Zipangizo Zonyamulira Laser Zochotsa Semiconductor

Chida Chokweza Laser Chopangidwa ndi Semiconductor Chithunzi Chodziwika

Kufotokozera Kwachidule:

Zipangizo Zolimbitsira Ma Laser za Semiconductor zikuyimira njira yatsopano yothetsera vuto la kupukuta kwa ingot pakupanga zinthu za semiconductor. Mosiyana ndi njira zachikhalidwe zopukutira ma wafer zomwe zimadalira kupukutira kwa makina, kudula waya wa diamondi, kapena kukonza makina pogwiritsa ntchito mankhwala, nsanja iyi yochokera ku laser imapereka njira ina yopanda kukhudzana, yosawononga yochotsera zigawo zoonda kwambiri kuchokera ku ingots za semiconductor zambiri.

Chokonzedwa bwino kuti chigwiritsidwe ntchito pazinthu zofooka komanso zamtengo wapatali monga gallium nitride (GaN), silicon carbide (SiC), safiro, ndi gallium arsenide (GaAs), Semiconductor Laser Lift-Off Equipment imalola kudula bwino mafilimu a wafer-scale mwachindunji kuchokera ku ingot ya kristalo. Ukadaulo wotsogola uwu umachepetsa kwambiri kutayika kwa zinthu, umawongolera mphamvu yamagetsi, komanso umawonjezera kulimba kwa substrate - zonsezi ndizofunikira kwambiri pazida zam'badwo wotsatira zamagetsi zamagetsi, makina a RF, ma photonics, ndi ma micro-displays.

Tumizani imelo kwa ife

Mawonekedwe

Chithunzi Chatsatanetsatane

Chidule cha Zamalonda za Zipangizo Zonyamulira ndi Laser

Pogogomezera kwambiri pa kulamulira kodziyimira pawokha, kupanga mawonekedwe a beam, ndi kusanthula kwa kuyanjana kwa laser-material, Semiconductor Laser Lift-Off Equipment idapangidwa kuti igwirizane bwino ndi ntchito zopangira semiconductor pomwe ikuchirikiza kusinthasintha kwa R&D ndi kukula kwa kupanga zinthu zambiri.

Ukadaulo ndi Mfundo Yogwiritsira Ntchito Zipangizo Zonyamulira ndi Laser

Njira yochitidwa ndi Semiconductor Laser Lift-Off Equipment imayamba mwa kuyatsa ingot ya donor kuchokera mbali imodzi pogwiritsa ntchito kuwala kwa laser ya ultraviolet yamphamvu kwambiri. Kuwala kumeneku kumayang'ana kwambiri kuzama kwamkati, nthawi zambiri motsatira mawonekedwe opangidwa ndiukadaulo, komwe kuyamwa kwa mphamvu kumakulitsidwa chifukwa cha kusiyana kwa kuwala, kutentha, kapena mankhwala.

Pa gawo loyamwa mphamvu ili, kutentha komwe kumachitika pamalopo kumabweretsa kuphulika kwachangu kwa micro-explosion, kufalikira kwa mpweya, kapena kuwonongeka kwa gawo lolumikizana (monga filimu yovutitsa kapena okosijeni wotsanulidwa). Kusokonezeka kumeneku komwe kumayendetsedwa bwino kumapangitsa kuti gawo lapamwamba la kristalo - lokhala ndi makulidwe a ma micrometer makumi - lichoke bwino kuchokera ku ingot yoyambira.

Chipangizo cha Semiconductor Laser Lift-Off chimagwiritsa ntchito mitu yojambulira yogwirizana ndi kuyenda, kulamulira kwa z-axis komwe kungakonzedwe, ndi reflecometry yeniyeni kuti zitsimikizire kuti kugunda kulikonse kumapereka mphamvu pamalo omwe akufuna. Zipangizozi zitha kukonzedwanso ndi mphamvu ya burst-mode kapena multi-pulse kuti ziwonjezere kusalala kwa detachment ndikuchepetsa kupsinjika kotsalira. Chofunika kwambiri, chifukwa kuwala kwa laser sikukhudza chinthucho mwakuthupi, chiopsezo cha microcracking, weraming, kapena surface chips chimachepa kwambiri.

Izi zimapangitsa kuti njira yochepetsera kuchotsedwa kwa laser ikhale yosintha kwambiri, makamaka m'malo omwe ma wafers opyapyala kwambiri komanso owonda kwambiri amafunika ndi sub-micron TTV (Total Thickness Variation).

