Zophika za SOI (Silicon-On-Insulator).imayimira chida chapadera cha semiconductor chokhala ndi silicon woonda kwambiri wopangidwa pamwamba pa insulating oxide layer. Mapangidwe apadera a sangwejiwa amapereka zowonjezera magwiridwe antchito a zida za semiconductor.
Kapangidwe Kapangidwe:
Chigawo Chachipangizo (Silicon Yapamwamba):
Kukula kuyambira ma nanometer angapo mpaka ma micrometer, omwe amagwira ntchito ngati gawo lopangira ma transistor.
Wokwiriridwa Oxide Layer (BOX):
Silicon dioxide insulating wosanjikiza (0.05-15μm wandiweyani) amene amalekanitsa ndi magetsi wosanjikiza chipangizo ku gawo lapansi.
Gawo Loyambira:
Silicon yochuluka (100-500μm wandiweyani) yopereka chithandizo chamakina.
Malinga ndi ukadaulo wokonzekera, njira zophatikizira zophatikizira za SOI silicon zitha kugawidwa ngati: SIMOX (ukadaulo wodzipatula wa oxygen), BESOI (ukadaulo wopatulira wolumikizana), ndi Smart Cut (ukadaulo wovundukula wanzeru).
SIMOX (Teknoloji ya jekeseni wa oxygen isolation) ndi njira yomwe imaphatikizapo kubaya ma ion okosijeni okhala ndi mphamvu zambiri mu zowotcha za silicon kuti apange wosanjikiza wa silicon dioxide, womwe umayikidwa ndi kutentha kwambiri kuti ukonze zolakwika za lattice. Pakatikati ndi jakisoni wa okosijeni wa ion kuti apange mpweya wosanjikiza wokwiriridwa.
BESOI (Tekinoloje ya Bonding Thinning) imaphatikizira kumangirira zowotcha ziwiri za silicon ndikupatulira imodzi mwazopera zamakina ndi etching yamankhwala kuti ipange mawonekedwe a SOI. Chinsinsi chagona pa kugwirizana ndi kupatulira.
Smart Cut (ukadaulo wa Intelligent Exfoliation) umapanga wosanjikiza wotulutsa kudzera mu jekeseni wa hydrogen ion. Pambuyo pa kugwirizana, chithandizo cha kutentha chimachitika kuti chiwonongeko chophatikizira cha silicon pamodzi ndi wosanjikiza wa hydrogen ion, ndikupanga wosanjikiza wowonda kwambiri wa silicon. Pakatikati ndikuchotsa jekeseni wa haidrojeni.
Pakalipano, pali teknoloji ina yotchedwa SIMBOND (teknoloji yogwirizanitsa jekeseni wa oxygen), yomwe inapangidwa ndi Xinao. M'malo mwake, ndi njira yomwe imaphatikizira kudzipatula kwa jakisoni wa okosijeni ndi matekinoloje omangirira. Munjira yaukadaulo iyi, jekeseni ya okosijeni imagwiritsidwa ntchito ngati chotchinga chotchinga, ndipo gawo lenileni la okosijeni lomwe limakwiriridwa ndi gawo la matenthedwe a okosijeni. Choncho, nthawi imodzi bwino magawo monga yunifolomu pamwamba pakachitsulo ndi khalidwe la m'manda wosanjikiza mpweya.
Zophika za SOI silicon zopangidwa ndi njira zosiyanasiyana zamaukadaulo zimakhala ndi magawo osiyanasiyana ogwirira ntchito ndipo ndizoyenera pazogwiritsa ntchito zosiyanasiyana.
Zotsatirazi ndi tebulo lachidule la ubwino wapakatikati wazitsulo za SOI silicon, kuphatikizapo mawonekedwe awo aukadaulo ndi zochitika zenizeni zogwiritsira ntchito. Poyerekeza ndi silicon yochuluka yachikhalidwe, SOI ili ndi ubwino wambiri pa liwiro la kuthamanga ndi kugwiritsa ntchito mphamvu. (PS: Kuchita kwa 22nm FD-SOI kuli pafupi ndi FinFET, ndipo mtengo wake umachepetsedwa ndi 30%.)
