M'ndandanda wazopezekamo
1. Kutaya Kutentha mu AI Chips ndi Kupambana kwa Zinthu za Silicon Carbide
2. Makhalidwe ndi Ubwino Waukadaulo wa Silicon Carbide Substrates
3. Mapulani Anzeru ndi Chitukuko Chogwirizana ndi NVIDIA ndi TSMC
4.Njira Yogwiritsira Ntchito ndi Mavuto Ofunika Kwambiri Aukadaulo
5.Ziyembekezo za Msika ndi Kukula kwa Mphamvu
6. Zotsatira pa Unyolo Wopereka ndi Magwiridwe Abwino a Makampani Ogwirizana
7.Magwiritsidwe Osiyanasiyana ndi Kukula Kwathunthu kwa Msika wa Silicon Carbide
8.Mayankho Opangidwa Mwamakonda a XKH ndi Chithandizo cha Zogulitsa
Bowo la kutentha kwa ma chips a AI amtsogolo likugonjetsedwa ndi zinthu za silicon carbide (SiC) substrate.
Malinga ndi malipoti a atolankhani akunja, NVIDIA ikukonzekera kusintha zinthu zapakati pa substrate mu njira yopangira ma processor a CoWoS a mbadwo wotsatira ndi silicon carbide. TSMC yapempha opanga akuluakulu kuti agwirizane kupanga ukadaulo wopanga ma substrate apakati a SiC.
Chifukwa chachikulu ndichakuti kusintha kwa magwiridwe antchito a ma chips a AI omwe alipo pano kwakumana ndi zofooka zakuthupi. Pamene mphamvu ya GPU ikukwera, kuphatikiza ma chips angapo mu ma silicon interposer kumabweretsa kufunikira kwakukulu kwa kutentha. Kutentha komwe kumapangidwa mkati mwa ma chips kukuyandikira malire ake, ndipo ma silicon interposer achikhalidwe sangathe kuthana ndi vutoli bwino.
Ma Processor a NVIDIA Asintha Zipangizo Zoyeretsera Kutentha! Kufunika kwa Silicon Carbide Substrate Kuphulika!Silicon carbide ndi semiconductor yosiyana kwambiri, ndipo mawonekedwe ake apadera amapatsa ubwino waukulu m'malo ovuta kwambiri okhala ndi mphamvu zambiri komanso kutentha kwambiri. Mu phukusi lapamwamba la GPU, limapereka zabwino ziwiri zazikulu:
1. Kutha Kutaya Kutentha: Kusintha ma interposer a silicon ndi ma interposer a SiC kungachepetse kukana kutentha ndi pafupifupi 70%.
2. Kapangidwe ka Mphamvu Kogwira Ntchito: SiC imalola kupanga ma module owongolera magetsi ogwirira ntchito bwino komanso ang'onoang'ono, kufupikitsa kwambiri njira zotumizira magetsi, kuchepetsa kutayika kwa ma circuit, ndikupereka mayankho achangu komanso okhazikika amagetsi a AI computing loads.
Kusinthaku cholinga chake ndi kuthana ndi mavuto owononga kutentha omwe amayambitsidwa ndi kukulitsa mphamvu ya GPU nthawi zonse, kupereka yankho lothandiza kwambiri pa ma chips apakompyuta ogwira ntchito bwino.
Mphamvu ya kutentha ya silicon carbide ndi yapamwamba kwambiri kuwirikiza kawiri kapena katatu kuposa ya silicon, zomwe zimapangitsa kuti kuyendetsa bwino kutentha kuyende bwino komanso kuthetsa mavuto otaya kutentha m'ma chip amphamvu kwambiri. Kugwira ntchito kwake bwino kwambiri kwa kutentha kumatha kuchepetsa kutentha kwa ma chip a GPU ndi 20-30°C, zomwe zimapangitsa kuti kukhazikika kukhale kolimba kwambiri m'makompyuta amphamvu.
Njira Yogwiritsira Ntchito ndi Mavuto
Malinga ndi magwero a unyolo wogulira, NVIDIA ichita izi m'magawo awiri:
•2025-2026: Rubin GPU ya m'badwo woyamba idzagwiritsabe ntchito ma silicon interposer. TSMC yapempha opanga akuluakulu kuti agwirizane kupanga ukadaulo wopanga ma SiC interposer.
•2027: Ma interposer a SiC adzaphatikizidwa mwalamulo mu njira yapamwamba yopangira ma CD.
Komabe, dongosololi likukumana ndi mavuto ambiri, makamaka pakupanga zinthu. Kuuma kwa silicon carbide kumafanana ndi kwa diamondi, komwe kumafuna ukadaulo wodula kwambiri. Ngati ukadaulo wodula suli wokwanira, pamwamba pa SiC pakhoza kukhala ngati mafunde, zomwe zimapangitsa kuti isagwiritsidwe ntchito popangira zinthu zapamwamba. Opanga zida monga DISCO yaku Japan akugwira ntchito yopanga zida zatsopano zodulira laser kuti athetse vutoli.
Ziyembekezo za M'tsogolo
Pakadali pano, ukadaulo wa SiC interposer udzayamba kugwiritsidwa ntchito mu ma chip apamwamba kwambiri a AI. TSMC ikukonzekera kuyambitsa CoWoS ya 7x reticle mu 2027 kuti iphatikize ma processor ndi memory ambiri, ndikuwonjezera malo a interposer kufika pa 14,400 mm², zomwe zipangitsa kuti pakhale kufunikira kwakukulu kwa ma substrates.
