Zida Zodulira Mokwanira Wafer Wafer-Kudula Zogwira Ntchito 8inch/12inch Wafer Ring Cutting

Kufotokozera Kwachidule:

XKH yapanga paokha makina omangira m'mphepete mwake, kuyimira njira yotsogola yopangidwira njira zopangira zida zam'tsogolo. Chida ichi chimaphatikizapo ukadaulo wowongolera wamitundu ingapo ndipo imakhala ndi makina ozungulira olimba kwambiri (liwiro lozungulira kwambiri: 60,000 RPM), kuperekera m'mphepete molunjika ndikudula mpaka ± 5μm. Dongosololi likuwonetsa kuyanjana kwabwino kwambiri ndi magawo osiyanasiyana a semiconductor, kuphatikiza koma osachepera:
1.Silicon wafers (Si): Oyenera m'mphepete processing wa 8-12 inchi zowotcha;
2.Compound semiconductors: Chachitatu m'badwo semiconductor zipangizo monga GaAs ndi SiC;
3.Special magawo: Piezoelectric zinthu zopyapyala kuphatikizapo LT/LN;

Mapangidwe amtundu wa modular amathandizira kusinthidwa mwachangu kwa zinthu zambiri zomwe zimaphatikizika ndi miyala ya diamondi ndi mitu yodulira laser, zomwe zimayenderana mopitilira miyezo yamakampani. Pazofunikira zamakina apadera, timapereka mayankho athunthu kuphatikiza:
· Odzipereka kudula consumables kupereka
· Mwambo processing misonkhano
· Njira zothetsera kukhathamiritsa kwa magawo


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  • Mawonekedwe

    Zosintha zaukadaulo

    Parameter Chigawo Kufotokozera
    Maximum Workpiece Kukula mm ku12"
    Spindle    Kusintha Single Spindle
    Liwiro 3,000-60,000 rpm
    Mphamvu Zotulutsa 1.8 kW (2.4 ngati mukufuna) pa 30,000 min⁻¹
    Max Blade Dia. Ø58 mm
    X-axis Kudula Range 310 mm
    Y-axis   Kudula Range 310 mm
    Kuwonjezeka kwa Gawo 0.0001 mm
    Malo Olondola ≤0.003 mm/310 mm, ≤0.002 mm/5 mm (cholakwika chimodzi)
    Z-Axis  Kusintha kwa Movement Resolution 0.00005 mm
    Kubwerezabwereza 0.001 mm
    θ-Axis Kuzungulira Kwambiri 380 deg
    Mtundu wa Spindle   Single spindle, yokhala ndi tsamba lolimba lodulira mphete
    Kudula-Kudula Kulondola μm ±50
    Kulondola kwa Wafer Positioning μm ±50
    Kuchita Bwino kwa Wafer Imodzi mphindi / mkate 8
    Multi-Wafer Efficiency   Zopangira zowola mpaka 4 zokonzedwa nthawi imodzi
    Kulemera kwa Zida kg ≈3,200
    Kukula kwa Zida (W×D×H) mm 2,730 × 1,550 × 2,070

    Mfundo Yoyendetsera Ntchito

    Dongosololi limakwaniritsa magwiridwe antchito apadera pogwiritsa ntchito matekinoloje apakatikati:

    1.Intelligent Motion Control System:
    · Kuyendetsa bwino kwambiri kwa liniya yamagalimoto (kubwereza kulondola kwa malo: ± 0.5μm)
    · Six-axis synchronous control yothandizira makonzedwe ovuta a trajectory
    · Real-time vibration kupondereza ma aligorivimu akuwonetsetsa kukhazikika kwa kudula

    2.Advanced Detection System:
    · Integrated 3D laser height sensor (kulondola: 0.1μm)
    Mawonekedwe apamwamba kwambiri a CCD (5 megapixels)
    · Module yoyendera pa intaneti

    3.Njira Yokhazikika Yokhazikika:
    + Kutsitsa / kutsitsa zokha (mawonekedwe a FOUP amagwirizana)
    · Wanzeru kusanja dongosolo
    · Chigawo chotsuka zotsekera (ukhondo: Gulu 10)

    Ntchito Zofananira

    Chida ichi chimapereka phindu lalikulu pamapulogalamu opanga semiconductor:

