Zida Zobowola za Nanosecond Laser za Glass Drilling makulidwe≤20mm

Zida Zobowola za Laser za Nanosecond za Kubowola kwa Glass makulidwe≤20mm Chithunzi Chowonetsedwa

Kufotokozera Kwachidule:

Chidule chaukadaulo:
Infrared Nanosecond Laser Glass Drilling System ndi njira yopangira magalasi yamafakitale yomwe idapangidwa kuti ibowole mwatsatanetsatane zida zamagalasi. Pogwiritsa ntchito gwero la laser la 1064nm infrared nanosecond laser (m'lifupi mwake: 10-300ns), makinawa amakwaniritsa kubowola kolondola kwambiri m'magawo osiyanasiyana agalasi okhala ndi makulidwe ≤20mm kudzera pakuwongolera mphamvu moyenera komanso matekinoloje opangira matabwa.
Pakugwiritsa ntchito mzere wopanga, Infrared Nanosecond Laser Drilling System ikuwonetsa maubwino apadera. Poyerekeza ndi kubowola wamba kapena CO₂ laser processing, dongosolo wokometsedwa matenthedwe mphamvu kulamulira limagwirira zimathandiza mwatsatanetsatane kubowola ndi diameters dzenje kuyambira Φ0.1-5mm mu muyezo soda-laimu galasi, pamene kusunga dzenje khoma taper mkati ± 0.5 °. Makamaka pakupanga ma lens ophimba a safiro a foni yam'manja, makinawa amatha kupanga Φ0.3mm zazing'ono zazing'ono zokhala ndi malo olondola a ± 10μm, kukwaniritsa zofunikira za miniaturization pamagetsi ogula. Dongosololi limabwera mokhazikika ndi makina otengera / kutsitsa ophatikizika osakanikirana ndi mizere yomwe ilipo.

Titumizireni imelo

Tsatanetsatane wa Zamalonda

Zolemba Zamalonda

Main parameter

Mtundu wa laser	Infrared nanosecond
Kukula kwa nsanja	*800600(mm)**
	*20001200(mm)**
Kubowola makulidwe	≤20(mm)
Liwiro lobowola	0-5000(mm/s)
Kubowola m'mphepete kusweka	<0.5(mm)
Chidziwitso: Kukula kwa nsanja kumatha kusinthidwa makonda.

Laser Drilling Principle

Mtsinje wa laser umayang'ana pamalo abwino kwambiri poyerekeza ndi makulidwe a workpiece, kenako amasanthula m'njira zomwe zafotokozedwa mothamanga kwambiri. Kupyolera mu kuyanjana ndi mtengo wamphamvu wa laser, zinthu zomwe chandamale zimachotsedwa mosanjikiza-ndi-wosanjikiza kupanga mayendedwe odulira, kukwaniritsa kuphulika kolondola (zozungulira, masikweya, kapena ma geometri ovuta) ndi kulekanitsa kwazinthu zoyendetsedwa.

Ubwino Wobowola Laser

· Kuphatikizika kwakukulu kogwiritsa ntchito mphamvu zochepa komanso ntchito yosavuta;

· Non-kukhudzana processing zimathandiza wopanda malire chitsanzo geometries kuposa njira ochiritsira;

· Kugwiritsa ntchito kwaulere kumachepetsa ndalama zogwirira ntchito komanso kumapangitsa kuti chilengedwe chiziyenda bwino;

· Kulondola kwapamwamba kwambiri ndikupukuta pang'ono ndikuchotsa kuwonongeka kwachiwiri;

Zida zoboola magalasi a infrared nanosecond laser 2

Chiwonetsero chachitsanzo

Sinthani Mapulogalamu

Dongosololi limapangidwa kuti lizitha kukonza bwino zinthu zosalimba/zolimba kuphatikiza kubowola, grooving, kuchotsa filimu, ndi kulemba pamwamba. Zomwe zimagwiritsidwa ntchito ndizo:

1. Kubowola ndi notch kwa zigawo shawa chitseko

2. Kubowola mwatsatanetsatane kwa mapanelo agalasi

3. Solar panel kudzera pobowola

4. Kusintha / zitsulo chophimba mbale perforation

5. Galasi ❖ kuyanika kuchotsa ndi kubowola

6. Kujambula kwamtundu wapamwamba ndi grooving kwa mankhwala apadera

Processing Ubwino

1. Mapulatifomu amitundu yayikulu amakhala ndi mitundu yosiyanasiyana yazinthu zamafakitale

2. Kubowola kovutirapo komwe kumatheka pakadutsa chiphaso chimodzi

3. M'mphepete pang'ono kutsetsereka ndi kutsirizitsa kwapamwamba (Ra <0.8μm)

4. Kusintha kosasunthika pakati pazomwe zimapangidwira ndi ntchito mwachilengedwe

5. Kuchita bwino kokhala ndi:

Zokolola zambiri (> 99.2%)

