Zida Zodulira Mokwanira Wafer Wafer-Kudula Zogwira Ntchito 8inch/12inch Wafer Ring Cutting
Zosintha zaukadaulo
Parameter | Chigawo | Kufotokozera |
Maximum Workpiece Kukula | mm | ku12" |
Spindle | Kusintha | Single Spindle |
Liwiro | 3,000-60,000 rpm | |
Mphamvu Zotulutsa | 1.8 kW (2.4 ngati mukufuna) pa 30,000 min⁻¹ | |
Max Blade Dia. | Ø58 mm | |
X-axis | Kudula Range | 310 mm |
Y-axis | Kudula Range | 310 mm |
Kuwonjezeka kwa Gawo | 0.0001 mm | |
Malo Olondola | ≤0.003 mm/310 mm, ≤0.002 mm/5 mm (cholakwika chimodzi) | |
Z-Axis | Kusintha kwa Movement Resolution | 0.00005 mm |
Kubwerezabwereza | 0.001 mm | |
θ-Axis | Kuzungulira Kwambiri | 380 deg |
Mtundu wa Spindle | Single spindle, yokhala ndi tsamba lolimba lodulira mphete | |
Kudula-Kudula Kulondola | μm | ±50 |
Kulondola kwa Wafer Positioning | μm | ±50 |
Kuchita Bwino kwa Wafer Imodzi | mphindi / mkate | 8 |
Multi-Wafer Efficiency | Zopangira zowola mpaka 4 zokonzedwa nthawi imodzi | |
Kulemera kwa Zida | kg | ≈3,200 |
Kukula kwa Zida (W×D×H) | mm | 2,730 × 1,550 × 2,070 |
Mfundo Yoyendetsera Ntchito
Dongosololi limakwaniritsa magwiridwe antchito apadera pogwiritsa ntchito matekinoloje apakatikati:
1.Intelligent Motion Control System:
· Kuyendetsa bwino kwambiri kwa liniya yamagalimoto (kubwereza kulondola kwa malo: ± 0.5μm)
· Six-axis synchronous control yothandizira makonzedwe ovuta a trajectory
· Real-time vibration kupondereza ma aligorivimu akuwonetsetsa kukhazikika kwa kudula
2.Advanced Detection System:
· Integrated 3D laser height sensor (kulondola: 0.1μm)
Mawonekedwe apamwamba kwambiri a CCD (5 megapixels)
· Module yoyendera pa intaneti
3.Njira Yokhazikika Yokhazikika:
+ Kutsitsa / kutsitsa zokha (mawonekedwe a FOUP amagwirizana)
· Wanzeru kusanja dongosolo
· Chigawo chotsuka zotsekera (ukhondo: Gulu 10)
Ntchito Zofananira
Chida ichi chimapereka phindu lalikulu pamapulogalamu opanga semiconductor:
Munda Wofunsira | Zida Zopangira | Ubwino Waukadaulo |
IC Manufacturing | 8/12 "Zipatso za Silicon | Imawonjezera kulumikizana kwa lithography |
Zida Zamagetsi | SiC/GaN Wafers | Imateteza zolakwika zam'mbali |
Masensa a MEMS | Zithunzi za SOI | Imatsimikizira kudalirika kwa chipangizocho |
Zida za RF | Zakudya za GaAs | Imawongolera magwiridwe antchito apamwamba kwambiri |
Zapamwamba Packaging | Zophika Zopangidwanso | Zimawonjezera zokolola zapackage |
Mawonekedwe
1.Four-station kasinthidwe kwa mkulu processing dzuwa;
2.Stable TAIKO mphete debonding ndi kuchotsa;
3.Kugwirizana kwakukulu ndi zinthu zofunika kugula;
4.Multi-axis synchronous yokonza luso zimatsimikizira mwatsatanetsatane m'mphepete kudula;
5.Fully yodzichitira okha ndondomeko otaya kwambiri amachepetsa ntchito ndalama;
6.Customized worktable kamangidwe chimathandiza khola processing wa nyumba yapadera;
Ntchito
1.Ring-drop kuzindikira dongosolo;
2.Automatic worktable kuyeretsa;
3.Intelligent UV debonding dongosolo;
4. Ntchito chipika kujambula;
5.Factory zochita zokha gawo kuphatikiza;
Kudzipereka kwa Utumiki
XKH imapereka chithandizo chokwanira, chathunthu chamoyo wonse chomwe chimapangidwira kukulitsa magwiridwe antchito a zida komanso magwiridwe antchito paulendo wanu wonse wopanga.
1. Ntchito Zosintha Mwamakonda Anu
· Kukonzekera kwa Zida Zogwirizana: Gulu lathu la uinjiniya limagwira ntchito limodzi ndi makasitomala kuti liwongolere magawo adongosolo (kudula liwiro, kusankha masamba, ndi zina zambiri) kutengera zinthu zakuthupi (Si / SiC / GaAs) ndi zofunikira pakukonzekera.
Thandizo Lachitukuko cha Njira: Timapereka kukonzanso kwachitsanzo ndi malipoti owunikira mwatsatanetsatane kuphatikiza muyeso wam'mbali mwaukali komanso mapu a zolakwika.
· Co-Development Co-Consumables: Pazinthu zatsopano (mwachitsanzo, Ga₂O₃), timathandizana ndi opanga zinthu zambiri kuti tipange masamba/ma laser optics enieni.
2. Professional Technical Support
Thandizo Lodzipatulira Patsamba: Perekani mainjiniya ovomerezeka pamagawo ovuta kwambiri (nthawi zambiri masabata a 2-4), okhudza:
Kusintha kwa zida & kukonza bwino
Maphunziro a luso la oyendetsa
Chitsogozo chophatikizira zipinda zoyera za ISO Class 5
· Kukonzekera Kukonzekera: Kuwunika thanzi la kotala ndi kusanthula kugwedezeka ndi kuwunika kwa ma servo motor kuti mupewe kutsika kosakonzekera.
Kuwunika Kutali: Kutsata kwa zida zenizeni zenizeni kudzera papulatifomu yathu ya IoT (JCFront Connect®) yokhala ndi zidziwitso zodziwikiratu.
3. Ntchito Zowonjezera Phindu
- Chidziwitso Chachidziwitso: Pezani maphikidwe odulira ovomerezeka 300+ azinthu zosiyanasiyana (zosinthidwa kotala).
· Kuyanjanitsa kwa Map Roadmap: Umboni wamtsogolo wa zomwe mwagulitsa ndi hardware/mapulogalamu okweza njira (mwachitsanzo, gawo lodziwira vuto lochokera ku AI).
Kuyankha Mwadzidzidzi: Kutsimikizika kwakutali kwa maola 4 ndi kulowererapo kwa maola 48 pamalopo (kufalikira padziko lonse lapansi).
4. Infrastructure Service
· Chitsimikizo Chogwira Ntchito: Kudzipereka kwa makontrakitala ku ≥98% nthawi yowonjezera zida ndi nthawi zoyankhira zothandizidwa ndi SLA.
Kupititsa patsogolo Mopitiriza
Timachita kafukufuku wokhutiritsa makasitomala kawiri pachaka ndikugwiritsa ntchito njira za Kaizen kuti tipititse patsogolo ntchito zoperekedwa. Gulu lathu la R&D limamasulira zidziwitso zapagawo pakukweza zida - 30% yakusintha kwa firmware imachokera kumalingaliro a kasitomala.

