Wafa wa mainchesi 12 wa 4H-SiC wa magalasi a AR

Kufotokozera Kwachidule:

TheChotsukira cha 4H-SiC (silicon carbide) cha mainchesi 12ndi wafer ya semiconductor yokhala ndi mainchesi akuluakulu kwambiri yopangidwa kuti igwiritsidwe ntchito m'badwo wotsatira.mphamvu yamagetsi yapamwamba, mphamvu yamagetsi yapamwamba, ma frequency apamwamba, ndi kutentha kwakukuluKupanga zamagetsi zamagetsi. Kugwiritsa ntchito ubwino wa SiC—mongamagetsi ofunikira kwambiri, liwiro lalikulu la ma elekitironi okhuta, kutentha kwambirindikukhazikika kwabwino kwa mankhwala—chinthu ichi chili ngati maziko a nsanja zamakono zamagetsi ndi ntchito zazikulu zatsopano za wafer.

Tumizani imelo kwa ife

Mawonekedwe

Chithunzi Chatsatanetsatane

Chidule

Kukwaniritsa zofunikira zamakampani onsekuchepetsa ndalama ndi kukonza zokololakusintha kuchoka pa malo odziwika bwino6–8 mainchesi SiC to SiC ya mainchesi 12Ma substrates amadziwika kwambiri ngati njira yofunika kwambiri. Wafer ya mainchesi 12 imapereka malo akuluakulu ogwiritsidwa ntchito kuposa ma formats ang'onoang'ono, zomwe zimathandiza kuti pakhale ma die output ambiri pa wafer iliyonse, kugwiritsa ntchito bwino wafer, komanso kuchepetsa edge-loss—potero zimathandiza kukonza bwino ndalama zopangira zinthu zonse mu unyolo wonse woperekera.

Kukula kwa Makristalo ndi Njira Yopangira Ma Wafer

Gawo loyambira la 4H-SiC la mainchesi 12 limapangidwa kudzera mu unyolo wonse wophimbakukula kwa mbewu, kukula kwa kristalo imodzi, kusweka, kupukuta, ndi kupukuta, kutsatira njira zodziwika bwino zopangira zinthu zopangidwa ndi semiconductor:

Kukula kwa mbewu pogwiritsa ntchito njira yoyendera nthunzi ya thupi (PVT):
A mainchesi 12Kristalo wa mbewu ya 4H-SiCimapezeka kudzera mu kukula kwa mainchesi pogwiritsa ntchito njira ya PVT, zomwe zimathandiza kukula kwa maboules a 4H-SiC okwana mainchesi 12.
Kukula kwa kristalo imodzi ya 4H-SiC yoyendetsa:
Kuyendetsan⁺ 4H-SiCKukula kwa makristalo amodzi kumachitika mwa kuyika nayitrogeni mu malo okulirapo kuti ipereke mankhwala ochepetsa mphamvu ya dope.
Kupanga ma wafer (kukonza zinthu za semiconductor wamba):
Pambuyo popanga boule, ma wafer amapangidwa kudzera mukudula kwa laser, otsatidwa ndikupukuta, kupukuta (kuphatikizapo kumaliza CMP-level), ndi kuyeretsa.
Kukhuthala kwa substrate komwe kumachitika ndi560 μm.

Njira yolumikizidwa iyi idapangidwa kuti ithandizire kukula kokhazikika pa ultra-large diameter pomwe ikusunga umphumphu wa kristalo ndi mphamvu zamagetsi zokhazikika.

