HPSI SiC Wafer ≥90% Transmittance Optical Grade ya AI/AR Magalasi

Kufotokozera Kwachidule:

Parameter	Gulu	4-inch Substrate	6-inch Substrate
Diameter	Gulu la Z / D	99.5 mm - 100.0 mm	149.5 mm - 150.0 mm
Mtundu wa Poly	Gulu la Z / D	4H	4H
Makulidwe	Z kalasi	500 μm ± 15 μm	500 μm ± 15 μm
Makulidwe	D kalasi	500 μm ± 25 μm	500 μm ± 25 μm
Wafer Orientation	Gulu la Z / D	Pa axis: <0001> ± 0.5°	Pa axis: <0001> ± 0.5°
Kuchulukana kwa Micropipe	Z kalasi	≤ 1 cm²	≤ 1 cm²
Kuchulukana kwa Micropipe	D kalasi	≤ 15 cm²	≤ 15 cm²
Resistivity	Z kalasi	≥ 1E10 Ω·cm	≥ 1E10 Ω·cm
Resistivity	D kalasi	≥ 1E5 Ω·cm	≥ 1E5 Ω·cm

Titumizireni imelo

Mawonekedwe

Chiyambi Chachikulu: Udindo wa HPSI SiC Wafers mu AI/AR Glasses

HPSI (High-Purity Semi-Insulating) Zowotcha za Silicon Carbide ndi zopyapyala zapadera zodziwika ndi kukana kwambiri (>10⁹ Ω·cm) komanso kusachulukira kochepa kwambiri. M'magalasi a AI / AR, amakhala ngati gawo loyambira la ma lens optical waveguide diffractive, kuthana ndi zovuta zomwe zimagwirizanitsidwa ndi zida zamawonekedwe achikhalidwe malinga ndi mawonekedwe opyapyala komanso opepuka, kutulutsa kutentha, komanso magwiridwe antchito. Mwachitsanzo, magalasi a AR omwe amagwiritsa ntchito ma lens a SiC waveguide amatha kuona malo owoneka bwino kwambiri (FOV) a 70 ° -80 °, pomwe amachepetsa makulidwe a lens imodzi kukhala 0.55mm ndi kulemera mpaka 2.7g, kumathandizira kwambiri kuvala chitonthozo ndi kumiza m'maso.

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Zofunika Kwambiri: Momwe SiC Material Imathandizira Kupanga Magalasi a AI/AR

High Refractive Index ndi Optical Performance Optimization

SiC's refractive index (2.6-2.7) ndi pafupifupi 50% kuposa magalasi achikhalidwe (1.8-2.0). Izi zimapangitsa kuti pakhale zocheperako komanso zowoneka bwino za ma waveguide, kukulitsa kwambiri FOV. Mlozera wapamwamba wa refractive umathandizanso kupondereza "utawaleza" womwe umapezeka m'mawonekedwe osakanikirana, ndikuwongolera kuyera kwazithunzi.

Exceptional Thermal Management Kutha

Pokhala ndi matenthedwe okwera kwambiri a 490 W/m·K (pafupi ndi a mkuwa), SiC imatha kutulutsa mwachangu kutentha kopangidwa ndi ma module owonetsera a Micro-LED. Izi zimalepheretsa kuwonongeka kwa magwiridwe antchito kapena kukalamba kwa chipangizo chifukwa cha kutentha kwambiri, kuonetsetsa kuti batire imakhala yayitali komanso kukhazikika kwapamwamba.

Mechanical Mphamvu ndi Kukhalitsa

SiC ili ndi kulimba kwa Mohs kwa 9.5 (yachiwiri kwa diamondi), kumapereka kukana kwapadera, kumapangitsa kuti ikhale yabwino kwa magalasi ogwiritsidwa ntchito kawirikawiri. Kukula kwake kumatha kuwongoleredwa mpaka Ra <0.5 nm, kuwonetsetsa kutayika kocheperako komanso kufalikira kofananira kwambiri m'mafunde.