    Munda Wofunsira Zida Zopangira Ubwino Waukadaulo
    IC Manufacturing 8/12 "Zipatso za Silicon Imawonjezera kulumikizana kwa lithography
    Zida Zamagetsi SiC/GaN Wafers Imateteza zolakwika zam'mbali
    Masensa a MEMS Zithunzi za SOI Imatsimikizira kudalirika kwa chipangizocho
    Zida za RF Zakudya za GaAs Imawongolera magwiridwe antchito apamwamba kwambiri
    Zapamwamba Packaging Zophika Zopangidwanso Zimawonjezera zokolola zapackage

    Mawonekedwe

    1.Four-station kasinthidwe kwa mkulu processing dzuwa;
    2.Stable TAIKO mphete debonding ndi kuchotsa;
    3.Kugwirizana kwakukulu ndi zinthu zofunika kugula;
    4.Multi-axis synchronous yokonza luso zimatsimikizira mwatsatanetsatane m'mphepete kudula;
    5.Fully yodzichitira okha ndondomeko otaya kwambiri amachepetsa ntchito ndalama;
    6.Customized worktable kamangidwe chimathandiza khola processing wa nyumba yapadera;

    Ntchito

    1.Ring-drop kuzindikira dongosolo;
    2.Automatic worktable kuyeretsa;
    3.Intelligent UV debonding dongosolo;
    4. Ntchito chipika kujambula;
    5.Factory zochita zokha gawo kuphatikiza;

    Kudzipereka kwa Utumiki

    XKH imapereka chithandizo chokwanira, chathunthu chamoyo wonse chomwe chimapangidwira kukulitsa magwiridwe antchito a zida komanso magwiridwe antchito paulendo wanu wonse wopanga.
    1. Ntchito Zosintha Mwamakonda Anu
    · Kukonzekera kwa Zida Zogwirizana: Gulu lathu la uinjiniya limagwira ntchito limodzi ndi makasitomala kuti liwongolere magawo adongosolo (kudula liwiro, kusankha masamba, ndi zina zambiri) kutengera zinthu zakuthupi (Si / SiC / GaAs) ndi zofunikira pakukonzekera.
    Thandizo Lachitukuko cha Njira: Timapereka kukonzanso kwachitsanzo ndi malipoti owunikira mwatsatanetsatane kuphatikiza muyeso wam'mbali mwaukali komanso mapu a zolakwika.
    · Co-Development Co-Consumables: Pazinthu zatsopano (mwachitsanzo, Ga₂O₃), timathandizana ndi opanga zinthu zambiri kuti tipange masamba/ma laser optics enieni.

    2. Professional Technical Support
    Thandizo Lodzipatulira Patsamba: Perekani mainjiniya ovomerezeka pamagawo ovuta kwambiri (nthawi zambiri masabata a 2-4), okhudza:
    Kusintha kwa zida & kukonza bwino
    Maphunziro a luso la oyendetsa
    Chitsogozo chophatikizira zipinda zoyera za ISO Class 5
    · Kukonzekera Kukonzekera: Kuwunika thanzi la kotala ndi kusanthula kugwedezeka ndi kuwunika kwa ma servo motor kuti mupewe kutsika kosakonzekera.
    Kuwunika Kutali: Kutsata kwa zida zenizeni zenizeni kudzera papulatifomu yathu ya IoT (JCFront Connect®) yokhala ndi zidziwitso zodziwikiratu.

    3. Ntchito Zowonjezera Phindu
    - Chidziwitso Chachidziwitso: Pezani maphikidwe odulira ovomerezeka 300+ azinthu zosiyanasiyana (zosinthidwa kotala).
    · Kuyanjanitsa kwa Map Roadmap: Umboni wamtsogolo wa zomwe mwagulitsa ndi hardware/mapulogalamu okweza njira (mwachitsanzo, gawo lodziwira vuto lochokera ku AI).
    Kuyankha Mwadzidzidzi: Kutsimikizika kwakutali kwa maola 4 ndi kulowererapo kwa maola 48 pamalopo (kufalikira padziko lonse lapansi).

    4. Infrastructure Service
    · Chitsimikizo Chogwira Ntchito: Kudzipereka kwa makontrakitala ku ≥98% nthawi yowonjezera zida ndi nthawi zoyankhira zothandizidwa ndi SLA.

    Kupititsa patsogolo Mopitiriza

    Timachita kafukufuku wokhutiritsa makasitomala kawiri pachaka ndikugwiritsa ntchito njira za Kaizen kuti tipititse patsogolo ntchito zoperekedwa. Gulu lathu la R&D limamasulira zidziwitso zapagawo pakukweza zida - 30% yakusintha kwa firmware imachokera kumalingaliro a kasitomala.

    Zida Zodulira mphete za Wafer 7
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