Ma wafer a SOI (Silicon-On-Insulator)ikuyimira zinthu zapadera za semiconductor zokhala ndi silicon wosanjikiza woonda kwambiri wopangidwa pamwamba pa wosanjikiza wa oxide woteteza. Kapangidwe kapadera ka masangweji kameneka kamapereka zowonjezera zazikulu pa magwiridwe antchito a zida za semiconductor.
Kapangidwe ka Kapangidwe:
Chida Chopangira (Silicon Yapamwamba):
Kukhuthala kwake kumayambira pa ma nanometer angapo mpaka ma micrometer, zomwe zimagwiritsidwa ntchito ngati gawo logwira ntchito popanga ma transistor.
Gawo la Oxide Lobisika (BOX):
Chitsulo choteteza silicon dioxide (chokhuthala cha 0.05-15μm) chomwe chimachotsa chipangizocho kuchokera ku substrate pogwiritsa ntchito magetsi.
Pansi pa nthaka:
Silikoni yochuluka (yokhuthala 100-500μm) imapereka chithandizo chamakina.
Malinga ndi ukadaulo wa njira yokonzekera, njira zazikulu zogwiritsira ntchito ma wafer a silicon a SOI zitha kugawidwa m'magulu awa: SIMOX (ukadaulo wodzipangira mpweya), BESOI (ukadaulo wothina womangirira), ndi Smart Cut (ukadaulo wanzeru wochotsa zinthu).
SIMOX (ukadaulo wodzipangira mpweya woipa) ndi njira yomwe imaphatikizapo kulowetsa ma ayoni a oxygen amphamvu kwambiri m'ma silicon wafers kuti apange gawo lokhala ndi silicon dioxide, lomwe kenako limayikidwa mu annealing yotentha kwambiri kuti likonze zolakwika za lattice. Pakati pake ndi jakisoni wa oxygen wa ion mwachindunji kuti apange mpweya woipa.
BESOI (ukadaulo wa Bonding Thinning) umaphatikizapo kulumikiza ma wafer awiri a silicon kenako nkuchepetsa imodzi mwa izo kudzera mu kupukutira ndi kupukuta mankhwala kuti apange kapangidwe ka SOI. Pakati pake pali kulumikiza ndi kuchepetsa.
Smart Cut (ukadaulo wa Intelligent Exfoliation) imapanga gawo lochotsa mafoli kudzera mu jakisoni wa hydrogen ion. Pambuyo polumikizana, chithandizo cha kutentha chimachitika kuti chichotse mafolidi a silicon wafer pamodzi ndi gawo la hydrogen ion, ndikupanga gawo lochepa kwambiri la silicon. Pakati pake ndi hydrogen injection stripping.
Pakadali pano, pali ukadaulo wina wotchedwa SIMBOND (ukadaulo wolumikizira mpweya), womwe unapangidwa ndi Xinao. Ndipotu, ndi njira yomwe imaphatikiza njira yodzipatula yolumikizira mpweya ndi ukadaulo wolumikizira. Mu njira yaukadaulo iyi, mpweya wolowetsedwa umagwiritsidwa ntchito ngati gawo lochepetsera kutayirira, ndipo gawo lenileni la mpweya wolowetsedwa ndi gawo lotenthetsera kutentha. Chifukwa chake, nthawi yomweyo imawongolera magawo monga kufanana kwa silicon yapamwamba ndi mtundu wa gawo la mpweya wolowetsedwa.
Ma wafer a silicon a SOI opangidwa ndi njira zosiyanasiyana zaukadaulo ali ndi magawo osiyanasiyana a magwiridwe antchito ndipo ndi oyenera kugwiritsidwa ntchito mosiyanasiyana.
Izi ndi tebulo lachidule la ubwino waukulu wa ma wafer a silicon a SOI, kuphatikiza ndi mawonekedwe awo aukadaulo ndi zochitika zenizeni zogwiritsidwa ntchito. Poyerekeza ndi silicon yachikhalidwe, SOI ili ndi ubwino waukulu pakulinganiza liwiro ndi kugwiritsa ntchito mphamvu. (PS: Kugwira ntchito kwa 22nm FD-SOI kuli pafupi ndi kwa FinFET, ndipo mtengo wake umachepetsedwa ndi 30%.)