Electrical Property Compatibility

HPSI SiC's resistivity (>10⁹ Ω·cm) imathandiza kupewa kusokoneza kwa ma signal. Itha kukhalanso ngati chida champhamvu chamagetsi, kukhathamiritsa ma module oyang'anira mphamvu mu magalasi a AR.

Mayendedwe Ofunika Kwambiri

Core Optical Components za AI/AR Glasses

Ma Lens a Diffractive Waveguide: Magawo a SiC amagwiritsidwa ntchito kupanga ma ultra-thin optical waveguides omwe amathandiza FOV yayikulu ndikuchotsa mphamvu ya utawaleza.
Mazenera Plates ndi Prisms: Kudzera mwa kudula ndi kupukuta makonda, SiC imatha kusinthidwa kukhala mazenera oteteza kapena ma prisms owoneka bwino a magalasi a AR, kupititsa patsogolo kuyatsa komanso kukana kuvala.

Ntchito Zowonjezereka M'madera Ena

Power Electronics: Amagwiritsidwa ntchito pafupipafupi, pamagetsi apamwamba kwambiri ngati ma inverter amagetsi atsopano ndi zowongolera zamagalimoto zamafakitale.
Quantum Optics: Imagwira ntchito ngati malo opangira mitundu, omwe amagwiritsidwa ntchito m'malo olumikizirana ndi ma quantum ndi zida zowonera.

4 Inchi & 6 Inchi HPSI SiC Substrate Specification Kufananitsa

Parameter	Gulu	4-inch Substrate	6-inch Substrate
Diameter	Gulu la Z / D	99.5 mm - 100.0 mm	149.5 mm - 150.0 mm
Mtundu wa Poly	Gulu la Z / D	4H	4H
Makulidwe	Z kalasi	500 μm ± 15 μm	500 μm ± 15 μm
Makulidwe	D kalasi	500 μm ± 25 μm	500 μm ± 25 μm
Wafer Orientation	Gulu la Z / D	Pa axis: <0001> ± 0.5°	Pa axis: <0001> ± 0.5°
Kuchulukana kwa Micropipe	Z kalasi	≤ 1 cm²	≤ 1 cm²
Kuchulukana kwa Micropipe	D kalasi	≤ 15 cm²	≤ 15 cm²
Resistivity	Z kalasi	≥ 1E10 Ω·cm	≥ 1E10 Ω·cm
Resistivity	D kalasi	≥ 1E5 Ω·cm	≥ 1E5 Ω·cm
Chiyambi cha Flat Orientation	Gulu la Z / D	(10-10) ± 5.0°	(10-10) ± 5.0°
Kutalika Kwambiri Kwambiri	Gulu la Z / D	32.5 mm ± 2.0 mm	Notch
Utali Wachiwiri Wa Flat	Gulu la Z / D	18.0 mm ± 2.0 mm	-
Kupatula M'mphepete	Gulu la Z / D	3 mm	3 mm
LTV / TTV / Bow / Warp	Z kalasi	≤ 2.5 μm / ≤ 5 μm / ≤ 15 μm / ≤ 30 μm	≤ 2.5 μm / ≤ 6 μm / ≤ 25 μm / ≤ 35 μm
LTV / TTV / Bow / Warp	D kalasi	≤ 10 μm / ≤ 15 μm / ≤ 25 μm / ≤ 40 μm	≤ 5 μm / ≤ 15 μm / ≤ 40 μm / ≤ 80 μm
Ukali	Z kalasi	Polish Ra ≤ 1 nm / CMP Ra ≤ 0.2 nm	Polish Ra ≤ 1 nm / CMP Ra ≤ 0.2 nm
Ukali	D kalasi	Polish Ra ≤ 1 nm / CMP Ra ≤ 0.2 nm	Polish Ra ≤ 1 nm / CMP Ra ≤ 0.5 nm
Zithunzi za Edge Cracks	D kalasi	Malo owonjezera ≤ 0.1%	Kutalika kokwanira ≤ 20 mm, limodzi ≤ 2 mm
Madera a Polytype	D kalasi	Malo owonjezera ≤ 0.3%	Malo owonjezera ≤ 3%
Ma Visual Carbon Inclusions	Z kalasi	Malo owonjezera ≤ 0.05%	Malo owonjezera ≤ 0.05%
Ma Visual Carbon Inclusions	D kalasi	Malo owonjezera ≤ 0.3%	Malo owonjezera ≤ 3%
Zojambula za Silicon Surface	D kalasi	5 ololedwa, aliyense ≤1mm	Kutalika kokwanira ≤ 1 x m'mimba mwake
Mapiritsi a Edge	Z kalasi	Palibe chololedwa (m'lifupi ndi kuya ≥0.2mm)	Palibe chololedwa (m'lifupi ndi kuya ≥0.2mm)
Mapiritsi a Edge	D kalasi	7 amaloledwa, aliyense ≤1mm	7 amaloledwa, aliyense ≤1mm
Threading Screw Dislocation	Z kalasi	-	≤ 500 cm²
Packaging	Gulu la Z / D	Makaseti amitundu yopyapyala Kapena Chidebe Chowotcha Chimodzi	Makaseti amitundu yopyapyala Kapena Chidebe Chowotcha Chimodzi

