, nsanjayi yochokera ku laser imapereka njira ina yopanda kukhudzana, yosawononga yochotsa zigawo zowonda kwambiri kuchokera ku ingots zambiri za semiconductor.

Zokongoletsedwa ndi zida zowoneka bwino komanso zamtengo wapatali monga gallium nitride (GaN), silicon carbide (SiC), safiro, ndi gallium arsenide (GaAs), Semiconductor Laser Lift-Off Equipment imathandizira kudula bwino kwamakanema ophatikizika molunjika kuchokera ku ingot ya kristalo. Ukadaulo wotsogolawu umachepetsa kwambiri zinyalala zakuthupi, umathandizira kutulutsa, ndikuwonjezera kukhulupirika kwa gawo lapansi - zonse zomwe ndizofunikira kwambiri pazida zam'badwo wotsatira mumagetsi amagetsi, machitidwe a RF, mafotonics, ndi mawonedwe ang'onoang'ono.

Titumizireni imelo

Mawonekedwe

Chithunzi chatsatanetsatane

Chidule cha Zogulitsa za Laser Lift-Off Equipment

Ndi kutsindika pa kuwongolera makina, mawonekedwe a matabwa, ndi kusanthula kwa laser-material interaction analytics, Semiconductor Laser Lift-Off Equipment idapangidwa kuti iziphatikizidwe mosasunthika mumayendedwe opangira ma semiconductor pothandizira kusinthasintha kwa R&D komanso kuchulukitsitsa kwapang'onopang'ono.

Tekinoloje & Mfundo Yogwiritsira Ntchito Laser Lift-Off Equipment

Njira yopangidwa ndi Semiconductor Laser Lift-Off Equipment imayamba ndikuyatsa ingot wopereka kuchokera kumbali imodzi pogwiritsa ntchito kuwala kwamphamvu kwa ultraviolet laser. Dongosololi limayang'ana kwambiri kuya kwamkati kwina, nthawi zambiri pamawonekedwe opangidwa mwaluso, pomwe mayamwidwe amagetsi amachulukitsidwa chifukwa cha kusiyanasiyana kwa kuwala, kutentha, kapena mankhwala.

Pakutentha kwamphamvu kumeneku, kutentha komweko kumabweretsa kuphulika kwapang'onopang'ono, kufutukuka kwa gasi, kapena kuwonongeka kwa gawo lapakati (mwachitsanzo, filimu yopanikizika kapena oksidi wansembe). Kusokonezeka koyendetsedwa bwino kumeneku kumapangitsa kuti kristalo wapamwamba - wokhala ndi makulidwe a ma micrometer makumi - kuti achoke pa ingot yoyambira bwino.

Semiconductor Laser Lift-Off Equipment imathandizira mitu yojambulira yosunthika, kuwongolera kwa z-axis, ndi reflectometry yanthawi yeniyeni kuwonetsetsa kuti kugunda kulikonse kumapereka mphamvu ndendende momwe ndege ikufuna. Zipangizozi zitha kupangidwanso ndi njira yophulika kapena ma pulse angapo kuti zithandizire kusalala kwachitetezo ndikuchepetsa kupsinjika kotsalira. Chofunika kwambiri, chifukwa mtengo wa laser sulumikizana ndi zinthuzo mwakuthupi, chiwopsezo chokhala ndi microcracking, kuwerama, kapena kudumpha pamwamba chimachepetsedwa kwambiri.

Izi zimapangitsa njira yochepetsera ya laser kukhala yosinthira masewera, makamaka pamapulogalamu omwe ma wafer owonda kwambiri, owonda kwambiri amafunikira ndi sub-micron TTV (Total Thickness Variation).

Parameter ya Semiconductor Laser Lift-Off Equipment

Wavelength	IR/SHG/THG/FHG
Pulse Width	Nanosecond, Picosecond, Femtosecond
Optical System	Makina owoneka bwino kapena Galvano-optical system
Gawo la XY	500 mm × 500 mm
Processing Range	160 mm
Kuthamanga Kwambiri	Kusapitirira 1,000 mm/mphindi
Kubwerezabwereza	± 1 μm kapena kuchepera
Kulondola Mtheradi:	± 5 μm kapena kuchepera
Wafer Size	2-6 mainchesi kapena makonda
Kulamulira	Windows 10, 11 ndi PLC
Mphamvu yamagetsi yamagetsi	AC 200 V ± 20 V, gawo limodzi, 50/60 kHz
Miyeso Yakunja	2400 mm (W) × 1700 mm (D) × 2000 mm (H)
Kulemera	1,000 kg

Ntchito Zamakampani a Laser Lift-Off Equipment

Semiconductor Laser Lift-Off Equipment ikusintha mwachangu momwe zida zimakonzedwera m'magawo angapo a semiconductor:

Zida Zamagetsi za GaN Zoyimilira za Laser Lift-Off Equipment

Kukwezedwa kwamakanema owonda kwambiri a GaN-on-GaN kuchokera m'zingwe zochulukira kumathandizira zomanga zowoneka bwino ndikugwiritsanso ntchito magawo okwera mtengo.