Chigawo cha Zida Zokweza Laser za Semiconductor

Kutalika kwa mafunde	IR/SHG/THG/FHG
Kukula kwa Kugunda	Nanosecond, Picosecond, Femtosecond
Dongosolo Lowala	Dongosolo lokhazikika la kuwala kapena dongosolo la Galvano-optical
Gawo la XY	500 mm × 500 mm
Kukonza Mitundu	160 mm
Liwiro la Kuyenda	Mphamvu yoposa 1,000 mm/sekondi
Kubwerezabwereza	± 1 μm kapena kuchepera
Kulondola Kwathunthu kwa Malo:	± 5 μm kapena kuchepera
Kukula kwa Wafer	2–6 mainchesi kapena makonda
Kulamulira	Mawindo 10, 11 ndi PLC
Mphamvu Yopereka Mphamvu	AC 200 V ±20 V, Gawo limodzi, 50/60 kHz
Miyeso Yakunja	2400 mm (W) × 1700 mm (D) × 2000 mm (H)
Kulemera	makilogalamu 1,000

Kugwiritsa Ntchito Zipangizo Zochotsa Laser mu Mafakitale

Zipangizo Zokweza Ma Laser za Semiconductor zikusinthira mwachangu momwe zipangizo zimakonzedwera m'magawo osiyanasiyana a semiconductor:

Zipangizo Zamagetsi Zoyimirira za GaN za Zipangizo Zokweza ndi Laser

Kuchotsa mafilimu a GaN-on-GaN owonda kwambiri kuchokera ku ma ingot akuluakulu kumathandiza kuti mapangidwe a conduction awonekere bwino komanso kugwiritsanso ntchito ma substrates okwera mtengo.

Kuchepetsa SiC Wafer kwa Zipangizo za Schottky ndi MOSFET

Amachepetsa makulidwe a chipangizocho pamene akusunga kulinganika kwa substrate — yabwino kwambiri pamagetsi amphamvu osinthasintha mwachangu.

Zipangizo Zowonetsera za LED ndi Sapphire Zochokera ku Zida Zokweza ndi Laser

Zimathandiza kulekanitsa bwino zigawo za chipangizocho ndi ma boules a safiro kuti zithandizire kupanga ma micro-LED ochepa komanso okonzedwa bwino ndi kutentha.

Ukadaulo wa Zinthu wa III-V wa Zida Zonyamulira Laser

Zimathandizira kugawa kwa zigawo za GaAs, InP, ndi AlGaN kuti pakhale kuphatikiza kwapamwamba kwa optoelectronic.

Kupangidwa kwa Thin-Wafer IC ndi Sensor

Amapanga zigawo zopyapyala zogwirira ntchito za masensa opanikizika, ma accelerometer, kapena ma photodiode, komwe kuchuluka kwake kumakhala choletsa magwiridwe antchito.

Zamagetsi Zosinthasintha komanso Zowonekera

Amakonza zinthu zopyapyala kwambiri zoyenera zowonetsera zosinthasintha, ma circuits ovalidwa, komanso mawindo anzeru owonekera bwino.

Mu gawo lililonse mwa magawo awa, Semiconductor Laser Lift-Off Equipment imagwira ntchito yofunika kwambiri pothandiza kuti zinthu zisamagwiritsidwenso ntchito, komanso kuti zinthu zisamawonongeke.

Mafunso Ofunsidwa Kawirikawiri (FAQ) a Zipangizo Zokweza ndi Laser

Q1: Kodi makulidwe ochepa omwe ndingapeze pogwiritsa ntchito Semiconductor Laser Lift-Off Equipment ndi otani?
A1:Kawirikawiri imakhala pakati pa ma microns 10–30 kutengera ndi zinthu zomwe zili mkati mwake. Njirayi imatha kuchepetsa zotsatira zake pogwiritsa ntchito zosintha.

Q2: Kodi izi zingagwiritsidwe ntchito kudula ma wafer angapo kuchokera ku ingot imodzi?
A2:Inde. Makasitomala ambiri amagwiritsa ntchito njira yochotsera laser kuti achotse zigawo zingapo zoonda kuchokera ku ingot imodzi yokulirapo.

Q3: Ndi zinthu ziti zachitetezo zomwe zikuphatikizidwa pakugwiritsa ntchito laser yamphamvu kwambiri?
A3:Ma enclosure a Class 1, ma interlock system, ma beam shielding, ndi automatic shutoffs zonse ndi zachizolowezi.

Q4: Kodi dongosololi likufanana bwanji ndi macheka a waya wa diamondi pankhani ya mtengo?
A4:Ngakhale kuti capex yoyamba ikhoza kukhala yokwera, kuchotsedwa kwa laser kumachepetsa kwambiri ndalama zomwe zingagwiritsidwe ntchito, kuwonongeka kwa substrate, ndi njira zogwirira ntchito pambuyo pokonza - kuchepetsa mtengo wonse wa umwini (TCO) kwa nthawi yayitali.

Q5: Kodi njirayi ingakulitsidwe mpaka mainchesi 6 kapena mainchesi 8?
A5:Inde. Nsanjayi imathandizira mpaka ma substrates a mainchesi 12 okhala ndi kufalikira kwa matabwa ofanana komanso magawo oyenda akuluakulu.

Zambiri zaife

XKH imagwira ntchito kwambiri pakupanga, kupanga, ndi kugulitsa magalasi apadera a kuwala ndi zinthu zatsopano zamakristalo. Zogulitsa zathu zimapereka zinthu zamagetsi, zamagetsi, ndi zankhondo. Timapereka zinthu za Sapphire optical, zophimba ma lens a foni yam'manja, Ceramics, LT, Silicon Carbide SIC, Quartz, ndi ma crystal wafers a semiconductor. Ndi ukatswiri waluso komanso zida zamakono, timachita bwino kwambiri pokonza zinthu zosakhazikika, cholinga chathu ndi kukhala kampani yotsogola kwambiri yaukadaulo wamagetsi.