Ntchito za XKH: Ntchito Zophatikizika Zopanga ndi Kusintha Makonda

Kampani ya XKH ili ndi luso lophatikizira kuchokera ku zida zopangira mpaka zomaliza, zomwe zimaphimba kukula kwa gawo lapansi la SiC, kudula, kupukuta, ndi kukonza makonda. Ubwino waukulu wa mautumiki ndi monga:

Kusiyanasiyana kwa Zinthu:Titha kupereka mitundu yopyapyala ngati 4H-N, mtundu wa 4H-HPSI, mtundu wa 4H/6H-P, ndi mtundu wa 3C-N. Resistivity, makulidwe, ndi orientation zitha kusinthidwa malinga ndi zofunikira.
paFlexible Size Customization:Timathandizira kukonza zopingasa kuchokera pa mainchesi awiri mpaka mainchesi 12, komanso timatha kukonza zida zapadera ngati masikweya (mwachitsanzo, 5x5mm, 10x10mm) ndi ma prism osakhazikika.
Optical-Grade Precision Control:Wafer Total Thickness Variation (TTV) ikhoza kusungidwa pa <1μm, ndi roughness pamwamba pa Ra <0.3 nm, kukwaniritsa nano-level flatness zofunika pa waveguide zipangizo.
Mayankho a Rapid Market:Mtundu wophatikizika wamabizinesi umatsimikizira kusintha koyenera kuchokera ku R&D kupita kukupanga zinthu zambiri, kuthandizira chilichonse kuchokera ku kutsimikizika kwamagulu ang'onoang'ono kupita ku zotumiza zazikulu (nthawi yotsogolera nthawi zambiri masiku 15-40).

FAQ ya HPSI SiC Wafer

Q1: Chifukwa chiyani HPSI SiC imatengedwa ngati zinthu zabwino kwambiri zamagalasi a AR waveguide?
A1: Mlozera wake wapamwamba wa refractive (2.6-2.7) umathandizira mawonekedwe ocheperako, owoneka bwino a ma waveguide omwe amathandizira gawo lalikulu (mwachitsanzo, 70 ° -80 °) ndikuchotsa "utawaleza".
Q2: Kodi HPSI SiC imathandizira bwanji kasamalidwe kamafuta mu magalasi a AI/AR?
A2: Ndi matenthedwe matenthedwe mpaka 490 W/m·K (pafupi ndi mkuwa), imataya bwino kutentha kuchokera kuzinthu monga ma Micro-LED, kuwonetsetsa kuti magwiridwe antchito ndi nthawi yayitali ya chipangizocho.
Q3: Ndi maubwino otani omwe HPS SiC amapereka pamagalasi ovala?
A3: Kulimba kwake kwapadera (Mohs 9.5) kumapereka kukana kwapamwamba kwambiri, kumapangitsa kuti ikhale yolimba kwambiri kuti igwiritsidwe ntchito tsiku ndi tsiku pamagalasi a AR ogula.