· Consumable-free processing

· Kutulutsa koyipitsa kulibe

6.Kusamalidwa kosagwirizana kumatsimikizira kusungidwa kwa umphumphu pamwamba

Zofunika Kwambiri

1. Precision Thermal Management Technology:

Amagwiritsa ntchito kubowola kopitilira muyeso kopitilira muyeso ndi mphamvu imodzi yosinthika (0.1–50 mJ)

· Njira yodzitchinjiriza yoteteza katani yamphepo imatsekereza malo omwe amakhudzidwa ndi kutentha mkati mwa 10% ya dzenje lalikulu.

· Munthawi yeniyeni yowunikira kutentha kwa infrared imangobweza magawo amagetsi (± 2% kukhazikika)

2. Intelligent Processing Platform:

· Wokhala ndi siteji yamoto yolondola kwambiri (kubwereza kulondola kwa malo: ± 2 μm)

* Dongosolo lophatikizana la masomphenya (5-megapixel CCD, kulondola kwa kuzindikira: ± 5 μm)

+ Zosungidwa zakale zamapulogalamu zokhala ndi magawo okometsedwa amitundu 50+ ya zida zamagalasi

3. Kupanga Mwachangu Kwambiri:

· Njira zosinthira masiteshoni apawiri ndi nthawi yosinthira zinthu ≤3 masekondi

Kuzungulira kokhazikika kwa 1 hole/0.5 sec (Φ0.5 mm kudutsa-bowo)

· Mapangidwe a modular amathandizira kusinthana kwachangu kwa ma lens omwe akulunjika (kusiyana kwa makonzedwe: Φ0.1–10 mm)

Brittle Hard Material Processing Applications

Mtundu Wazinthu	Ntchito Scenario	Kukonza Zinthu
Soda-laimu Galasi	Zitseko za shawa	Kuyika mabowo & ngalande zotayira
Soda-laimu Galasi	Zida zowongolera zida	Mabowo a ngalande
Galasi Yotentha	Mawindo owonera uvuni	Mpweya wolowera dzenje arrays
Galasi Yotentha	Zophika za induction	Njira zoziziritsira zopindika
Galasi la Borosilicate	Makanema adzuwa	Mabowo okwera
Galasi la Borosilicate	Laboratory glassware	Mwambo ngalande ngalande
Galasi-ceramic	Malo ophikira	Mabowo oyatsira moto
Galasi-ceramic	Ma induction cookers	Sensor mounting hole arrays
Safira	Zida zanzeru zimakwirira	Mabowo olowera mpweya
Safira	Malo owonera mafakitale	Analimbitsa mabowo
Galasi Wokutidwa	Magalasi aku bafa	Mabowo okwera (kuchotsa zokutira + kubowola)
Galasi Wokutidwa	Makoma a nsalu	Magalasi a Low-E amabisa mabowo a ngalande
Galasi ya Ceramicized	Sinthani / zovundikira socket	Malo otetezedwa + mabowo a waya
Galasi ya Ceramicized	Zolepheretsa moto	Mabowo opereka chithandizo chadzidzidzi

XKH imapereka chithandizo chokwanira chaukadaulo komanso ntchito zowonjezera pazida zobowolera magalasi a infrared nanosecond laser kuti zitsimikizire kuti zimagwira ntchito bwino pa nthawi yonse ya moyo wa zida. Timapereka ntchito zachitukuko zomwe gulu lathu la uinjiniya limagwirira ntchito limodzi ndi makasitomala kuti likhazikitse malaibulale okhudzana ndi zinthu, kuphatikiza mapulogalamu apadera obowola azinthu zovuta monga safiro ndi magalasi opumira okhala ndi makulidwe osiyanasiyana kuchokera ku 0.1mm mpaka 20mm. Pofuna kukhathamiritsa kupanga, timayesa kuyesa zida zapamalo ndikuyesa kutsimikizira magwiridwe antchito, kuwonetsetsa kuti ma metric ofunikira monga kulolerana kwa dzenje (± 5μm) ndi mtundu wam'mphepete (Ra<0.5μm) amakwaniritsa miyezo yamakampani.

Zam'mbuyo: Microjet laser teknoloji zida zopyapyala kudula SiC processing zinthu

Ena: 6 Inchi Conductive SiC Composite Substrate 4H Diameter 150mm Ra≤0.2nm Warp≤35μm

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