Kodi tingachepetse bwanji wafer kuti ikhale "yopyapyala kwambiri"?

Kodi tingachepetse bwanji wafer kuti ikhale "yopyapyala kwambiri"?
Kodi wafer woonda kwambiri ndi chiyani kwenikweni?

Makulidwe wamba (8″/12″ ma wafer mwachitsanzo)

• Wafa wamba:600–775 μm

• Wafa woonda:150–200 μm

• Wafer woonda kwambiri:pansi pa 100 μm

• Wafer woonda kwambiri:50 μm, 30 μm, kapena ngakhale 10–20 μm

Nchifukwa chiyani ma wafers akuchepa thupi?

• Chepetsani makulidwe onse a phukusi, fupikitsani kutalika kwa TSV, ndikuchepetsa kuchedwa kwa RC

• Chepetsani kukana kutentha ndipo thandizani kuti kutentha kusatuluke

• Kukwaniritsa zofunikira pa zinthu zomaliza chifukwa cha mawonekedwe owonda kwambiri

Zoopsa zazikulu za ma wafers owonda kwambiri

1. Mphamvu ya makina imachepa kwambiri

2. Kuukira koopsa

3. Kusamalira ndi mayendedwe ovuta

4. Nyumba zakutsogolo zimakhala zotetezeka kwambiri; ma wafer amatha kusweka/kusweka mosavuta

Kodi tingachepetse bwanji wafer kuti ikhale yopyapyala kwambiri?

1. DBG (Kudula Usanapule)
   Dulani pang'ono wafer (popanda kudula mbali zonse) kuti die iliyonse ikhale yodziwikiratu pomwe wafer imakhala yolumikizidwa ndi makina kuchokera kumbuyo. Kenako pukutani wafer kuchokera kumbuyo kuti muchepetse makulidwe, pang'onopang'ono kuchotsa silicon yotsalayo yosadulidwa. Pomaliza pake, wosanjikiza womaliza wa silicon umaphwanyidwa, ndikumaliza kusungunuka.

2. Njira ya Taiko
   Chepetsani gawo lapakati la wafer pokhapokha pamene m'mphepete mwake muli ndi makulidwe. Mzere wokhuthala umapereka chithandizo chamakina, zomwe zimathandiza kuchepetsa kupotoka ndi chiopsezo chogwira ntchito.

3. Kumangirira kwakanthawi kwa wafer
   Kumangirira kwakanthawi kumalumikiza wafer pachonyamulira kwakanthawi, kusandutsa chikwama chofewa kwambiri, chonga filimu kukhala chipangizo cholimba komanso chotheka kuchikonza. Chonyamuliracho chimathandizira chikwamacho, chimateteza nyumba zakutsogolo, komanso chimachepetsa kupsinjika kwa kutentha—kupangitsa kuti chichepetsemakumi a ma micronspamene ikulolabe njira zamphamvu monga kupanga TSV, electroplating, ndi bonding. Ndi imodzi mwa njira zofunika kwambiri zothandizira ma phukusi amakono a 3D.