Ma Wafers a Silicon Carbide Wafers a 3 inch High Purity (Osadulidwa) a semi-Insulating Sic Substrates (HPSl)

Silicon Carbide Wafers ya mainchesi atatu yoyera kwambiri (yosadulidwa) ya semi-Insulating Sic Substrates (HPSl) Chithunzi Chowonetsedwa

Kufotokozera Kwachidule:

Wafer wa 3-inch High Purity Semi-Insulating (HPSI) Silicon Carbide (SiC) ndi substrate yapamwamba kwambiri yokonzedwa kuti igwiritsidwe ntchito ndi mphamvu zambiri, ma frequency apamwamba, komanso ma optoelectronic. Wopangidwa ndi zinthu zopanda undoped, high-purity 4H-SiC, ma wafer awa ali ndi mphamvu zabwino kwambiri zoyendetsera kutentha, bandgap yayikulu, komanso mawonekedwe apadera a semi-insulating, zomwe zimapangitsa kuti zikhale zofunika kwambiri pakupanga zida zapamwamba. Ndi kapangidwe kake kabwino komanso mawonekedwe apamwamba, ma substrate a HPSI SiC ndi maziko a ukadaulo wamtsogolo mumakampani amagetsi, kulumikizana, ndi ndege, kuthandizira kupanga zinthu zatsopano m'magawo osiyanasiyana.

Tumizani imelo kwa ife

Mawonekedwe

Katundu

1. Kapangidwe ka Thupi ndi Kapangidwe kake
●Mtundu wa Zinthu: Kuyera Kwambiri (Kopanda Dope) Silicon Carbide (SiC)
●Mulifupi: mainchesi 3 (76.2 mm)
●Kukhuthala: 0.33-0.5 mm, kosinthika malinga ndi zofunikira pakugwiritsa ntchito.
●Kapangidwe ka Crystal: 4H-SiC polytype yokhala ndi hexagonal lattice, yodziwika ndi kuyenda kwa ma elekitironi ambiri komanso kukhazikika kwa kutentha.
●Kuyang'ana:
oStandard: [0001] (C-plane), yoyenera kugwiritsa ntchito zosiyanasiyana.
oZosankha: Off-axis (4° kapena 8° tilt) kuti epitaxial ya zigawo za chipangizocho ikule bwino.
●Kusalala: Kusiyanasiyana konse kwa makulidwe (TTV) ●Ubwino wa pamwamba:
o Yopukutidwa mpaka o Kuchuluka kwa chilema Chochepa (<10/cm² kuchuluka kwa mapaipi ang'onoang'ono). 2. Katundu Wamagetsi ●Kulimba: >109^99 Ω·cm, kumasungidwa mwa kuchotsa zinthu zofunidwa.
●Kulimba kwa Dielectric: Kupirira kwa magetsi amphamvu kwambiri komanso kutayika kochepa kwa magetsi, komwe ndi koyenera kugwiritsidwa ntchito ndi magetsi amphamvu kwambiri.
●Kutentha kwa kutentha: 3.5-4.9 W/cm·K, zomwe zimathandiza kuti kutentha kuchotsedwe bwino m'zida zogwira ntchito bwino.

3. Katundu wa Kutentha ndi Makina
●Chingwe Chokulirapo: 3.26 eV, chothandizira kugwira ntchito pansi pa mphamvu yamagetsi yapamwamba, kutentha kwambiri, komanso kutentha kwambiri.
●Kulimba: Mohs sikelo 9, kuonetsetsa kuti imagwira ntchito bwino polimbana ndi kuwonongeka kwa makina panthawi yokonza.
●Kukulitsa Kutentha: 4.2×10−6/K4.2 \times 10^{-6}/\text{K}4.2×10−6/K, kuonetsetsa kuti miyeso yake ndi yokhazikika pansi pa kusintha kwa kutentha.

