Makina Ocheka a Daimondi a Multi-Wire a SiC Sapphire Ultra-Hard Brittle Materials
Chiyambi cha Multi-Wire Diamond Sawing Machine
Makina ocheka a diamondi okhala ndi mawaya angapo ndi makina apamwamba kwambiri opangira makina opangira zida zolimba kwambiri komanso zosalimba. Poyika mawaya angapo ofanana okhala ndi diamondi, makinawo amatha kudula mawafa angapo panthawi imodzi, ndikukwaniritsa zonse zotuluka komanso zolondola. Tekinoloje iyi yakhala chida chofunikira m'mafakitale monga ma semiconductors, ma solar photovoltaics, ma LED, ndi zoumba zapamwamba, makamaka pazinthu monga SiC, safiro, GaN, quartz, ndi alumina.
Poyerekeza ndi kudula wamba kwa waya umodzi, kasinthidwe ka waya wambiri kumapereka magawo angapo mpaka mazana pa batch, kuchepetsa kwambiri nthawi yozungulira ndikusunga kusalala bwino (Ra <0.5 μm) ndi kulondola kwenikweni (± 0.02 mm). Mapangidwe ake amaphatikiza ma waya okhazikika, makina ogwirira ntchito, komanso kuyang'anira pa intaneti, kuwonetsetsa kuti nthawi yayitali, yokhazikika komanso yokhazikika.
Magawo aukadaulo a Multi-Wire Diamond Sawing Machine
| Kanthu | Kufotokozera | Kanthu | Kufotokozera |
|---|---|---|---|
| Kukula kwakukulu kwa ntchito (Square) | 220 × 200 × 350 mm | Kuyendetsa galimoto | 17.8 kW × 2 |
| Kuchuluka kwa ntchito (zozungulira) | Φ205 × 350 mm | Wire drive motor | 11.86 kW × 2 |
| Kutalikirana kwa spindle | Φ250 ±10 × 370 × 2 olamulira (mm) | Motere yonyamula katundu | 2.42 kW × 1 |
| Principal axis | 650 mm | Swing motor | 0.8 kW × 1 |
| Kuthamanga kwa waya | 1500m/mphindi | Kupanga motere | 0.45 kW × 2 |
| Waya awiri | Φ0.12–0.25 mm | Mphamvu yamagetsi | 4.15 kW × 2 |
| Kwezani liwiro | 225 mm / mphindi | Motere wopepuka | 7.5 kW × 1 |
| Max. kuzungulira kwa tebulo | ± 12° | Kuchuluka kwa tanki ya slurry | 300 L |
| Swing angle | ±3° | Kuyenda kozizira | 200 L / mphindi |
| Kuthamanga pafupipafupi | ~ 30 nthawi / mphindi | Temp. kulondola | ±2 °C |
| Mtengo wa chakudya | 0.01–9.99 mm/mphindi | Magetsi | 335+210 (mm²) |
| Mtengo wa chakudya cha waya | 0.01-300 mm/mphindi | Mpweya woponderezedwa | 0.4-0.6 MPa |
| Kukula kwa makina | 3550 × 2200 × 3000 mm | Kulemera | 13,500 kg |
Njira Yogwirira Ntchito ya Multi-Wire Diamond Sawing Machine
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Multi-Wire Cutting Motion
Mawaya angapo a diamondi amayenda pa liwiro lolumikizana mpaka 1500 m / min. Mapuleti otsogola molondola komanso kutsekeka kotsekeka (15–130 N) kumapangitsa mawaya kukhala okhazikika, kuchepetsa mwayi wopatuka kapena kusweka. -
Kudyetsa Molondola & Makhalidwe
Kuyika koyendetsedwa ndi Servo kumakwaniritsa kulondola kwa ± 0.005 mm. Kulumikizana kothandizidwa ndi laser kapena masomphenya kumawonjezera zotsatira za mawonekedwe ovuta. -
Kuzizira ndi Kuchotsa Zinyalala
Chozizira chothamanga kwambiri chimachotsa tchipisi ndikuziziritsa malo ogwirira ntchito, kuteteza kuwonongeka kwa kutentha. Kusefera kwa masitepe angapo kumakulitsa moyo wozizirira komanso kumachepetsa nthawi yopuma. -
Smart Control Platform
Madalaivala a servo oyankha kwambiri (<1 ms) amasintha ma feed, kukanika, ndi liwiro la waya. Kasamalidwe ka maphikidwe ophatikizika ndikudina kumodzi kusinthira kuwongolera kupanga kwakukulu.