SiC Wafer Thinning ya Schottky ndi MOSFET Devices

Imachepetsa makulidwe a chipangizo ndikusunga mapulaneti a gawo lapansi - yabwino pamagetsi osinthika mwachangu.

Zida Zopangira Ma LED ndi Zowonetsera za Sapphire za Laser Lift-Off Equipment

Imathandiza kulekanitsa bwino kwa zigawo kuchokera ku miyala ya safiro kuti zithandizire kupanga zoonda, zokongoletsedwa ndi ma LED ang'onoang'ono.

III-V Material Engineering ya Laser Lift-Off Equipment

Imathandizira kusungidwa kwa magawo a GaAs, InP, ndi AlGaN kuti agwirizane ndi optoelectronic.

Thin-Wafer IC ndi Sensor Fabrication

Amapanga zigawo zoonda zogwirira ntchito za masensa othamanga, ma accelerometers, kapena ma photodiode, pomwe zambiri zimakhala zolepheretsa kugwira ntchito.

Flexible ndi Transparent Electronics

Imakonza magawo owonda kwambiri oyenera mawonedwe osinthika, mabwalo ovala, ndi mawindo anzeru owonekera.

M'madera onsewa, Semiconductor Laser Lift-Off Equipment imakhala ndi gawo lofunikira pakupangitsa kuti miniaturization, kugwiritsanso ntchito zinthu, ndi kuphweka.

Mafunso Ofunsidwa Kawirikawiri (FAQ) a Laser Lift-Off Equipment

Q1: Ndi makulidwe otani omwe ndingakwaniritse pogwiritsa ntchito Semiconductor Laser Lift-Off Equipment?
A1:Nthawi zambiri pakati pa 10-30 ma microns kutengera zakuthupi. Njirayi imatha kukhala ndi zotsatira zocheperako ndi makonzedwe osinthidwa.

Q2: Kodi izi zitha kugwiritsidwa ntchito kudula mawotchi angapo kuchokera pa ingot imodzi?
A2:Inde. Makasitomala ambiri amagwiritsa ntchito njira yokweza laser kuti atulutse zigawo zingapo zoonda kuchokera ku ingot imodzi yochuluka.

Q3: Ndi zinthu ziti zachitetezo zomwe zimaphatikizidwa pakugwiritsa ntchito laser yamphamvu kwambiri?
A3:Malo otsekera a Class 1, interlock system, kutchingira mitengo, ndi zotsekera zokha ndizokhazikika.

Q4: Kodi dongosololi likufananiza bwanji ndi macheka a diamondi pamtengo wake?
A4:Ngakhale kuti capex yoyamba ingakhale yokwera, kukweza laser kumachepetsa kwambiri mtengo wogula, kuwonongeka kwa gawo lapansi, ndi masitepe pambuyo pokonza - kutsitsa mtengo waumwini (TCO) kwa nthawi yaitali.

Q5: Kodi ndondomekoyi ndi yotheka ku 6-inch kapena 8-inch ingots?
A5:Mwamtheradi. Pulatifomuyi imathandizira mpaka magawo 12-inch okhala ndi kugawa kwamitengo yofananira komanso magawo akulu akulu.

Zambiri zaife

XKH imagwira ntchito mwaukadaulo wapamwamba kwambiri, kupanga, ndi kugulitsa magalasi apadera owoneka bwino ndi zida zatsopano za kristalo. Zogulitsa zathu zimagwiritsa ntchito zamagetsi zamagetsi, zamagetsi zamagetsi, komanso zankhondo. Timapereka zida zowoneka bwino za Sapphire, zovundikira ma lens amafoni, Ceramics, LT, Silicon Carbide SIC, Quartz, ndi zowotcha za semiconductor crystal. Ndi ukadaulo waluso komanso zida zotsogola, timachita bwino kwambiri pakukonza zinthu zomwe sizili muyeso, tikufuna kukhala bizinesi yotsogola yaukadaulo wa optoelectronic.