Mu chitukuko cha makampani opanga ma semiconductor, galasi limodzi lopukutidwama wafer a silikoniAmagwira ntchito yofunika kwambiri. Amagwira ntchito ngati zinthu zofunika kwambiri popanga zipangizo zosiyanasiyana zamagetsi. Kuyambira ma circuits ovuta komanso olondola ophatikizidwa mpaka ma microprocessor othamanga kwambiri ndi masensa ambiri, kristalo imodzi yopukutidwama wafer a silikonindizofunikira kwambiri. Kusiyana kwa magwiridwe antchito ndi zofunikira zawo kumakhudza mwachindunji mtundu ndi magwiridwe antchito a zinthu zomaliza. Pansipa pali zofunikira ndi magawo odziwika bwino a ma wafers opukutidwa a silicon imodzi:

M'mimba mwake: Kukula kwa ma wafer a silicon amodzi a semiconductor kumayesedwa ndi m'mimba mwake, ndipo amabwera m'njira zosiyanasiyana. Ma diameter wamba ndi mainchesi 2 (50.8mm), mainchesi 76.2mm, mainchesi 4 (100mm), mainchesi 5 (125mm), mainchesi 6 (150mm), mainchesi 8 (200mm), mainchesi 12 (300mm), ndi mainchesi 18 (450mm). Ma diameter osiyanasiyana ndi oyenera zosowa zosiyanasiyana zopangira ndi zofunikira pa njira. Mwachitsanzo, ma wafer ang'onoang'ono a diameter amagwiritsidwa ntchito kwambiri pazida zapadera zazing'ono zamagetsi, pomwe ma wafer akuluakulu a diameter amasonyeza kugwira ntchito bwino kwambiri komanso ubwino wamtengo wapatali popanga ma circuit akuluakulu. Zofunikira pamwamba pake zimagawidwa m'magulu monga single-side polished (SSP) ndi double-side polished (DSP). Ma wafer opukutidwa mbali imodzi amagwiritsidwa ntchito pazida zomwe zimafuna kusalala kwambiri mbali imodzi, monga masensa ena. Ma wafer opukutidwa mbali imodzi amagwiritsidwa ntchito kwambiri pa ma circuit ophatikizidwa ndi zinthu zina zomwe zimafuna kulondola kwambiri pamalo onse awiri. Zofunikira Pamwamba (Kutha): SSP yopukutidwa mbali imodzi / DSP yopukutidwa mbali ziwiri.

Mtundu/Dopant: (1) Semiconductor ya mtundu wa N: Pamene maatomu ena odetsedwa alowetsedwa mu semiconductor yamkati, amasintha kayendedwe kake. Mwachitsanzo, pamene zinthu za pentavalent monga nitrogen (N), phosphorus (P), arsenic (As), kapena antimony (Sb) ziwonjezedwa, ma electron awo a valence amapanga ma covalent bond ndi ma electron a valence a maatomu a silicon ozungulira, zomwe zimasiya electron yowonjezera yosamangidwa ndi covalent bond. Izi zimapangitsa kuti ma electron azikhala ochuluka kuposa kuchuluka kwa dzenje, zomwe zimapangitsa semiconductor ya mtundu wa N, yomwe imadziwikanso kuti semiconductor ya mtundu wa electron. Ma semiconductor a mtundu wa N ndi ofunikira kwambiri popanga zipangizo zomwe zimafuna ma electron ngati zonyamulira zazikulu, monga zipangizo zina zamagetsi. (2) Semiconductor ya mtundu wa P: Pamene zinthu zodetsedwa za trivalent monga boron (B), gallium (Ga), kapena indium (In) zilowetsedwa mu silicon semiconductor, ma electron a valence a maatomu odetsedwa amapanga ma covalent bond ndi ma silicon ozungulira, koma alibe valence electron imodzi ndipo sangathe kupanga covalent bond yonse. Izi zimapangitsa kuti kuchuluka kwa mabowo kukhale kwakukulu kuposa kuchuluka kwa ma elekitironi, zomwe zimapangitsa kuti pakhale semiconductor ya P-type, yomwe imadziwikanso kuti semiconductor ya mabowo. Ma semiconductor a P-type amachita gawo lofunika kwambiri popanga zipangizo komwe mabowo amagwira ntchito ngati zonyamulira zazikulu, monga ma diode ndi ma transistors ena.