| Ubwino Wantchito | Mfundo Zaumisiri | Chiwonetsero Chachindunji | Zochitika Zofananira za Ntchito |
| Low Parasitic Capacitance | Insulating layer (BOX) imatchinga kulumikizana pakati pa chipangizo ndi gawo lapansi | Kuthamanga kwasintha kunakwera ndi 15% -30%, kugwiritsa ntchito mphamvu kumachepetsedwa ndi 20% -50% | 5G RF, High-Friquency Communication chips |
| Kuchepetsa Kutayikira Panopa | Insulating wosanjikiza imapondereza kutayikira njira zamakono | Kutayikira kwapano kwachepetsedwa ndi> 90%, moyo wautali wa batri | Zida za IoT, Zovala zamagetsi |
| Kulimba kwa Radiation | Insulating layer imatchinga kuchuluka kwa ma radiation chifukwa cha kuchuluka | Kulekerera kwa radiation kunasintha 3-5x, kuchepetsa kukhumudwa kwa chochitika chimodzi | Spacecraft, zida zamakampani a nyukiliya |
| Short-Channel Effect Control | Wopanda silicon wosanjikiza amachepetsa kusokoneza kwa magetsi pakati pa kukhetsa ndi gwero | Kukhazikika kwamphamvu kwamagetsi, kukhathamiritsa kotsetsereka kwa subthreshold | Advanced node logic chips (<14nm) |
| Kuwongolera Kutentha Kwambiri | Insulating wosanjikiza amachepetsa matenthedwe conduction lumikiza | Kuchuluka kwa kutentha kwa 30%, 15-25 ° C kutsika kwa kutentha kwa ntchito | 3D ICs, Zamagetsi zamagalimoto |
| Kukhathamiritsa Kwambiri Kwambiri | Kuchepetsa mphamvu ya parasitic komanso kuyenda bwino kwa chonyamulira | 20% kuchedwa kutsika, kumathandizira> 30GHz kukonza ma siginecha | mmWave kulankhulana, Satellite comm chips |
| Kuwonjezeka Kwapangidwe Kusinthasintha | Palibe doping yabwino yofunikira, imathandizira kukondera kumbuyo | 13% -20% masitepe ocheperako, 40% kachulukidwe kaphatikizidwe kapamwamba | Ma IC ophatikizika, masensa |
| Latch-up Immunity | Insulating layer imadzipatula parasitic PN junctions | Latch-up posachedwa idakwera mpaka> 100mA | Zipangizo zamagetsi zamphamvu kwambiri |
Kufotokozera mwachidule, ubwino waukulu wa SOI ndi: imayenda mofulumira komanso imakhala ndi mphamvu zambiri.
Chifukwa cha machitidwewa a SOI, ili ndi ntchito zambiri m'magawo omwe amafunikira magwiridwe antchito apamwamba komanso kugwiritsa ntchito mphamvu.
Monga tawonera pansipa, kutengera kuchuluka kwa magawo ogwiritsira ntchito omwe akufanana ndi SOI, zitha kuwoneka kuti RF ndi zida zamagetsi zimatengera msika waukulu wa SOI.
| Munda Wofunsira | Machitidwe pamsika |
| RF-SOI (Radiyo Frequency) | 45% |
| Mphamvu SOI | 30% |
| FD-SOI (Yatha Kwambiri) | 15% |
| Zithunzi za SOI | 8% |
| Sensor SOI | 2% |
Ndi kukula kwa misika monga kulumikizana ndi mafoni komanso kuyendetsa pawokha, ma SOI silicon wafers akuyembekezekanso kukhalabe ndi kukula kwina.
XKH, monga wotsogola wotsogola muukadaulo wa Silicon-On-Insulator (SOI), amapereka mayankho athunthu a SOI kuchokera ku R&D mpaka kupanga ma voliyumu pogwiritsa ntchito njira zotsogola zamakampani. Mbiri yathu yonse imaphatikizapo zowotcha za 200mm/300mm za SOI zokhala ndi mitundu ya RF-SOI, Power-SOI ndi FD-SOI, zokhala ndi kuwongolera kolimba kuwonetsetsa kuti magwiridwe antchito azikhala osasinthasintha (kukhuthala mkati mwa ± 1.5%). Timapereka mayankho makonda okhala ndi makulidwe a oxide okwiriridwa (BOX) kuyambira 50nm mpaka 1.5μm ndi mitundu yosiyanasiyana ya resistivity kuti ikwaniritse zofunikira. Pogwiritsa ntchito zaka 15 zaukatswiri waukadaulo komanso njira zolimbikitsira padziko lonse lapansi, timapereka zida zapamwamba za SOI kwa opanga apamwamba kwambiri padziko lonse lapansi, zomwe zimathandizira luso lamakono la chip mu kulumikizana kwa 5G, zamagetsi zamagalimoto, ndi ntchito zanzeru zopangira.
XKH'Zophika za SOI:
Nthawi yotumiza: Apr-24-2025