| Ubwino wa Kuchita Bwino | Mfundo Zaukadaulo | Kuwonetsera Kwapadera | Zochitika Zachizolowezi Zogwiritsira Ntchito |
| Mphamvu Yochepa ya Parasitic | Chotchingira chotetezera kutentha (BOX) chimatseka kulumikizana kwa chaji pakati pa chipangizo ndi substrate | Liwiro losinthira linawonjezeka ndi 15%-30%, kugwiritsa ntchito mphamvu kunachepetsedwa ndi 20%-50% | 5G RF, Ma chip olumikizirana pafupipafupi kwambiri |
| Kutsika kwa Kutaya Kwatsopano | Chitsulo choteteza chimaletsa njira zotulutsira madzi | Mphamvu yotayikira yatsika ndi >90%, moyo wa batri wotalikirapo | Zipangizo za IoT, zamagetsi zovekedwa |
| Kulimba Kwambiri kwa Radiation | Chotetezera kutentha chimaletsa kusonkhanitsa mphamvu zomwe zimayambitsidwa ndi kuwala kwa dzuwa | Kupirira kwa kuwala kwa dzuwa kunakula katatu kapena kasanu, ndipo kunachepetsa kugwedezeka kwa nthawi imodzi. | Zombo Zamlengalenga, Zipangizo zamakampani a nyukiliya |
| Kulamulira Zotsatira za Njira Yaifupi | Chopondapo cha silicon choonda chimachepetsa kusokoneza kwa magetsi pakati pa ngalande ndi gwero | Kukhazikika kwa magetsi olowera m'mphepete, malo otsetsereka a subthreshold okonzedwa bwino | Ma chips apamwamba a node logic (<14nm) |
| Kuwongolera Kutentha Kwabwino | Chophimba choteteza kutentha chimachepetsa kulumikizana kwa kutentha | Kuchuluka kwa kutentha kochepera 30%, kutentha kocheperako kwa ntchito ndi 15-25°C | Ma IC a 3D, Zamagetsi zamagalimoto |
| Kukonza Kwambiri Ma Frequency | Kuchepa kwa mphamvu ya parasitic komanso kuyenda bwino kwa chonyamulira | Kuchedwa kotsika kwa 20%, kumathandizira kukonza ma signalo a >30GHz | Kulankhulana kwa mmWave, ma satellite comm chips |
| Kusinthasintha Kwambiri kwa Kapangidwe | Palibe mankhwala oletsa kutupa m'chiwindi omwe amafunika, amathandizira kuletsa msana | Njira zochepetsera 13%-20%, kuchuluka kwa kuphatikiza ndi 40% kokwera | Ma IC a zizindikiro zosakanikirana, Masensa |
| Chitetezo chamthupi chopanda chitetezo | Chotchingira kutentha chimachotsa malo olumikizirana a PN | Mzere wamagetsi wa latch-up wakwera kufika pa >100mA | Zipangizo zamagetsi zamagetsi amphamvu kwambiri |
Mwachidule, ubwino waukulu wa SOI ndi wakuti: imagwira ntchito mwachangu komanso imagwiritsa ntchito mphamvu zochepa.
Chifukwa cha makhalidwe amenewa a SOI, ili ndi ntchito zambiri m'magawo omwe amafunikira magwiridwe antchito abwino kwambiri komanso kugwiritsa ntchito mphamvu.
Monga momwe zasonyezedwera pansipa, kutengera kuchuluka kwa magawo ogwiritsira ntchito omwe akugwirizana ndi SOI, zitha kuwoneka kuti RF ndi zida zamagetsi ndizo zomwe zimayimira msika waukulu wa SOI.
| Munda Wofunsira | Machitidwe pamsika |
| RF-SOI (Mafupipafupi a Ma wailesi) | 45% |
| Mphamvu SOI | 30% |
| FD-SOI (Yotheratu) | 15% |
| SOI yowoneka bwino | 8% |
| Sensor SOI | 2% |
Ndi kukula kwa misika monga kulankhulana pafoni ndi kuyendetsa galimoto yodziyimira payokha, ma wafer a silicon a SOI akuyembekezekanso kukhala ndi kukula kwina.
XKH, monga katswiri wotsogola mu ukadaulo wa Silicon-On-Insulator (SOI), imapereka mayankho athunthu a SOI kuyambira pa kafukufuku ndi chitukuko mpaka kupanga kuchuluka pogwiritsa ntchito njira zopangira zotsogola mumakampani. Mapepala athu onse akuphatikizapo ma wafer a SOI a 200mm/300mm okhala ndi mitundu ya RF-SOI, Power-SOI ndi FD-SOI, okhala ndi kuwongolera kolimba kwa khalidwe komwe kumatsimikizira kusinthasintha kwa magwiridwe antchito (kufanana kwa makulidwe mkati mwa ± 1.5%). Timapereka mayankho okonzedwa ndi makulidwe a wosanjikiza wa oxide (BOX) kuyambira 50nm mpaka 1.5μm ndi mitundu yosiyanasiyana ya resistivity kuti akwaniritse zofunikira zinazake. Pogwiritsa ntchito zaka 15 zaukadaulo komanso unyolo wamphamvu wapadziko lonse lapansi, timapereka modalirika zida zapamwamba za SOI substrate kwa opanga ma semiconductor apamwamba padziko lonse lapansi, zomwe zimathandiza kuti pakhale zatsopano zama chip mu kulumikizana kwa 5G, zamagetsi zamagalimoto, ndi ntchito zanzeru zopanga.
XKH'Ma wafer a SOI:
Nthawi yotumizira: Epulo-24-2025