Makina Osewerera Daimondi Amitundu Iwiri a Zida Zosalimba za SiC Sapphire

Makina Odulira Daimondi Amitundu Iwiri a SiC Sapphire Ultra-Hard Brittle Materials Chithunzi Chowonetsedwa

Kufotokozera Kwachidule:

Makina odulira diamondi okhala ndi waya wambiri ndi njira yapamwamba kwambiri yodulira diamondi yomwe idapangidwa kuti igwiritsidwe ntchito pokonza zinthu zolimba komanso zosweka. Pogwiritsa ntchito mawaya ambiri okhala ndi diamondi, makinawo amatha kudula ma wafer angapo nthawi imodzi, zomwe zimapangitsa kuti ntchito ikhale yolimba komanso yolondola kwambiri.

Tumizani imelo kwa ife

Mawonekedwe

Chiyambi cha Makina Osewerera Daimondi Amitundu Iwiri

Makina odulira diamondi okhala ndi waya wambiri ndi njira yapamwamba kwambiri yodulira yomwe idapangidwira kukonza zinthu zolimba kwambiri komanso zosweka. Pogwiritsa ntchito mawaya ambiri okhala ndi diamondi ofanana, makinawo amatha kudula ma wafer angapo nthawi imodzi, zomwe zimapangitsa kuti pakhale kufalikira kwakukulu komanso kulondola. Ukadaulo uwu wakhala chida chofunikira kwambiri m'mafakitale monga ma semiconductors, ma solar photovoltaics, ma LED, ndi ma ceramics apamwamba, makamaka pazinthu monga SiC, safiro, GaN, quartz, ndi alumina.

Poyerekeza ndi kudula kwa waya umodzi wamba, kasinthidwe ka waya wambiri kamapereka magawo ambiri mpaka mazana ambiri pa gulu lililonse, zomwe zimachepetsa kwambiri nthawi yozungulira pomwe zimasunga kusalala bwino (Ra < 0.5 μm) ndi kulondola kwa miyeso (± 0.02 mm). Kapangidwe kake ka modular kamaphatikiza kukanikiza kwa waya wokha, machitidwe ogwirira ntchito, ndi kuyang'anira pa intaneti, kuonetsetsa kuti kupanga kumachitika nthawi yayitali, kokhazikika, komanso kodziyimira pawokha.

Magawo aukadaulo a Makina Osewerera Daimondi Ambiri

Chinthu	Kufotokozera	Chinthu	Kufotokozera
Kukula kwakukulu kwa ntchito (Sikweya)	220 × 200 × 350 mm	Galimoto yoyendetsa	17.8 kW × 2
Kukula kwakukulu kwa ntchito (Yozungulira)	Φ205 × 350 mm	Injini yoyendetsa waya	11.86 kW × 2
Kutalikirana kwa spindle	Φ250 ±10 × 370 × 2 axis (mm)	Injini yokweza patebulo logwirira ntchito	2.42 kW × 1
Mzere waukulu	650 mm	Mota yozungulira	0.8 kW × 1
Liwiro la waya	1500 m/mphindi	Makonzedwe a mota	0.45 kW × 2
Waya m'mimba mwake	Φ0.12–0.25 mm	Galimoto yokakamiza	4.15 kW × 2
Liwiro lokwezera	225 mm/mphindi	Galimoto yodzaza ndi matope	7.5 kW × 1
Kuzungulira tebulo kwambiri	±12°	Kuchuluka kwa thanki ya slurry	300 L
Ngodya yozungulira	±3°	Kuyenda kwa choziziritsira	200 L/mphindi
Kuthamanga kwafupipafupi	~nthawi 30/mphindi	Kulondola kwa kutentha	±2 °C
Chiŵerengero cha chakudya	0.01–9.99 mm/mphindi	Magetsi	335+210 (mm²)
Mtengo wa waya wodyetsa	0.01–300 mm/mphindi	Mpweya wopanikizika	0.4–0.6 MPa
Kukula kwa makina	3550 × 2200 × 3000 mm	Kulemera	makilogalamu 13,500

Njira Yogwirira Ntchito ya Makina Osewerera Daimondi Amitundu Iwiri

Kuyenda kwa Mawaya Ambiri
Mawaya angapo a diamondi amayenda pa liwiro logwirizana mpaka 1500 m/mphindi. Ma pulley owongolera bwino komanso kulamulira kwa mphamvu yotsekedwa (15–130 N) kumasunga mawayawo mokhazikika, kuchepetsa mwayi woti apatuke kapena kusweka.
Kudyetsa ndi Kuyika Malo Molondola
Malo oyendetsedwa ndi servo amakwaniritsa kulondola kwa ±0.005 mm. Kulinganiza kosankha kwa laser kapena kothandizidwa ndi maso kumawonjezera zotsatira za mawonekedwe ovuta.
Kuziziritsa ndi Kuchotsa Zinyalala
Choziziritsira champhamvu chimachotsa tchipisi ndikuziziritsa malo ogwirira ntchito nthawi zonse, kupewa kuwonongeka kwa kutentha. Kusefa kwa magawo ambiri kumawonjezera nthawi yogwira ntchito yoziziritsira ndipo kumachepetsa nthawi yogwira ntchito.
Nsanja Yowongolera Mwanzeru
Ma servo driver oyankha kwambiri (<1 ms) amasintha mwachangu chakudya, mphamvu, ndi liwiro la waya. Kuwongolera njira yophikira pamodzi ndi kusintha kwa parameter kamodzi kokha kumapangitsa kuti pakhale kupanga zinthu zambiri.