Chizindikiro	Gulu Lopanga	Kalasi Yofufuzira	Giredi Yopanda Chilungamo	Chigawo
Giredi	Gulu Lopanga	Kalasi Yofufuzira	Giredi Yopanda Chilungamo
M'mimba mwake	76.2 ± 0.5	76.2 ± 0.5	76.2 ± 0.5	mm
Kukhuthala	500 ± 25	500 ± 25	500 ± 25	µm
Kuwongolera kwa Wafer	Pa-axis: <0001> ± 0.5°	Pa-axis: <0001> ± 2.0°	Pa-axis: <0001> ± 2.0°	digiri
Kuchuluka kwa mapaipi ang'onoang'ono (MPD)	≤ 1	≤ 5	≤ 10	cm−2^-2−2
Kukana kwa Magetsi	≥ 1E10	≥ 1E5	≥ 1E5	Ω·cm
Dopant	Yosachotsedwa	Yosachotsedwa	Yosachotsedwa
Kuyang'ana Kwambiri Pang'onopang'ono	{1-100} ± 5.0°	{1-100} ± 5.0°	{1-100} ± 5.0°	digiri
Utali Woyamba Wathyathyathya	32.5 ± 3.0	32.5 ± 3.0	32.5 ± 3.0	mm
Utali Wachiwiri Wathyathyathya	18.0 ± 2.0	18.0 ± 2.0	18.0 ± 2.0	mm
Kuyang'ana Kwachiwiri Kwapafupi	90° CW kuchokera ku chipinda choyamba ± 5.0°	90° CW kuchokera ku chipinda choyamba ± 5.0°	90° CW kuchokera ku chipinda choyamba ± 5.0°	digiri
Kupatula Mphepete	3	3	3	mm
LTV/TTV/Uta/Warp	3 / 10 / ±30 / 40	3 / 10 / ±30 / 40	5 / 15 / ±40 / 45	µm
Kuuma kwa pamwamba	Nkhope ya Si: CMP, Nkhope ya C: Yopukutidwa	Nkhope ya Si: CMP, Nkhope ya C: Yopukutidwa	Nkhope ya Si: CMP, Nkhope ya C: Yopukutidwa
Ming'alu (Kuwala Kwambiri)	Palibe	Palibe	Palibe
Ma Hex Plates (Kuwala Kwambiri)	Palibe	Palibe	Malo osonkhanitsidwa 10%	%
Malo Osiyanasiyana (Kuwala Kwambiri)	Malo osonkhanitsidwa 5%	Malo osonkhanitsidwa 20%	Malo osonkhanitsidwa 30%	%
Kukanda (Kuwala Kwambiri)	≤ mikwingwirima 5, kutalika kokwanira ≤ 150	≤ mikwingwirima 10, kutalika kokwanira ≤ 200	≤ mikwingwirima 10, kutalika kokwanira ≤ 200	mm
Kudula Mphepete	Palibe ≥ 0.5 mm m'lifupi/kuya	2 yaloledwa ≤ 1 mm m'lifupi/kuya	5 yaloledwa ≤ 5 mm m'lifupi/kuya	mm
Kuipitsidwa kwa pamwamba	Palibe	Palibe	Palibe

Mapulogalamu

1. Zamagetsi Zamagetsi Zamagetsi
Kuchuluka kwa bandgap ndi kutentha kwambiri kwa ma substrates a HPSI SiC kumapangitsa kuti zikhale zabwino kwambiri pazida zamagetsi zomwe zimagwira ntchito m'mikhalidwe yovuta kwambiri, monga:
●Zipangizo Zokhala ndi Mphamvu Yaikulu: Kuphatikiza ma MOSFET, ma IGBT, ndi ma Schottky Barrier Diodes (SBD) kuti azitha kusintha mphamvu moyenera.
●Machitidwe Obwezerezedwanso Mphamvu: Monga ma solar inverters ndi ma wind turbine controllers.
●Magalimoto Amagetsi (EV): Amagwiritsidwa ntchito mu ma inverter, ma charger, ndi makina opangira magetsi kuti awonjezere magwiridwe antchito ndikuchepetsa kukula.

