N-Type SiC pa Si Composite Substrates Dia6inch
等级Gulu | U 级 | P级 | D级 |
Low BPD Grade | Kalasi Yopanga | Dummy Grade | |
直径Diameter | 150.0 mm± 0.25mm | ||
厚度Makulidwe | 500 μm ± 25μm | ||
晶片方向Wafer Orientation | Kutalikirana: 4.0 ° kulowera <11-20 > ± 0.5 ° kwa 4H-N Pa axis: <0001> ± 0.5 ° kwa 4H-SI | ||
主定位边方向Nyumba Yoyambira | {10-10}±5.0° | ||
主定位边长度Utali Woyambira Wathyathyathya | 47.5 mm ± 2.5 mm | ||
边缘Kupatula m'mphepete | 3 mm | ||
总厚度变化/弯曲度/翘曲度 TTV/Uta/Warp | ≤15μm /≤40μm /≤60μm | ||
微管密度和基面位错MPD & BPD | MPD≤1 cm-2 | MPD≤5 cm-2 | MPD≤15 cm-2 |
BPD≤1000cm-2 | |||
电阻率Kukaniza | ≥1E5 Ω·cm | ||
表面粗糙度Ukali | Chipolishi Ra≤1 nm | ||
CMP Ra≤0.5 nm | |||
裂纹(强光灯观测) # | Palibe | Utali wophatikiza ≤10mm, utali umodzi≤2mm | |
Ming'alu ndi kuwala kwakukulu | |||
六方空洞(强光灯观测)* | Malo owonjezera ≤1% | Malo owonjezera ≤5% | |
Hex Plates ndi kuwala kwambiri | |||
多型(强光灯观测)* | Palibe | Malo owonjezera≤5% | |
Madera a Polytype ndi kuwala kwakukulu | |||
划痕(强光灯观测)*& | 3 zokopa mpaka 1 × wafer awiri | 5 zokopa mpaka 1 × wafer awiri | |
Kukwapula ndi kuwala kwakukulu | kutalika kokwanira | kutalika kokwanira | |
崩边# Chip chapakatikati | Palibe | 5 zololedwa, ≤1 mm iliyonse | |
表面污染物 (强光灯观测) | Palibe | ||
Kuyipitsidwa ndi kuwala kwamphamvu kwambiri |