Zida Zokulira za Sapphire Ingot Czochralski CZ Njira Yopangira Ma Wafers a Sapphire a 2inch-12inch

Zida Zokulira za Sapphire Ingot Czochralski CZ Njira Yopangira Ma Wafer a Sapphire a 2inch-12inch Chithunzi Chowonetsedwa

Kufotokozera Kwachidule:

Zipangizo Zokulira za Sapphire Ingot (Czochralski Method)ndi njira yamakono yopangidwira kukula kwa safiro imodzi yokhala ndi kristalo yoyera kwambiri komanso yopanda chilema chilichonse. Njira ya Czochralski (CZ) imalola kuwongolera molondola liwiro lokoka makristalo a mbewu (0.5–5 mm/h), liwiro lozungulira (5–30 rpm), ndi kutentha kwa gradients mu iridium crucible, ndikupanga makristalo olingana mpaka mainchesi 300 (300 mm) m'mimba mwake. Zipangizozi zimathandizira kuwongolera kwa C/A-plane crystal orientation, zomwe zimathandiza kukula kwa optical-grade, electronic-grade, ndi doped safiro (monga Cr³⁺ ruby, Ti³⁺ star safiro).

XKH imapereka njira zothetsera mavuto osiyanasiyana, kuphatikizapo kusintha kwa zida (kupanga ma wafer a mainchesi 2–12), kukonza njira (defect deficit <100/cm²), ndi maphunziro aukadaulo, ndi kutulutsa ma wafer okwana 5,000+ pamwezi pazinthu monga ma LED substrates, GaN epitaxy, ndi ma semiconductor packaging.

Tumizani imelo kwa ife

Mawonekedwe

Mfundo Yogwirira Ntchito

Njira ya CZ imagwira ntchito m'njira zotsatirazi:
1. Kusungunula Zipangizo Zapadera: Al₂O₃ (kuyera >99.999%) imasungunuka mu iridium crucible pa 2050–2100°C.
2. Chiyambi cha Kristalo wa Mbeu: Kristalo wa mbewu amatsitsidwa mu kusungunuka, kenako n’kukoka mofulumira kuti apange khosi (m’mimba mwake <1 mm) kuti athetse kusokonekera.
3. Kupanga Mapewa ndi Kukula Kwambiri: Liwiro lokoka limachepetsedwa kufika pa 0.2–1 mm/h, pang'onopang'ono kukula kwa kristalo m'mimba mwake kufika pa kukula kwa cholinga (monga mainchesi 4–12).
4. Kuzimitsa ndi Kuziziritsa: Khiristo imaziziritsidwa pa 0.1–0.5°C/min kuti ichepetse kusweka komwe kumabwera chifukwa cha kutentha.
5. Mitundu Yogwirizana ya Makristalo:
Kalasi yamagetsi: Ma substrates a semiconductor (TTV <5 μm)
Giredi Yowunikira: Mawindo a laser a UV (ma transmittance >90%@200 nm)
Mitundu Yopangidwa ndi Doped: Ruby (Cr³⁺ concentration 0.01–0.5 wt.%), chubu cha buluu cha safiro

Zigawo Zapakati pa Dongosolo

1. Dongosolo Losungunula
Iridium Crucible: Yolimba ku 2300°C, yosagwira dzimbiri, yogwirizana ndi kusungunuka kwakukulu (100–400 kg).
Furnace Yotenthetsera Yoyambitsa: Kuwongolera kutentha kodziyimira pawokha m'malo ambiri (± 0.5°C), kusintha kwa kutentha koyenera.

2. Dongosolo Lokoka ndi Kuzungulira
Mota ya Servo Yolondola Kwambiri: Kukweza mphamvu 0.01 mm/h, kuzungulira kwa concentricity <0.01 mm.
Chisindikizo cha Magnetic Fluid: Kutumiza kosakhudzana ndi kukula kosalekeza (> maola 72).

3. Dongosolo Lowongolera Kutentha
Kulamulira kwa PID Closed-Loop: Kusintha kwa mphamvu nthawi yeniyeni (50–200 kW) kuti kukhazikitse mphamvu ya kutentha.
Chitetezo cha Mpweya Wopanda Mphamvu: Kusakaniza kwa Ar/N₂ (kuyera kwa 99.999%) kuti tipewe kukhuthala.