Kuti muwonetsetse kuti pali kuwunika kwabwino, gawo lapansi limadziwika pogwiritsa ntchito zida zowunikira kapangidwe kake, kuwala, zamagetsi, ndi zolakwika:

Raman spectroscopy (kujambula mapu a dera):kutsimikizira kufanana kwa polytype kudutsa wafer
Kujambula maikulosikopu yowunikira yokha yokha (mapu a wafer):kuzindikira ndi kuwunika ziwerengero za ma micropipes
Kuyeza kwa mphamvu ya resistivity yosakhudzana ndi kukhudzana (mapu a wafer):kugawa kwa resistivity m'malo osiyanasiyana oyezera
Kufalikira kwa X-ray (HRXRD) kwapamwamba kwambiri:kuwunika kwa khalidwe la kristalo kudzera mu miyeso ya rocking curve
Kuyang'anira kusokonekera kwa malo (mutatha kudula kosankhidwa):kuwunika kuchuluka kwa dislocation ndi mawonekedwe ake (poyang'ana kwambiri dislocations ya screw)

sic wafer 10

Zotsatira Zofunikira pa Magwiridwe Antchito (Woyimira)

Zotsatira za makhalidwe zikuwonetsa kuti gawo lapansi la 4H-SiC lokhala ndi mainchesi 12 likuwonetsa ubwino wamphamvu pazinthu zofunika kwambiri:

(1) Kuyera ndi kufanana kwa mitundu yosiyanasiyana

Mapu a madera a Raman akuwonetsaKuphimba kwa polytype ya 4H-SiC 100%kudutsa pansi.
Palibe kupezeka kwa mitundu ina ya polytype (monga 6H kapena 15R), zomwe zikusonyeza kuwongolera bwino kwa polytype pa sikelo ya mainchesi 12.

(2) Kuchulukana kwa mapaipi ang'onoang'ono (MPD)

Kujambula mapu a microscopy pogwiritsa ntchito chigamba cha wafer kumasonyezakuchulukana kwa mapaipi ang'onoang'ono < 0.01 cm⁻², kusonyeza kuletsa bwino gulu la zilema zoletsa chipangizochi.

(3) Kukana kwa magetsi ndi kufanana kwake

Mapu osonyeza kukana kukhudzana ndi chinthu (muyeso wa mfundo 361) akusonyeza:
- Kukana kwa mphamvu:20.5–23.6 mΩ·cm
- Kukana kwapakati:22.8 mΩ·cm
- Kusagwirizana:< 2%
  Zotsatirazi zikusonyeza kukhazikika kwa dopant komanso kufanana kwamagetsi kwabwino.

(4) Ubwino wa kristalo (HRXRD)

Miyeso ya HRXRD rocking curve pa(004) kuwunikira, yatengedwa pamapointi asanumotsatira njira ya wafer diameter, onetsani:
- Ma peak amodzi, ofanana ndi ofanana popanda khalidwe la ma peak ambiri, zomwe zikusonyeza kuti palibe mawonekedwe a malire a tinthu tating'onoting'ono.
- Avereji ya FWHM:20.8 arcsec (″), zomwe zikusonyeza kuti ndi kristalo wapamwamba kwambiri.

(5) Kuchuluka kwa screw dislocation (TSD)

Pambuyo posankha bwino komanso kusanthula kodziyimira pawokha,kachulukidwe ka dislocation ya screwimayesedwa pa2 cm⁻², kusonyeza TSD yotsika pa sikelo ya mainchesi 12.

Mapeto kuchokera ku zotsatira zomwe zili pamwambapa:
Chigawo chapansi chikuwonetsaKuyera kwabwino kwambiri kwa 4H polytype, kuchuluka kwa micropipe kochepa kwambiri, kukana kokhazikika komanso kofanana, khalidwe lamphamvu la kristalo, komanso kuchuluka kochepa kwa screw dislocation, kuthandizira kuyenerera kwake popanga zipangizo zamakono.

Mtengo ndi Ubwino wa Zamalonda

Imathandizira kusamutsa kwa ma SiC a mainchesi 12
Imapereka nsanja yapamwamba kwambiri yogwirizana ndi njira yamakampani yopangira ma wafer a SiC a mainchesi 12.
Kuchulukana kochepa kwa chilema kuti chipangizo chikhale chogwira ntchito bwino komanso chodalirika
Kuchulukana kwa mapaipi ang'onoang'ono otsika kwambiri komanso kutsika kwa makulidwe a screw kumathandiza kuchepetsa njira zowonongera zowononga komanso zopinga.
Kufanana kwabwino kwamagetsi kuti zinthu ziyende bwino
Kugawika kolimba kwa mphamvu kumathandiza kuti chigwirizanitse bwino pakati pa wafer ndi wafer komanso chipangizocho chikhale cholimba mkati mwa wafer.
Ubwino wapamwamba wa kristalo wothandizira epitaxy ndi kukonza zida
Zotsatira za HRXRD ndi kusowa kwa zizindikiro za malire a tirigu otsika zimasonyeza ubwino wa zinthu zomwe zingagwiritsidwe ntchito pakukula kwa epitaxial ndi kupanga zipangizo.