Kukana: Kukana ndi kuchuluka kofunikira komwe kumayesa mphamvu yamagetsi ya ma wafer a silicon opukutidwa amodzi. Mtengo wake umasonyeza mphamvu yamagetsi ya chipangizocho. Kukana kutsika, mphamvu ya silicon wafer imakhala yabwino; Mosiyana ndi zimenezi, mphamvu yamagetsi imakhala yotsika kwambiri. Kukana kwa ma wafer a silicon kumatsimikiziridwa ndi zinthu zawo, ndipo kutentha kumakhudzanso kwambiri. Nthawi zambiri, mphamvu ya ma wafer a silicon imawonjezeka ndi kutentha. Mu ntchito zenizeni, zipangizo zosiyanasiyana zamagetsi zimakhala ndi zofunikira zosiyanasiyana za mphamvu yamagetsi ya ma wafer a silicon. Mwachitsanzo, ma wafer omwe amagwiritsidwa ntchito popanga ma circuit ophatikizidwa amafunika kuwongolera bwino mphamvu yamagetsi kuti atsimikizire kuti chipangizocho chikugwira ntchito bwino komanso modalirika.

Kuyang'ana: Kuyang'ana kwa kristalo kwa wafer kumayimira njira yowunikira ya silicon lattice, yomwe nthawi zambiri imafotokozedwa ndi Miller indices monga (100), (110), (111), ndi zina zotero. Ma kristalo osiyanasiyana ali ndi mawonekedwe osiyanasiyana, monga kuchuluka kwa mzere, komwe kumasiyana kutengera momwe akuyendetsera. Kusiyana kumeneku kungakhudze momwe wafer imagwirira ntchito pokonza zinthu komanso momwe zida zamagetsi zimagwirira ntchito. Pakupanga, kusankha wafer ya silicon yokhala ndi njira yoyenera yogwiritsira ntchito zida zosiyanasiyana kumatha kukonza magwiridwe antchito a chipangizocho, kukonza magwiridwe antchito, komanso kukulitsa mtundu wa chinthucho.

Flat/Notch: Mphepete mwathyathyathya (Flat) kapena V-notch (Notch) yomwe ili pa circle ya silicon wafer imagwira ntchito yofunika kwambiri pakugwirizanitsa ma crystal directional ndipo ndi chizindikiro chofunikira pakupanga ndi kukonza wafer. Ma wafer amitundu yosiyanasiyana amafanana ndi miyezo yosiyanasiyana ya kutalika kwa Flat kapena Notch. Mphepete mwa alignment zimagawidwa m'magulu a flat flat ndi secondary flat. Flat yoyamba imagwiritsidwa ntchito makamaka kudziwa momwe crystal imayendera ndi momwe processing imayendera wafer, pomwe flat yachiwiri imathandizanso pakugwirizanitsa ndi kukonza molondola, kuonetsetsa kuti wafer ikugwira ntchito molondola komanso mosasinthasintha mu mzere wonse wopanga.

Kukhuthala: Kukhuthala kwa wafer nthawi zambiri kumatchulidwa mu ma micrometer (μm), ndipo makulidwe ofanana amakhala pakati pa 100μm ndi 1000μm. Ma wafer a makulidwe osiyanasiyana ndi oyenera mitundu yosiyanasiyana ya zida zamagetsi. Ma wafer owonda (monga, 100μm - 300μm) nthawi zambiri amagwiritsidwa ntchito popanga ma chip omwe amafunikira kuwongolera makulidwe, kuchepetsa kukula ndi kulemera kwa chip ndikuwonjezera kuchuluka kwa kuphatikiza. Ma wafer okhuthala (monga, 500μm - 1000μm) amagwiritsidwa ntchito kwambiri pazida zomwe zimafuna mphamvu zambiri zamakanika, monga zida zamagetsi zamagetsi, kuti zitsimikizire kukhazikika panthawi yogwira ntchito.

Kukhwima kwa pamwamba: Kukhwima kwa pamwamba ndi chimodzi mwa zinthu zofunika kwambiri poyesa ubwino wa wafer, chifukwa kumakhudza mwachindunji kugwirizana pakati pa wafer ndi zipangizo zopyapyala zomwe zasungidwa pambuyo pake, komanso momwe chipangizocho chimagwirira ntchito. Nthawi zambiri chimafotokozedwa ngati kukhwima kwa root mean square (RMS) (mu nm). Kukhwima kwapansi pa pamwamba kumatanthauza kuti pamwamba pa wafer ndi posalala, zomwe zimathandiza kuchepetsa zochitika monga kufalikira kwa ma elekitironi ndikuwongolera magwiridwe antchito ndi kudalirika kwa chipangizocho. Mu njira zopangira semiconductor zapamwamba, zofunikira pakukhwima kwa pamwamba zikukulirakulira, makamaka popanga ma circuit ophatikizidwa apamwamba, komwe kukhwima kwa pamwamba kuyenera kulamulidwa mpaka ma nanometer angapo kapena kutsika.

