Ubwino waKudzera mu Glass Via (TGV)ndipo njira zogwiritsira ntchito Through Silicon Via(TSV) pa TGV makamaka ndi izi:
(1) makhalidwe abwino kwambiri amagetsi okhala ndi ma frequency apamwamba. Zipangizo zagalasi ndi zinthu zotetezera kutentha, chokhazikika cha dielectric chili pafupifupi 1/3 yokha ya zinthu za silicon, ndipo chinthu chotayika ndi chotsika ndi 2-3 kuposa zinthu za silicon, zomwe zimapangitsa kuti kutayika kwa substrate ndi zotsatira za parasitic zichepe kwambiri ndikuwonetsetsa kuti chizindikiro chotumizidwacho chikhale cholimba;
(2)chachikulu komanso galasi lopyapyala kwambiriNdi kosavuta kupeza. Corning, Asahi ndi SCHOTT ndi opanga magalasi ena amatha kupereka magalasi akuluakulu kwambiri (>2m × 2m) komanso opyapyala kwambiri (<50µm) ndi magalasi osinthasintha opyapyala kwambiri.
3) Mtengo wotsika. Kupeza mosavuta galasi lalikulu lopyapyala kwambiri, ndipo sikufuna kuti pakhale zigawo zotetezera kutentha, mtengo wopangira mbale ya adapter yagalasi ndi pafupifupi 1/8 yokha ya mbale ya adapter yochokera ku silicon;
4) Njira yosavuta. Palibe chifukwa choyika chotetezera kutentha pamwamba pa substrate ndi khoma lamkati la TGV, ndipo palibe kupukuta komwe kumafunika mu mbale yopyapyala kwambiri ya adaputala;
(5) Kukhazikika kwamphamvu kwa makina. Ngakhale makulidwe a mbale ya adaputala ali ochepera 100µm, tsamba lakuthwa likadali laling'ono;
(6) Ntchito zambiri, ndi ukadaulo wolumikizana wautali womwe ukugwiritsidwa ntchito m'munda wa ma CD a wafer-level, kuti ukwaniritse mtunda waufupi kwambiri pakati pa wafer-wafer, kutsika kochepa kwa ma connection kumapereka njira yatsopano yaukadaulo, yokhala ndi mphamvu zamagetsi, kutentha, makina abwino kwambiri, mu RF chip, masensa apamwamba a MEMS, kuphatikiza kwa makina apamwamba komanso madera ena okhala ndi zabwino zapadera, ndi mbadwo wotsatira wa 5G, 6G high-frequency chip 3D Ndi imodzi mwazosankha zoyambirira za ma CD a 3D a 5G ndi 6G high-frequency chips a m'badwo wotsatira.
Njira yopangira TGV imaphatikizapo kuphulika kwa mchenga, kuboola kwa ultrasonic, kunyowa, kunyowa kwa ion yozama, kunyowa kwa kuwala kwa dzuwa, kunyowa kwa laser, kunyowa kwakuya komwe kumachitika chifukwa cha laser, komanso kupanga mabowo otulutsa madzi molunjika.
Zotsatira za kafukufuku waposachedwa ndi chitukuko zikusonyeza kuti ukadaulowu ukhoza kukonzekera kudzera m'mabowo ndi mabowo osawoneka a 5:1 okhala ndi chiŵerengero cha kuya ndi m'lifupi cha 20:1, ndipo uli ndi mawonekedwe abwino. Kuboola kwakuya kochitidwa ndi laser, komwe kumabweretsa kukhwima pang'ono pamwamba, ndiyo njira yomwe yaphunziridwa kwambiri pakadali pano. Monga momwe zasonyezedwera pa Chithunzi 1, pali ming'alu yoonekeratu yozungulira kuboola kwa laser wamba, pomwe makoma ozungulira ndi am'mbali a kuboola kwakuya kochitidwa ndi laser ndi oyera komanso osalala.
Njira yogwiritsira ntchitoTGVCholumikizira chawonetsedwa pa Chithunzi 2. Ndondomeko yonse ndikuboola mabowo pa galasi, kenako ndikuyika chotchinga ndi gawo la mbewu pakhoma ndi pamwamba. Chotchinga chimaletsa kufalikira kwa Cu ku gawo la galasi, pomwe kuwonjezera kumamatira kwa awiriwa, ndithudi, mu maphunziro ena adapezanso kuti gawo lotchinga silofunikira. Kenako Cu imayikidwa ndi electroplating, kenako annealed, ndipo gawo la Cu limachotsedwa ndi CMP. Pomaliza, gawo lobwezeretsanso la RDL limakonzedwa ndi PVD coating lithography, ndipo gawo losasinthika limapangidwa guluu litachotsedwa.
(a) Kukonzekera wafer, (b) kupanga TGV, (c) electroplating yokhala ndi mbali ziwiri - kuyika mkuwa, (d) kupukuta ndi kupukuta kwa mankhwala a CMP, kuchotsa pamwamba pa mkuwa, (e) PVD coating ndi lithography, (f) kuyika kwa RDL rewiring layer, (g) degluing ndi Cu/Ti etching, (h) kupanga passivation layer.
Powombetsa mkota,galasi kudzera m'bowo (TGV)Kuthekera kwa kugwiritsa ntchito ndi kwakukulu, ndipo msika wamakono wamkati ukukwera, kuyambira zida mpaka kapangidwe ka zinthu ndi kuchuluka kwa kafukufuku ndi chitukuko kuli kokwera kuposa avareji yapadziko lonse lapansi.
Ngati pali kuphwanya malamulo, funsani kuti muchotse
Nthawi yotumizira: Julayi-16-2024