12 mainchesi SiC Substrate N Mtundu Waukulu Waukulu Kugwiritsa Ntchito RF Kwambiri

Kufotokozera Kwachidule:

Chigawo cha SiC cha mainchesi 12 chikuyimira kupita patsogolo kwakukulu muukadaulo wa zida za semiconductor, zomwe zimapereka maubwino osintha pamagetsi amphamvu komanso kugwiritsa ntchito pafupipafupi kwambiri. Monga mtundu waukulu kwambiri wa silicon carbide wafer womwe umapezeka pamsika, gawo la SiC la mainchesi 12 limalola chuma chosayerekezeka cha kukula kwina kulikonse pomwe likusunga ubwino wazinthuzo wa mawonekedwe a bandgap komanso mphamvu zapadera zotenthetsera. Poyerekeza ndi ma wafer a SiC a mainchesi 6 kapena ang'onoang'ono, nsanja ya mainchesi 12 imapereka malo ogwiritsidwa ntchito opitilira 300% pa wafer iliyonse, zomwe zimawonjezera kwambiri phindu la die ndikuchepetsa ndalama zopangira zida zamagetsi. Kusintha kwa kukula kumeneku kumawonetsa kusintha kwa mbiri ya ma wafer a silicon, komwe kuwonjezeka kulikonse kwa mainchesi kumabweretsa kuchepetsa kwakukulu kwa ndalama ndikusintha magwiridwe antchito. Kuyenda bwino kwa kutentha kwa gawo la SiC la mainchesi 12 (pafupifupi 3 × kuposa silicon) komanso mphamvu yayikulu yowononga mphamvu zimapangitsa kuti ikhale yofunikira kwambiri pamagalimoto amagetsi a 800V a m'badwo wotsatira, komwe kumathandizira ma module amphamvu ocheperako komanso ogwira ntchito bwino. Mu zomangamanga za 5G, liwiro lalikulu la ma elekitironi la chipangizocho limalola zida za RF kugwira ntchito pama frequency apamwamba ndi kutayika kochepa. Kugwirizana kwa gawo lapansi ndi zida zosinthira zopangira silicon kumathandizanso kuti zinthu zomwe zilipo zigwiritsidwe ntchito mosavuta, ngakhale kuti kugwiritsa ntchito mwapadera kumafunika chifukwa cha kuuma kwambiri kwa SiC (9.5 Mohs). Pamene kuchuluka kwa zinthu zomwe zimapangidwa kukuwonjezeka, gawo lapansi la SiC la mainchesi 12 likuyembekezeka kukhala muyezo wamakampani ogwiritsa ntchito mphamvu zambiri, zomwe zikuyendetsa luso lamakono m'magalimoto, mphamvu zongowonjezwdwanso, komanso makina osinthira mphamvu zamafakitale.

Tumizani imelo kwa ife

Mawonekedwe

Magawo aukadaulo

12 mainchesi Silicon Carbide (SiC) Substrate Kufotokozera
Giredi		Kupanga kwa ZeroMPD Giredi (Giredi ya Z)	Kupanga Kokhazikika Giredi (Giredi P)		Giredi Yopanda Chilungamo (Giredi D)
M'mimba mwake		3 0 0 mm~1305mm
Kukhuthala	4H-N	750μm±15 μm	750μm±25 μm
	4H-SI	750μm±15 μm	750μm±25 μm
Kuwongolera kwa Wafer		Kutseka kwa mzere: 4.0° kulowera <1120 >±0.5° pa 4H-N, Kutseka kwa mzere: <0001>±0.5° pa 4H-SI
Kuchuluka kwa mapaipi ang'onoang'ono	4H-N	≤0.4cm-2	≤4cm-2		≤25cm-2
	4H-SI	≤5cm-2	≤10cm-2		≤25cm-2
Kusakhazikika	4H-N	0.015~0.024 Ω·cm			0.015~0.028 Ω·cm
	4H-SI	≥1E10 Ω·cm			≥1E5 Ω·cm
Kuyang'ana Kwambiri Pang'onopang'ono		{10-10} ±5.0°
Utali Woyamba Wathyathyathya	4H-N	N / A
	4H-SI	Chingwe
Kupatula Mphepete		3 mm
LTV/TTV/Uta/Warp		≤5μm/≤15μm/≤35 μm/≤55 μm			≤5μm/≤15μm/≤35 □ μm/≤55 □ μm
Kuuma		Chipolishi Ra≤1 nm
		CMP Ra≤0.2 nm			Ra≤0.5 nm
Ming'alu ya Mphepete Yopangidwa ndi Kuwala Kwakukulu Kwambiri Mbale za Hex Ndi Kuwala Kwakukulu Kwambiri Malo Opangidwa ndi Polytype Ndi Kuwala Kwambiri Kuphatikizidwa kwa Kaboni Yowoneka Kukanda kwa Silicon Pamwamba Ndi Kuwala Kwambiri		Palibe Malo osonkhanitsidwa ≤0.05% Palibe Malo osonkhanitsidwa ≤0.05% Palibe			Kutalika kokwanira ≤ 20 mm, kutalika kamodzi ≤2 mm Malo osonkhanitsidwa ≤0.1% Malo osonkhanitsidwa ≤3% Malo osonkhanitsidwa ≤3% Kutalika kokwanira ≤1 × m'mimba mwake wa wafer
Ma Chips a M'mphepete Ndi Kuwala Kwakukulu Kwambiri		Palibe chololedwa m'lifupi ndi kuya kwa ≥0.2mm			7 zololedwa, ≤1 mm iliyonse
(TSD) Kusokonekera kwa screw yolumikiza ulusi		≤500 cm-2		N / A
(BPD) Kusuntha kwa ndege yapansi		≤1000 cm-2		N / A
Kuipitsidwa kwa Silicon pamwamba ndi Kuwala Kwambiri		Palibe
Kulongedza		Kaseti Yokhala ndi Ma Wafer Ambiri Kapena Chidebe Chimodzi Chokhala ndi Ma Wafer
Zolemba:
1 Malire a zolakwika amagwira ntchito pamwamba pa wafer yonse kupatulapo malo ochotsera m'mphepete. 2 Mikwingwirima iyenera kuwonedwa pa nkhope ya Si yokha. 3 Deta ya kusokonekera kwa malo imachokera ku ma wafers odulidwa a KOH okha.

