TSMC Yatseka Silicon Carbide ya mainchesi 12 ya New Frontier, Kuyika Kwanzeru mu Zipangizo Zofunikira Zoyendetsera Kutentha kwa AI Era​

Zamkatimu

1. Kusintha kwa Ukadaulo: Kukwera kwa Silicon Carbide ndi Mavuto Ake​

2. Kusintha kwa Strategic kwa TSMC: Kutuluka mu GaN ndi Kubetcha pa SiC

3. Mpikisano wa Zinthu: Kusasinthika kwa SiC​

4. Zochitika Zogwiritsira Ntchito: Kusintha kwa Kusamalira Kutentha mu Ma Chips a AI ndi Zamagetsi Zam'badwo Wotsatira​​

5. Mavuto Amtsogolo: Zopinga Zaukadaulo ndi Mpikisano Wamakampani​

Malinga ndi TechNews, makampani opanga ma semiconductor padziko lonse lapansi alowa munthawi yoyendetsedwa ndi luntha lochita kupanga (AI) ndi makompyuta ogwira ntchito bwino (HPC), komwe kasamalidwe ka kutentha kwawonekera ngati vuto lalikulu lomwe limakhudza kapangidwe ka ma chip ndi kupita patsogolo kwa njira. Pamene mapangidwe apamwamba a ma CD monga 3D stacking ndi 2.5D integration akupitiliza kuwonjezera kuchuluka kwa ma chip ndi kugwiritsa ntchito mphamvu, ma ceramic substrates achikhalidwe sangathenso kukwaniritsa zosowa za kutentha. TSMC, kampani yotsogola kwambiri padziko lonse lapansi yopanga ma wafer foundry, ikuyankha vutoli ndi kusintha kwakukulu kwa zinthu: kukumbatira kwathunthu ma substrates a 12-inch single-crystal silicon carbide (SiC) pomwe pang'onopang'ono ikutuluka mu bizinesi ya gallium nitride (GaN). Kusunthaku sikungotanthauza kukonzanso njira ya TSMC komanso kukuwonetsa momwe kasamalidwe ka kutentha kasinthira kuchoka pa "ukadaulo wothandizira" kupita ku "ubwino wopikisana nawo."

Silicon Carbide: Kupitilira Mphamvu Zamagetsi

Silicon carbide, yotchuka chifukwa cha mphamvu zake zazikulu za bandgap semiconductor, yakhala ikugwiritsidwa ntchito pamagetsi amphamvu kwambiri monga ma inverter amagetsi, zowongolera zamagalimoto zamafakitale, ndi zomangamanga zamagetsi zongowonjezwdwanso. Komabe, mphamvu ya SiC imapitirira patali. Ndi kutentha kwapadera kwa pafupifupi 500 W/mK—kuposa kwambiri zinthu wamba zadothi monga aluminum oxide (Al₂O₃) kapena safiro—SiC tsopano yakonzeka kuthana ndi mavuto omwe akuchulukirachulukira a kutentha kwa ntchito zapamwamba.

Zothandizira AI ndi Vuto la Kutentha

Kuchuluka kwa ma accelerator a AI, ma processor a data center, ndi magalasi anzeru a AR kwawonjezera zoletsa za malo ndi zovuta zoyendetsera kutentha. Mwachitsanzo, muzipangizo zovalidwa, zigawo za microchip zomwe zili pafupi ndi maso zimafuna kuwongolera kutentha moyenera kuti zitsimikizire chitetezo ndi kukhazikika. Pogwiritsa ntchito zaka zambiri zaukadaulo wake popanga ma wafer a mainchesi 12, TSMC ikupititsa patsogolo zinthu zazikulu za SiC kuti zilowe m'malo mwa zoumba zachikhalidwe. Njirayi imalola kuphatikizana bwino m'mizere yopangira yomwe ilipo, kulinganiza phindu ndi mtengo popanda kufunikira kukonzanso kwathunthu.

Mavuto aukadaulo ndi zatsopanopa

paUdindo wa SiC mu Kupaka Patsogolo

• Kuphatikiza kwa 2.5D​​:Ma chips amaikidwa pa silicon kapena organic interposer okhala ndi njira zazifupi komanso zogwira mtima zolumikizirana. Mavuto otaya kutentha pano makamaka amakhala opingasa.
• Kuphatikiza kwa 3D:Zidutswa zolumikizidwa molunjika kudzera mu ma through-silicon vias (TSVs) kapena hybrid bonding zimakhala ndi kuchuluka kwakukulu kwa ma connection koma zimakumana ndi kupsinjika kwa kutentha kwa exponential. SiC sikuti imangokhala ngati chinthu chotenthetsera chokha komanso imagwirizana ndi njira zamakono monga diamondi kapena chitsulo chamadzimadzi kuti ipange machitidwe a "hybrid cooling".

paKutuluka Mwachangu kuchokera ku GaN

Kupitirira Magalimoto: Malire Atsopano a SiC

• SiC ya mtundu wa N woyendetsa:Imagwira ntchito ngati zofalitsira kutentha mu ma accelerator a AI ndi ma processor ogwira ntchito kwambiri.
• SiC yoteteza:Amagwira ntchito ngati zolumikizira zamagetsi mu mapangidwe a chiplet, kulinganiza kusiyanitsa magetsi ndi kutentha.

Zatsopanozi zikuika SiC ngati maziko oyendetsera kutentha mu AI ndi ma data center chips.

​​​​​Malo Opangira Zinthu