Mapulogalamu Oyenera

Chotsukira cha 4H-SiC cha mainchesi 12 chingagwiritsidwe ntchito pa:

Zipangizo zamagetsi za SiC:Ma MOSFET, ma Schottky barrier diode (SBD), ndi zina zokhudzana nazo
Magalimoto amagetsi:ma inverter akuluakulu ogwirira ntchito, ma charger omwe ali mkati (OBC), ndi ma converter a DC-DC
Mphamvu zongowonjezedwanso ndi gridi:ma inverter a photovoltaic, makina osungira mphamvu, ndi ma module anzeru a grid
Zamagetsi zamagetsi zamafakitale:magetsi amphamvu kwambiri, ma drive a mota, ndi ma converter amphamvu kwambiri
Zofunikira zazikulu za wafer zomwe zikubwera:ma phukusi apamwamba ndi zochitika zina zopangira semiconductor zogwirizana ndi mainchesi 12

Mafunso Ofunsidwa Kawirikawiri - Substrate ya 4H-SiC ya mainchesi 12

Q1. Kodi chinthuchi ndi cha mtundu wanji wa SiC substrate?

A:
Katundu uyu ndiChoyatsira cha 12-inch (mtundu wa n⁺) cha 4H-SiC single-crystal substrate, yomwe imakula pogwiritsa ntchito njira ya Physical Vapor Transport (PVT) ndipo imakonzedwa pogwiritsa ntchito njira zodziwika bwino za semiconductor wafering.

Q2. N’chifukwa chiyani 4H-SiC imasankhidwa ngati polytype?

A:
4H-SiC imapereka kuphatikiza kwabwino kwambiri kwakuyenda kwa ma elekitironi ambiri, mpata waukulu, malo owonongeka kwambiri, komanso kutentha kwa mpweyapakati pa mitundu ya SiC yofunikira pa malonda. Ndi mtundu waukulu wa polytype womwe umagwiritsidwa ntchitozipangizo za SiC zokhala ndi magetsi amphamvu komanso amphamvu kwambiri, monga ma MOSFET ndi ma Schottky diode.

Q3. Kodi ubwino wosintha kuchokera ku ma substrates a SiC a mainchesi 8 kupita ku 12 mainchesi ndi wotani?

A:
Wafer ya SiC ya mainchesi 12 imapereka:

Chofunika kwambirimalo akuluakulu ogwiritsidwa ntchito
Kutulutsa kwakukulu kwa die pa wafer imodzi
Chiŵerengero chotsika cha m'mphepete-kutayika
Kugwirizana bwino ndimizere yopangira semiconductor yapamwamba ya mainchesi 12

Zinthu izi zimathandiza mwachindunji kumtengo wotsika pa chipangizo chilichonsekomanso kupanga bwino kwambiri.

Zambiri zaife

XKH imagwira ntchito kwambiri pakupanga, kupanga, ndi kugulitsa magalasi apadera a kuwala ndi zinthu zatsopano zamakristalo. Zogulitsa zathu zimapereka zinthu zamagetsi, zamagetsi, ndi zankhondo. Timapereka zinthu za Sapphire optical, zophimba ma lens a foni yam'manja, Ceramics, LT, Silicon Carbide SIC, Quartz, ndi ma crystal wafers a semiconductor. Ndi ukatswiri waluso komanso zida zamakono, timachita bwino kwambiri pokonza zinthu zosakhazikika, cholinga chathu ndi kukhala kampani yotsogola kwambiri yaukadaulo wamagetsi.