Kusiyanasiyana Kwa Makulidwe Onse (TTV): Kusiyanasiyana kwa makulidwe onse kumatanthauza kusiyana pakati pa makulidwe apamwamba ndi ocheperako omwe amayesedwa pamalo angapo pamwamba pa wafer, omwe nthawi zambiri amawonetsedwa mu μm. TTV yayitali ingayambitse kusintha kwa njira monga photolithography ndi etching, zomwe zimakhudza magwiridwe antchito a chipangizocho komanso phindu lake. Chifukwa chake, kuwongolera TTV panthawi yopanga wafer ndi gawo lofunikira pakutsimikizira mtundu wa chinthucho. Pakupanga zida zamagetsi zamagetsi molondola kwambiri, TTV nthawi zambiri imafunika kukhala mkati mwa ma micrometer ochepa.

Uta: Uta umatanthauza kusiyana pakati pa pamwamba pa wafer ndi malo abwino osalala, omwe nthawi zambiri amayesedwa mu μm. Ma wafer omwe amawerama kwambiri amatha kusweka kapena kukhala ndi nkhawa yosagwirizana panthawi yokonza pambuyo pake, zomwe zimakhudza magwiridwe antchito opanga komanso mtundu wa zinthu. Makamaka m'njira zomwe zimafuna kusalala kwambiri, monga photolithography, kuwerama kuyenera kulamulidwa mkati mwa mtundu winawake kuti zitsimikizire kulondola ndi kusinthasintha kwa kapangidwe ka photolithography.

Kupindika: Kupindika kumasonyeza kusiyana pakati pa pamwamba pa wafer ndi mawonekedwe abwino ozungulira, omwe amayesedwanso mu μm. Mofanana ndi uta, kupindika ndi chizindikiro chofunikira cha kusalala kwa wafer. Kupindika kwakukulu sikumangokhudza kulondola kwa malo a wafer mu zida zokonzera zinthu komanso kungayambitse mavuto panthawi yokonza chip, monga kusalumikizana bwino pakati pa chip ndi zinthu zolongedza, zomwe zimakhudza kudalirika kwa chipangizocho. Pakupanga ma semiconductor apamwamba, zofunikira za warp zikukulirakulira kuti zikwaniritse zofunikira za njira zamakono zopangira chip ndi zolongedza.

Mbiri ya Mphepete: Mbiri ya m'mphepete mwa wafer ndi yofunika kwambiri pakukonzekera ndi kusamalira pambuyo pake. Nthawi zambiri imafotokozedwa ndi Edge Exclusion Zone (EEZ), yomwe imafotokoza mtunda kuchokera ku m'mphepete mwa wafer komwe sikuloledwa kukonza. Mbiri ya m'mphepete yokonzedwa bwino komanso kuwongolera kwa EEZ kolondola kumathandiza kupewa zolakwika za m'mphepete, kuchuluka kwa kupsinjika, ndi mavuto ena panthawi yokonza, ndikukweza mtundu wonse wa wafer ndi zokolola. Mu njira zina zopangira zapamwamba, kulondola kwa mbiri ya m'mphepete kumafunika kuti kukhale pamlingo wa sub-micron.

Kuchuluka kwa Tinthu: Kuchuluka ndi kukula kwa tinthu pamwamba pa wafer kumakhudza kwambiri magwiridwe antchito a zida zamagetsi. Tinthu tambirimbiri kapena tambiri tingayambitse kulephera kwa chipangizo, monga ma short circuits kapena kutayikira kwa madzi, zomwe zimachepetsa kukolola kwa chinthucho. Chifukwa chake, kuchuluka kwa tinthu nthawi zambiri kumayesedwa powerengera tinthu pagawo lililonse, monga kuchuluka kwa tinthu tating'onoting'ono toposa 0.3μm. Kuwongolera mwamphamvu kuchuluka kwa tinthu panthawi yopanga wafer ndi njira yofunika kwambiri yotsimikizira kuti chinthucho chili bwino. Ukadaulo wapamwamba woyeretsa ndi malo oyera opangira zinthu zimagwiritsidwa ntchito kuchepetsa kuipitsidwa kwa tinthu pamwamba pa wafer.

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