12 Inchi SiC substrate M'mimba mwake 300mm Kukhuthala 750μm 4H-N Mtundu ukhoza kusinthidwa
Magawo aukadaulo
| 12 mainchesi Silicon Carbide (SiC) Substrate Kufotokozera | |||||
| Giredi | Kupanga kwa ZeroMPD Giredi (Giredi ya Z) | Kupanga Kokhazikika Giredi (Giredi P) | Giredi Yopanda Chilungamo (Giredi D) | ||
| M'mimba mwake | 3 0 0 mm~1305mm | ||||
| Kukhuthala | 4H-N | 750μm±15 μm | 750μm±25 μm | ||
| 4H-SI | 750μm±15 μm | 750μm±25 μm | |||
| Kuwongolera kwa Wafer | Kutseka kwa mzere: 4.0° kulowera <1120 >±0.5° pa 4H-N, Kutseka kwa mzere: <0001>±0.5° pa 4H-SI | ||||
| Kuchuluka kwa mapaipi ang'onoang'ono | 4H-N | ≤0.4cm-2 | ≤4cm-2 | ≤25cm-2 | |
| 4H-SI | ≤5cm-2 | ≤10cm-2 | ≤25cm-2 | ||
| Kusakhazikika | 4H-N | 0.015~0.024 Ω·cm | 0.015~0.028 Ω·cm | ||
| 4H-SI | ≥1E10 Ω·cm | ≥1E5 Ω·cm | |||
| Kuyang'ana Kwambiri Pang'onopang'ono | {10-10} ±5.0° | ||||
| Utali Woyamba Wathyathyathya | 4H-N | N / A | |||
| 4H-SI | Chingwe | ||||
| Kupatula Mphepete | 3 mm | ||||
| LTV/TTV/Uta/Warp | ≤5μm/≤15μm/≤35 μm/≤55 μm | ≤5μm/≤15μm/≤35 □ μm/≤55 □ μm | |||
| Kuuma | Chipolishi Ra≤1 nm | ||||
| CMP Ra≤0.2 nm | Ra≤0.5 nm | ||||
| Ming'alu ya Mphepete Yopangidwa ndi Kuwala Kwakukulu Kwambiri Mbale za Hex Ndi Kuwala Kwakukulu Kwambiri Malo Opangidwa ndi Polytype Ndi Kuwala Kwambiri Kuphatikizidwa kwa Kaboni Yowoneka Kukanda kwa Silicon Pamwamba Ndi Kuwala Kwambiri | Palibe Malo osonkhanitsidwa ≤0.05% Palibe Malo osonkhanitsidwa ≤0.05% Palibe | Kutalika kokwanira ≤ 20 mm, kutalika kamodzi ≤2 mm Malo osonkhanitsidwa ≤0.1% Malo osonkhanitsidwa ≤3% Malo osonkhanitsidwa ≤3% Kutalika kokwanira ≤1 × m'mimba mwake wa wafer | |||
| Ma Chips a M'mphepete Ndi Kuwala Kwakukulu Kwambiri | Palibe chololedwa m'lifupi ndi kuya kwa ≥0.2mm | 7 zololedwa, ≤1 mm iliyonse | |||
| (TSD) Kusokonekera kwa screw yolumikiza ulusi | ≤500 cm-2 | N / A | |||
| (BPD) Kusuntha kwa ndege yapansi | ≤1000 cm-2 | N / A | |||
| Kuipitsidwa kwa Silicon pamwamba ndi Kuwala Kwambiri | Palibe | ||||
| Kulongedza | Kaseti Yokhala ndi Ma Wafer Ambiri Kapena Chidebe Chimodzi Chokhala ndi Ma Wafer | ||||
| Zolemba: | |||||
| 1 Malire a zolakwika amagwira ntchito pamwamba pa wafer yonse kupatulapo malo ochotsera m'mphepete. 2 Mikwingwirima iyenera kuwonedwa pa nkhope ya Si yokha. 3 Deta ya kusokonekera kwa malo imachokera ku ma wafers odulidwa a KOH okha. | |||||
Zinthu Zofunika Kwambiri
1. Mphamvu Yopangira ndi Ubwino wa Mtengo: Kupanga kwakukulu kwa gawo la SiC la mainchesi 12 (gawo la silicon carbide la mainchesi 12) kukuwonetsa nthawi yatsopano pakupanga ma semiconductor. Chiwerengero cha ma chips omwe amapezeka kuchokera ku wafer imodzi chimafika nthawi 2.25 kuposa ma substrates a mainchesi 8, zomwe zimapangitsa kuti ntchito yopangira ikhale yopambana. Ndemanga za makasitomala zikusonyeza kuti kugwiritsa ntchito ma substrates a mainchesi 12 kwachepetsa ndalama zawo zopangira ma module amphamvu ndi 28%, zomwe zimapangitsa kuti pakhale mpikisano waukulu pamsika womwe ukutsutsidwa kwambiri.
2. Kapangidwe Kabwino Kwambiri: Chogwirizira cha SiC cha mainchesi 12 chimalandira zabwino zonse za zinthu za silicon carbide - kutentha kwake kumapitirira katatu kuposa silicon, pomwe mphamvu yake yogawa mphamvu imafika nthawi 10 kuposa silicon. Makhalidwe amenewa amalola zipangizo zochokera kuzinthu za mainchesi 12 kugwira ntchito mokhazikika m'malo otentha kwambiri opitilira 200°C, zomwe zimapangitsa kuti zikhale zoyenera kwambiri kugwiritsa ntchito molimbika monga magalimoto amagetsi.