Morgan Stanley akuneneratu kuti kuchuluka kwa ma CD a CoWoS pamwezi padziko lonse lapansi kudzakwera kuchoka pa ma wafer 38,000 a mainchesi 12 mu 2024 kufika pa 83,000 mu 2025 ndi 112,000 mu 2026. Kukula kumeneku kudzawonjezera kufunikira kwa ma interposer a SiC.
Ngakhale kuti ma substrates a SiC a mainchesi 12 ndi okwera mtengo pakadali pano, mitengo ikuyembekezeka kutsika pang'onopang'ono kufika pamlingo woyenera pamene kupanga zinthu zambiri kukukwera ndipo ukadaulo ukukhwima, zomwe zimapangitsa kuti ntchito zazikulu zigwiritsidwe ntchito.
Ma interposer a SiC samangothetsa mavuto otaya kutentha kokha komanso amawonjezera kwambiri kuchulukana kwa ma integration. Dera la ma substrates a SiC a mainchesi 12 ndi lalikulu pafupifupi 90% kuposa la ma substrates a mainchesi 8, zomwe zimathandiza kuti interposer imodzi iphatikize ma module ambiri a Chiplet, zomwe zimathandiza mwachindunji zofunikira za NVIDIA's 7x reticle CoWoS packaging.
TSMC ikugwirizana ndi makampani aku Japan monga DISCO kuti apange ukadaulo wopanga ma interposer a SiC. Zipangizo zatsopano zikangoyamba kugwiritsidwa ntchito, kupanga ma interposer a SiC kudzayenda bwino, ndipo kuyika koyamba mu ma phukusi apamwamba kukuyembekezeka mu 2027.
Chifukwa cha nkhaniyi, masheya okhudzana ndi SiC adachita bwino kwambiri pa Seputembala 5, ndipo index idakwera ndi 5.76%. Makampani monga Tianyue Advanced, Luxshare Precision, ndi Tiantong Co. adafika pamlingo wokwera tsiku lililonse, pomwe Jingsheng Mechanical & Electrical ndi Yintang Intelligent Control adakwera ndi 10%.
Malinga ndi Daily Economic News, kuti apititse patsogolo magwiridwe antchito, NVIDIA ikukonzekera kusintha zinthu zomwe zili mkati mwa njira yopangira zinthu za CoWoS ndi silicon carbide mu pulani yake yatsopano yopangira purosesa ya Rubin.
Chidziwitso cha anthu onse chikuwonetsa kuti silicon carbide ili ndi zinthu zabwino kwambiri. Poyerekeza ndi zipangizo za silicon, zipangizo za SiC zimapereka ubwino monga mphamvu zambiri, kutayika kwa mphamvu zochepa, komanso kukhazikika kwa kutentha kwambiri. Malinga ndi Tianfeng Securities, unyolo wa makampani a SiC pamwamba umaphatikizapo kukonzekera zinthu za SiC ndi ma wafers a epitaxial; pakati pake pamakhala kapangidwe, kupanga, ndi kulongedza/kuyesa zipangizo za SiC ndi zipangizo za RF.
Pansi pake, ntchito za SiC ndi zambiri, zomwe zikuphatikizapo mafakitale opitilira khumi, kuphatikizapo magalimoto atsopano amphamvu, ma photovoltaic, kupanga mafakitale, mayendedwe, malo olumikizirana, ndi radar. Pakati pa izi, magalimoto adzakhala malo ofunikira kwambiri a SiC. Malinga ndi Aijian Securities, pofika chaka cha 2028, gawo la magalimoto lidzakhala ndi 74% ya msika wapadziko lonse wa zida zamagetsi za SiC.
Ponena za kukula kwa msika wonse, malinga ndi Yole Intelligence, kukula kwa msika wapadziko lonse wa SiC substrate woyendetsa ndi woteteza pang'ono kunali 512 miliyoni ndi 242 miliyoni, motsatana, mu 2022. Akuyembekezeka kuti pofika chaka cha 2026, kukula kwa msika wa SiC padziko lonse kudzafika 2.053 biliyoni, ndi kukula kwa msika wa SiC substrate woyendetsa ndi woteteza pang'ono kufika 1.62 biliyoni ndi $433 miliyoni, motsatana. Chiwerengero cha kukula kwa pachaka (CAGRs) cha ma substrate a SiC oyendetsa ndi oteteza pang'ono kuyambira 2022 mpaka 2026 chikuyembekezeka kukhala 33.37% ndi 15.66%, motsatana.
XKH Yapadera pa Kupanga Kwapadera ndi Kugulitsa Padziko Lonse kwa Zinthu za Silicon Carbide (SiC), zomwe zimapereka kukula konse kwa mainchesi 2 mpaka 12 pa zinthu zonse za silicon carbide zoyendetsa komanso zoteteza kutentha. Timathandizira kusintha kwapadera kwa magawo monga kristalo, resistivity (10⁻³–10¹⁰ Ω·cm), ndi makulidwe (350–2000μm). Zogulitsa zathu zimagwiritsidwa ntchito kwambiri m'magawo apamwamba kuphatikiza magalimoto atsopano amphamvu, ma inverter a photovoltaic, ndi ma industrial motors. Pogwiritsa ntchito njira yolimba yoperekera zinthu ndi gulu lothandizira ukadaulo, timaonetsetsa kuti makasitomala ayankha mwachangu komanso molondola, kuthandiza makasitomala kukulitsa magwiridwe antchito a chipangizocho ndikukonza ndalama zomwe amagwiritsa ntchito.
Nthawi yotumizira: Sep-12-2025