4. Kudziyendetsa ndi Kuwunika
Kuwunika kwa M'mimba mwa CCD: Ndemanga yeniyeni (kulondola ± 0.01 mm).
Thermography ya infrared: Imayang'anira mawonekedwe a mawonekedwe olimba ndi amadzimadzi.

Kuyerekeza Njira ya CZ ndi KY

Paramita	Njira ya CZ	Njira ya KY
Kukula kwa Crystal Kwambiri	Mainchesi 12 (300 mm)	400 mm (ingot yooneka ngati peyala)
Kuchuluka kwa Zolakwika	<100/cm²	<50/cm²
Chiŵerengero cha Kukula	0.5–5 mm/h	0.1–2 mm/h
Kugwiritsa Ntchito Mphamvu	50–80 kWh/kg	80–120 kWh/kg
Mapulogalamu	Ma substrates a LED, GaN epitaxy	Mawindo owoneka bwino, ma ingot akuluakulu
Mtengo	Ndalama zocheperako (ndalama zambiri zogulira zida)	Njira yayikulu (yovuta)

Mapulogalamu Ofunika

1. Makampani Opanga Makontrakitala
Ma Substrate a GaN Epitaxial: Ma wafer a mainchesi 2–8 (TTV <10 μm) a ma Micro-LED ndi ma laser diode.
Ma Wafer a SOI: Kukhwima kwa pamwamba <0.2 nm kwa ma chips ophatikizidwa ndi 3D.

2. Zipangizo zamagetsi
Mawindo a Laser a UV: Osagonja ku mphamvu ya 200 W/cm² ya lithography optics.
Zigawo za Infrared: Kuchuluka kwa kuyamwa <10⁻³ cm⁻¹ pojambula zithunzi za kutentha.

3. Zamagetsi Zamagetsi Zogwiritsa Ntchito
Zophimba Kamera ya Foni Yam'manja: Kulimba kwa Mohs 9, 10 × kukana kukanda bwino.
Ma Smartwatch Displays: Kukhuthala 0.3–0.5 mm, transmittance >92%.

4. Chitetezo ndi Ndege
Mawindo a Nuclear Reactor: Kupirira kwa kuwala kwa dzuwa mpaka 10¹⁶ n/cm².
Magalasi a Laser Amphamvu Kwambiri: Kusintha kwa kutentha <λ/20@1064 nm.

Ntchito za XKH

1. Kusintha kwa Zida
Kapangidwe ka Chipinda Chokulirapo: Makonzedwe a Φ200–400 mm opangira wafer wa mainchesi 2–12.
Kusinthasintha kwa Doping: Kumathandizira doping ya rare-earth (Er/Yb) ndi transition-metal (Ti/Cr) kuti igwiritsidwe ntchito popanga zinthu za optoelectronic.

2. Thandizo Lochokera Kumapeto
Kukonza Njira: Maphikidwe otsimikiziridwa kale (50+) a zipangizo za LED, RF, ndi zida zoumitsidwa ndi kuwala kwa dzuwa.
Global Service Network: Kuzindikira matenda patali maola 24 pa tsiku, masiku 7 pa sabata komanso kukonza komwe kuli pamalopo ndi chitsimikizo cha miyezi 24.

3. Kukonza Pansi
Kupanga Wafer: Kuduladula, kupukuta, ndi kupukuta ma wafer a mainchesi 2–12 (C/A-plane).
Zogulitsa Zowonjezera Mtengo:
Zopangira Kuwala: Mawindo a UV/IR (0.5–50 mm makulidwe).
Zipangizo Zodzikongoletsera Zapamwamba: Cr³⁺ ruby (yovomerezedwa ndi GIA), Ti³⁺ nyenyezi ya safiro.

4. Utsogoleri waukadaulo
Zitsimikizo: Ma wafer otsatira EMI.
Ma Patent: Ma Patent Aakulu mu Njira Yatsopano ya CZ.

Mapeto

Zipangizo za CZ method zimapereka kugwirizana kwakukulu, kuchuluka kwa zilema zochepa, komanso kukhazikika kwa ntchito, zomwe zimapangitsa kuti zikhale muyezo wa makampani a LED, semiconductor, ndi chitetezo. XKH imapereka chithandizo chokwanira kuyambira pakuyika zida mpaka kukonza pambuyo pa kukula, zomwe zimathandiza makasitomala kupanga makristalo a safiro osawononga ndalama zambiri komanso ogwira ntchito bwino.