2. Mapulogalamu a RF ndi Microwave
Kukana kwambiri kwa ma wafer a HPSI komanso kutayika kochepa kwa dielectric ndikofunikira kwambiri pa ma radio-frequency (RF) ndi ma microwave system, kuphatikizapo:
●Njira Zolumikizirana: Malo oyambira maukonde a 5G ndi maulumikizidwe a satelayiti.
●Ndege ndi Chitetezo: Makina a radar, ma antenna oyenda pang'onopang'ono, ndi zigawo za avionics.

3. Zipangizo zamagetsi
Kuwonekera bwino ndi kusiyana kwakukulu kwa 4H-SiC kumathandiza kuti igwiritsidwe ntchito pazida zamagetsi, monga:
●Zida zowunikira kuwala kwa dzuwa: Zowunikira chilengedwe komanso kuzindikira matenda.
●Ma LED Amphamvu Kwambiri: Amathandizira makina owunikira olimba.
●Ma Diode a Laser: Ogwiritsidwa ntchito m'mafakitale ndi m'zipatala.

4. Kafukufuku ndi Chitukuko
Ma substrates a HPSI SiC amagwiritsidwa ntchito kwambiri m'ma laboratories a kafukufuku ndi chitukuko cha maphunziro ndi mafakitale pofufuza zinthu zapamwamba komanso kupanga zipangizo, kuphatikizapo:
●Kukula kwa Epitaxial Layer: Maphunziro okhudza kuchepetsa zolakwika ndi kukonza bwino layer.
●Kafukufuku Wokhudza Kuyenda kwa Zinthu: Kufufuza za kayendedwe ka ma elekitironi ndi mabowo m'zinthu zoyera kwambiri.
●Kupanga zitsanzo: Kupanga koyamba kwa zipangizo zatsopano ndi ma circuits.

Ubwino

Ubwino Wapamwamba:
Kuyera kwambiri komanso kuchepa kwa chilema kumapereka nsanja yodalirika yogwiritsira ntchito zinthu zapamwamba.

Kukhazikika kwa Kutentha:
Makhalidwe abwino kwambiri ochotsera kutentha amalola zipangizo kugwira ntchito bwino pakakhala mphamvu zambiri komanso kutentha kwambiri.

Kugwirizana Kwambiri:
Mawonekedwe omwe alipo komanso makulidwe omwe apangidwa mwamakonda amatsimikizira kuti chipangizocho chikugwirizana ndi zosowa zosiyanasiyana.

Kulimba:
Kuuma kwapadera komanso kukhazikika kwa kapangidwe kake kumachepetsa kuwonongeka ndi kusinthika panthawi yokonza ndi kugwiritsa ntchito.

Kusinthasintha:
Yoyenera mafakitale osiyanasiyana, kuyambira mphamvu zongowonjezwdwanso mpaka ndege ndi mauthenga.

Mapeto

Wafer ya Silicon Carbide ya mainchesi atatu yokhala ndi High Purity Semi-Insulating ikuyimira ukadaulo wapamwamba kwambiri wa substrate wa zida zamagetsi zamphamvu kwambiri, zama frequency apamwamba, komanso zamagetsi. Kuphatikiza kwake kwa zinthu zabwino kwambiri zotenthetsera, zamagetsi, komanso zamakanika kumatsimikizira magwiridwe antchito odalirika m'malo ovuta. Kuyambira zamagetsi zamagetsi ndi machitidwe a RF mpaka ma optoelectronics ndi R&D apamwamba, ma substrates awa a HPSI amapereka maziko a zatsopano zamtsogolo.
Kuti mudziwe zambiri kapena kuti muyike oda, chonde titumizireni uthenga. Gulu lathu laukadaulo lilipo kuti likupatseni malangizo ndi njira zosinthira zomwe zikugwirizana ndi zosowa zanu.