Ubwino Wamakina a Multi-Wire Diamond Sawing Machine
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Kuchuluka Kwambiri
Kutha kudula mawafa 50-200 pakuthamanga, ndikutayika kwa kerf <100 μm, kupititsa patsogolo kugwiritsa ntchito zinthu mpaka 40%. Kutulutsa ndi 5-10 × komwe kumayendera ma waya amtundu umodzi. -
Precision Control
Kukhazikika kwamphamvu kwa waya mkati mwa ± 0.5 N kumatsimikizira zotsatira zosasinthika pazida zosiyanasiyana. Kuwunika kwenikweni pa mawonekedwe a 10 ″ HMI kumathandizira kusungirako maphikidwe ndi magwiridwe antchito akutali. -
Kusinthika, Modular Build
Yogwirizana ndi waya diameters kuchokera 0.12-0.45 mm kwa njira zosiyanasiyana kudula. Kuwongolera kwa robotic kumalola mizere yopangira zokha. -
Kudalirika kwa Industrial-Grade
Mafelemu olemetsa/opanga amachepetsa kupunduka (<0.01 mm). Zowongolera zokhala ndi zokutira za ceramic kapena carbide zimapereka maola opitilira 8000 a moyo wautumiki.
Minda Yogwiritsa Ntchito Makina Ocheka Amitundu Awiri A diamondi
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Semiconductors: Kudula SiC kwa ma module amphamvu a EV, magawo a GaN a zida za 5G.
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Zithunzi za Photovoltais: Kudula kwa silicon wothamanga kwambiri ndi ± 10 μm kufananiza.
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LED & Optics: Magawo a safiro a epitaxy ndi zinthu zowoneka bwino zokhala ndi <20 μm m'mphepete.
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Zapamwamba Ceramics: Kukonzekera kwa alumina, AlN, ndi zida zofananira zazamlengalenga ndi zida zowongolera matenthedwe.
FAQ - Multi-Wire Diamond Sawing Machine
Q1: Kodi ubwino wocheka mawaya ambiri ndi otani poyerekeza ndi makina a waya umodzi?
A: Makina opangira mawaya angapo amatha kugawa mawafa mazana ambiri nthawi imodzi, kukulitsa luso la 5-10 ×. Kugwiritsidwa ntchito kwazinthu kumakhalanso kokulirapo ndi kutayika kwa kerf pansi pa 100 μm, ndikupangitsa kuti ikhale yabwino kupanga zambiri.
Q2: Ndi mitundu yanji yazinthu zomwe zitha kukonzedwa?
A: Makinawa amapangidwira zinthu zolimba komanso zowonongeka, kuphatikizapo silicon carbide (SiC), safiro, gallium nitride (GaN), quartz, alumina (Al₂O₃), ndi aluminium nitride (AlN).
Q3: Kodi kulondola kothekera ndi mtundu wanji wa pamwamba ndi chiyani?
A: Kuuma kwapamwamba kumatha kufika ku Ra <0.5 μm, ndi kulondola kwa ± 0.02 mm. Kuwongolera m'mphepete kumatha kuwongoleredwa ku <20 μm, kukumana ndi semiconductor ndi miyezo yamakampani optoelectronic.
Q4: Kodi kudula kumayambitsa ming'alu kapena kuwonongeka?
A: Ndi kuwongolera kozizira kwambiri komanso kutsekeka kotsekeka, chiwopsezo cha ming'alu yaying'ono ndi kuwonongeka kwa kupsinjika kumachepetsedwa, kuwonetsetsa kukhulupirika kwabwino kwambiri.