Zinthu Zofunika Kwambiri

1. Ubwino Waukulu: Chigawo cha SiC cha mainchesi 12 (chigawo cha silicon carbide cha mainchesi 12) chimapereka malo akuluakulu okhala ndi chidebe chimodzi, zomwe zimathandiza kuti ma chips ambiri apangidwe pa chidebe chilichonse, motero amachepetsa ndalama zopangira ndikuwonjezera phindu.
2. Zipangizo Zogwira Ntchito Kwambiri: Kulimba kwa silicon carbide komwe kumatentha kwambiri komanso mphamvu yamagetsi yowononga kwambiri kumapangitsa kuti gawo la mainchesi 12 likhale labwino kwambiri pakugwiritsa ntchito magetsi amphamvu komanso pafupipafupi, monga ma EV inverters ndi makina ochaja mwachangu.
3. Kugwirizana kwa Kukonza: Ngakhale kuti SiC ndi yovuta kwambiri komanso yovuta kukonza, gawo la SiC la mainchesi 12 limapeza zolakwika zochepa pamwamba kudzera mu njira zabwino zodulira ndi kupukuta, zomwe zimapangitsa kuti chipangizocho chizigwira bwino ntchito.
4. Kusamalira Kutentha Kwambiri: Ndi kutentha kwabwino kuposa zinthu zopangidwa ndi silicon, gawo la mainchesi 12 limathandiza kuthetsa kutentha m'zida zamagetsi amphamvu kwambiri, zomwe zimawonjezera nthawi ya moyo wa zida.

Mapulogalamu Aakulu

1. Magalimoto Amagetsi: Chigawo cha SiC cha mainchesi 12 (chigawo cha silicon carbide cha mainchesi 12) ndi gawo lofunika kwambiri la makina oyendetsa magetsi a m'badwo watsopano, zomwe zimathandiza ma inverter ogwira ntchito bwino omwe amawonjezera liwiro la magalimoto ndikuchepetsa nthawi yochaja.

2. Malo Oyambira a 5G: Ma substrate akuluakulu a SiC amathandizira zida za RF zama frequency apamwamba, zomwe zimakwaniritsa zosowa za malo oyambira a 5G kuti pakhale mphamvu zambiri komanso kutayika kochepa.

3.Magetsi a Mafakitale: Mu ma inverter a dzuwa ndi ma gridi anzeru, gawo la mainchesi 12 limatha kupirira ma voltage ambiri pomwe limachepetsa kutayika kwa mphamvu.

4. Zamagetsi Zamagetsi Zamagetsi: Ma charger ofulumira komanso magetsi a data center amtsogolo angagwiritse ntchito ma substrates a SiC a mainchesi 12 kuti akwaniritse kukula kochepa komanso kugwira ntchito bwino.

Ntchito za XKH

Timagwira ntchito yokonza zinthu mwamakonda pa ma substrate a 12-inch SiC (ma substrate a silicon carbide a 12-inch), kuphatikizapo:
1. Kudula ndi Kupukuta: Kukonza kwa substrate kosawonongeka kwambiri komanso kosalala kwambiri komwe kumapangidwa mogwirizana ndi zosowa za makasitomala, kuonetsetsa kuti chipangizocho chikugwira ntchito bwino.
2. Thandizo la Kukula kwa Epitaxial: Ntchito zapamwamba kwambiri za epitaxial wafer kuti zithandize kupanga ma chip mwachangu.
3. Kupanga Zithunzi Zazing'ono: Kumathandizira kutsimikizira kafukufuku ndi chitukuko cha mabungwe ndi mabizinesi ofufuza, kuchepetsa nthawi yopangira zinthu.
4. Upangiri waukadaulo: Mayankho ochokera kumapeto mpaka kumapeto kuyambira kusankha zinthu mpaka kukonza njira, kuthandiza makasitomala kuthana ndi mavuto okonza SiC.
Kaya ndi yopangira zinthu zambiri kapena yosinthidwa mwapadera, ntchito zathu za 12-inch SiC substrate zimagwirizana ndi zosowa zanu za polojekiti, zomwe zimathandizira kupita patsogolo kwaukadaulo.