N-Type SiC pa Si Composite Substrates Dia6inch

Kufotokozera Kwachidule:

N-Type SiC pa Si composite substrates ndi zida za semiconductor zomwe zimakhala ndi n-type silicon carbide (SiC) zoyikidwa pagawo la silicon (Si).


Tsatanetsatane wa Zamalonda

Zogulitsa Tags

等级Gulu

U 级

P级

D级

Low BPD Grade

Kalasi Yopanga

Dummy Grade

直径Diameter

150.0 mm± 0.25mm

厚度Makulidwe

500 μm ± 25μm

晶片方向Wafer Orientation

Kutalikirana: 4.0 ° kulowera <11-20 > ± 0.5 ° kwa 4H-N Pa axis: <0001> ± 0.5 ° kwa 4H-SI

主定位边方向Nyumba Yoyambira

{10-10}±5.0°

主定位边长度Utali Woyambira Wathyathyathya

47.5 mm ± 2.5 mm

边缘Kupatula m'mphepete

3 mm

总厚度变化/弯曲度/翘曲度 TTV/Uta/Warp

≤15μm /≤40μm /≤60μm

微管密度和基面位错MPD & BPD

MPD≤1 cm-2

MPD≤5 cm-2

MPD≤15 cm-2

BPD≤1000cm-2

电阻率Kukaniza

≥1E5 Ω·cm

表面粗糙度Ukali

Chipolishi Ra≤1 nm

CMP Ra≤0.5 nm

裂纹(强光灯观测) #

Palibe

Utali wophatikiza ≤10mm, utali umodzi≤2mm

Ming'alu ndi kuwala kwakukulu

六方空洞(强光灯观测)*

Malo owonjezera ≤1%

Malo owonjezera ≤5%

Hex Plates ndi kuwala kwambiri

多型(强光灯观测)*

Palibe

Malo owonjezera≤5%

Madera a Polytype ndi kuwala kwakukulu

划痕(强光灯观测)*&

3 zokopa mpaka 1 × wafer awiri

5 zokopa mpaka 1 × wafer awiri

Kukwapula ndi kuwala kwakukulu

kutalika kokwanira

kutalika kokwanira

崩边# Chip chapakatikati

Palibe

5 zololedwa, ≤1 mm iliyonse

表面污染物 (强光灯观测)

Palibe

Kuyipitsidwa ndi kuwala kwamphamvu kwambiri

 

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