Ubwino Waukulu wa Makina Odulira Daimondi Amitundu Iwiri

Kugwira Ntchito Kwambiri
Imatha kudula ma wafer 50–200 pa nthawi iliyonse, ndipo kerf itayika <100 μm, zomwe zimapangitsa kuti zinthu zigwiritsidwe ntchito bwino mpaka 40%. Mphamvu yogwiritsira ntchito ndi 5–10× kuposa ya makina achikhalidwe a waya umodzi.
Kuwongolera Mwanzeru
Kukhazikika kwa waya mkati mwa ±0.5 N kumatsimikizira zotsatira zofanana pa zipangizo zosiyanasiyana zosweka. Kuwunika nthawi yeniyeni pa mawonekedwe a 10" HMI kumathandiza kusunga maphikidwe ndi kugwiritsa ntchito kutali.
Zosinthasintha, Zomangamanga Zokhazikika
Imagwirizana ndi waya wa mainchesi kuyambira 0.12–0.45 mm pa njira zosiyanasiyana zodulira. Kugwiritsa ntchito kwa robotic komwe kungafunike kumalola mizere yopangira yokha.
Kudalirika kwa Magawo a Mafakitale
Mafelemu olemera opangidwa ndi chitsulo/opangidwa ndi chitsulo amachepetsa kusintha kwa kutentha (<0.01 mm). Ma pulley otsogolera okhala ndi zokutira za ceramic kapena carbide amapereka moyo wautumiki wa maola opitilira 8000.

Dongosolo Lodula Ma Dayimondi la Zingwe Zambiri la SiC Sapphire Ultra-Hard Brittle Materials 2

Magawo Ogwiritsira Ntchito Makina Opangira Mawaya Ambiri a Daimondi

Ma semiconductor: Kudula SiC ya ma module amphamvu a EV, magawo a GaN a zida za 5G.
Ma photovoltaic: Chodulira cha silikoni cha liwiro lalikulu chokhala ndi kufanana kwa ±10 μm.
LED ndi Optics: Ma substrates a safiro a epitaxy ndi precision optical elements okhala ndi <20 μm edge chipping.
Zapamwamba za Ceramics: Kukonza alumina, AlN, ndi zinthu zina zofanana ndi zimenezi pa zipangizo zoyendetsera ndege ndi kutentha.

Dongosolo Lodula Ma Dayimondi la Zingwe Zambiri la SiC Sapphire Ultra-Hard Brittle Materials 3

Dongosolo Lodula Ma Dayimondi la Zingwe Zambiri la SiC Sapphire Ultra-Hard Brittle Materials 5

Dongosolo Lodula Ma Dayimondi la Zingwe Zambiri la SiC Sapphire Ultra-Hard Brittle Materials 6

Mafunso Ofunsidwa Kawirikawiri - Makina Odulira Daimondi Amitundu Iwiri

Q1: Kodi ubwino wa kudula waya wambiri ndi wotani poyerekeza ndi makina a waya umodzi?
Yankho: Makina okhala ndi mawaya ambiri amatha kudula ma wafer ambiri nthawi imodzi, zomwe zimapangitsa kuti ntchito ikhale yabwino kwambiri ndi 5–10×. Kugwiritsa ntchito zinthu kumakhala kokwera kwambiri chifukwa cha kutayika kwa kerf pansi pa 100 μm, zomwe zimapangitsa kuti ikhale yoyenera kupanga zinthu zambiri.

Q2: Ndi mitundu yanji ya zinthu zomwe zingakonzedwe?
A: Makinawa adapangidwira zinthu zolimba komanso zofooka, kuphatikizapo silicon carbide (SiC), safiro, gallium nitride (GaN), quartz, alumina (Al₂O₃), ndi aluminium nitride (AlN).

Q3: Kodi kulondola komwe kungatheke komanso khalidwe la pamwamba ndi lotani?
A: Kukhwima kwa pamwamba kumatha kufika pa Ra <0.5 μm, ndi kulondola kwa ±0.02 mm. Kudula m'mphepete kumatha kulamulidwa kufika pa <20 μm, kukwaniritsa miyezo ya makampani a semiconductor ndi optoelectronic.

Q4: Kodi njira yodulira imayambitsa ming'alu kapena kuwonongeka?
A: Ndi choziziritsira champhamvu komanso chowongolera kupsinjika kwa closed-loop, chiopsezo cha ming'alu yaying'ono ndi kuwonongeka kwa kupsinjika kumachepetsedwa, zomwe zimapangitsa kuti wafer ikhale yolimba kwambiri.

Yapitayi: SICOI (Silicon Carbide pa Insulator) Wafers SiC Film ON Silicon

Ena: Makina Opukutira Okhala ndi Mbali Ziwiri a SiC Sapphire Si wafer