4inch Silicon wafer FZ CZ N-Type DSP kapena SSP Test grade

Kufotokozera Kwachidule:

Wafer wa silicon ndi pepala lopyapyala lopangidwa ndi silicon imodzi ya kristalo. Wafer wa silicon amapezeka m'madigiri awiri, mainchesi atatu, mainchesi anayi, mainchesi 6, ndi mainchesi 8, ndipo amagwiritsidwa ntchito kwambiri popanga ma circuits ophatikizidwa. Ma wafer a silicon ndi zinthu zopangira ndipo tchipisi ndi chinthu chomalizidwa. Ma wafer a silicon ndi zinthu zofunika kwambiri popanga ma circuits ophatikizidwa, ndipo zipangizo zosiyanasiyana za semiconductor zimatha kupangidwa pogwiritsa ntchito photolithography ndi ion implantation pa ma wafer a silicon.


Mawonekedwe

Kuwonetsa bokosi la wafer

Ma wafer a silicon ndi gawo lofunika kwambiri pa gawo la ukadaulo lomwe likukula masiku ano. Msika wa zinthu za semiconductor umafuna ma wafer a silicon okhala ndi zofunikira zenizeni kuti apange zida zatsopano zambiri zolumikizidwa. Timazindikira kuti pamene mtengo wopangira ma semiconductor ukukwera, mtengo wa zinthu zopangirazo, monga ma wafer a silicon umakweranso. Timamvetsetsa kufunika kwa khalidwe ndi kugwiritsa ntchito bwino ndalama pazinthu zomwe timapereka kwa makasitomala athu. Timapereka ma wafer omwe ndi otsika mtengo komanso abwino nthawi zonse. Timapanga makamaka ma wafer a silicon ndi ingots (CZ), ma wafer a epitaxial, ndi ma wafer a SOI.

M'mimba mwake M'mimba mwake Yopukutidwa Wopanda mankhwala Kuyang'ana Kusakhazikika/Ω.cm Kunenepa/um
mainchesi awiri 50.8±0.5mm SSP
DSP
P/N 100 1-20 200-500
mainchesi atatu 76.2±0.5mm SSP
DSP
P/B 100 NA 525±20
mainchesi 4
101.6±0.2
101.6±0.3
101.6±0.4
SSP
DSP
P/N 100 0.001-10 200-2000
6inchi
152.5±0.3 SSPDSP P/N 100 1-10 500-650
mainchesi 8
200±0.3 DSPSSP P/N 100 0.1-20 625

Kugwiritsa ntchito ma wafers a silicon

Gawo lapansi: PECVD/LPCVD yokutira, magnetron sputtering

Substrate: XRD, SEM, atomic force infrared spectroscopy, transmission electron microscopy, fluorescence spectroscopy ndi mayeso ena owunikira, kukula kwa molecular beam epitaxial, X-ray kusanthula kwa crystal microstructure processing: etching, bonding, MEMS devices, power devices, MOS devices ndi ma processing ena

Kuyambira mu 2010, Shanghai XKH Material Tech. Co., Ltd yadzipereka kupatsa makasitomala mayankho athunthu a 4-inch wafer Silicon Wafer, kuyambira ma wafers ofanana ndi Dummy Wafer, ma wafers ofanana ndi Test Wafer, mpaka ma wafers ofanana ndi malonda Prime Wafer, komanso ma wafers apadera, ma wafers ofanana ndi Oxide Oxide, ma wafers ofanana ndi Nitride Si3N4, ma wafers ofanana ndi aluminiyamu, ma wafers ofanana ndi Copper plated silicon, SOI Wafer, MEMS Glass, ma wafers ofanana ndi okhuthala kwambiri komanso osalala, ndi zina zotero, okhala ndi kukula kuyambira 50mm-300mm, ndipo titha kupereka ma wafers ofanana ndi semiconductor okhala ndi kupukuta kwa mbali imodzi/mbali ziwiri, kupukuta pang'ono, kudula, MEMS ndi ntchito zina zokonzera ndi kusintha.

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