3. Ukadaulo Wokhudza Kukonza Malo: Tapanga njira yatsopano yopangira makina opukutira (CMP) makamaka ya ma substrates a SiC a mainchesi 12, zomwe zimapangitsa kuti malo azitha kukhala osalala (Ra<0.15nm). Kupambana kumeneku kumathetsa vuto la padziko lonse lapansi la chithandizo cha pamwamba pa silicon carbide wafer cha mainchesi akuluakulu, ndikuchotsa zopinga kuti kukula kwa epitaxial kukhale kwapamwamba.
4. Kugwira Ntchito kwa Kutentha: Mu ntchito zenizeni, ma substrate a SiC a mainchesi 12 amasonyeza mphamvu zodabwitsa zotaya kutentha. Deta yoyesera ikuwonetsa kuti pansi pa mphamvu yofanana, zipangizo zomwe zimagwiritsa ntchito ma substrate a mainchesi 12 zimagwira ntchito kutentha kotsika ndi 40-50°C kuposa zida zopangidwa ndi silicon, zomwe zimawonjezera kwambiri moyo wa ntchito ya zida.
Mapulogalamu Aakulu
1. Dongosolo Latsopano la Magalimoto Ogwiritsa Ntchito Mphamvu: Dongosolo la SiC la mainchesi 12 (substrate ya silicon carbide ya mainchesi 12) likusinthiratu kapangidwe ka magetsi amagetsi. Kuyambira pa ma charger omwe ali mkati (OBC) mpaka ma inverter akuluakulu ndi machitidwe oyang'anira mabatire, kusintha kwa magwiridwe antchito komwe kumabwera chifukwa cha ma substrate a mainchesi 12 kumawonjezera kuchuluka kwa magalimoto ndi 5-8%. Malipoti ochokera kwa wopanga magalimoto wotsogola akuwonetsa kuti kugwiritsa ntchito ma substrate athu a mainchesi 12 kunachepetsa kutayika kwa mphamvu mu dongosolo lawo lochaja mwachangu ndi 62%.
2. Gawo la Mphamvu Zobwezerezedwanso: Mu malo opangira magetsi a photovoltaic, ma inverter opangidwa ndi ma substrates a SiC a mainchesi 12 samangokhala ndi zinthu zazing'ono komanso amakwaniritsa bwino kusintha kwa magetsi kuposa 99%. Makamaka m'magawo ogawa magetsi, mphamvu yayikuluyi imatanthawuza kusungidwa kwa pachaka kwa ma yuan mazana ambiri pakutayika kwa magetsi kwa ogwiritsa ntchito.
3.Kudziyendetsa Mwachangu Kwamafakitale: Ma frequency converters omwe amagwiritsa ntchito ma substrates a mainchesi 12 amasonyeza ntchito yabwino kwambiri m'ma robot amakampani, zida zamakina a CNC, ndi zida zina. Makhalidwe awo osinthira pafupipafupi amawongolera liwiro la kuyankha kwa magalimoto ndi 30% pomwe amachepetsa kusokonezedwa kwa ma electromagnetic kufika pa gawo limodzi mwa magawo atatu a mayankho wamba.
4. Zatsopano pa Zamagetsi a Ogwiritsa Ntchito: Ukadaulo watsopano wa mafoni a m'badwo watsopano wochapira mwachangu wayamba kugwiritsa ntchito ma substrate a SiC a mainchesi 12. Akuyembekezeka kuti zinthu zochapira mwachangu zoposa 65W zidzasinthiratu kukhala njira zothetsera vuto la silicon carbide, ndipo ma substrate a mainchesi 12 adzakhala chisankho chabwino kwambiri pamtengo wabwino.
Ntchito Zopangidwira XKH za SiC Substrate ya mainchesi 12
Kuti akwaniritse zofunikira zenizeni za ma substrates a SiC a mainchesi 12 (ma substrates a silicon carbide a mainchesi 12), XKH imapereka chithandizo chokwanira chautumiki:
1. Kusintha Kwa Makulidwe:
Timapereka ma substrates a mainchesi 12 okhala ndi makulidwe osiyanasiyana kuphatikiza 725μm kuti tikwaniritse zosowa zosiyanasiyana zogwiritsira ntchito.
2. Kuchuluka kwa doping:
Kupanga kwathu kumathandizira mitundu yosiyanasiyana ya conductivity kuphatikiza substrates za mtundu wa n ndi mtundu wa p, ndi kulamulira kolondola kwa resistivity komwe kuli pakati pa 0.01-0.02Ω·cm.
3. Ntchito Zoyesera:
Ndi zida zonse zoyesera za wafer, timapereka malipoti athunthu owunikira.
XKH ikumvetsa kuti kasitomala aliyense ali ndi zofunikira zapadera pa ma substrates a SiC a mainchesi 12. Chifukwa chake timapereka njira zosinthika zogwirira ntchito limodzi kuti tipereke mayankho opikisana kwambiri, kaya a:
· Zitsanzo za R&D
· Kugula zinthu zambiri
Ntchito zathu zomwe timachita mwamakonda zimatitsimikizira kuti tikhoza kukwaniritsa zosowa zanu zaukadaulo komanso zopangira za ma substrates a SiC a mainchesi 12.









