Zipangizo Zodulira Za Laser Zolondola Kwambiri Za Ma Wafer a SiC a 8-Inch: Ukadaulo Wapakati Wopangira Ma Wafer a SiC Amtsogolo

Silicon carbide (SiC) si ukadaulo wofunikira kwambiri pa chitetezo cha dziko komanso ndi chinthu chofunikira kwambiri m'mafakitale apadziko lonse lapansi a magalimoto ndi mphamvu. Monga gawo loyamba lofunikira kwambiri pakupanga SiC single-crystal, kudula wafer kumatsimikizira mwachindunji ubwino wa kupukuta ndi kupukuta pambuyo pake. Njira zachikhalidwe zodula nthawi zambiri zimayambitsa ming'alu pamwamba ndi pansi pa nthaka, zomwe zimawonjezera kuchuluka kwa kusweka kwa wafer ndi ndalama zopangira. Chifukwa chake, kuwongolera kuwonongeka kwa ming'alu pamwamba ndikofunikira kwambiri pakupititsa patsogolo kupanga zida za SiC.

Pakadali pano, kudula kwa ingot ya SiC kukukumana ndi mavuto awiri akuluakulu:

1. Kutayika kwakukulu kwa zinthu pa kudula kwachikhalidwe kwa waya wambiri:Kuuma kwambiri kwa SiC komanso kufooka kwake kumapangitsa kuti ikhale yopindika komanso yosweka ikadulidwa, kupukutidwa, komanso kupukutidwa. Malinga ndi deta ya Infineon, kudula kwa waya wamitundu yambiri komwe kumapangidwa ndi diamond-resin-bond kumakwaniritsa 50% yokha ya zinthu zomwe zimagwiritsidwa ntchito podula, ndipo kutayika konse kwa wafer imodzi kumafika ~250 μm mutapukuta, zomwe zimapangitsa kuti zinthuzo zisamagwiritsidwe ntchito kwambiri.
2. Kugwiritsa ntchito bwino kochepa komanso nthawi yayitali yopangira:Ziwerengero za kupanga padziko lonse lapansi zikusonyeza kuti kupanga ma wafer 10,000 pogwiritsa ntchito kudula mawaya ambiri kwa maola 24 kumatenga masiku pafupifupi 273. Njirayi imafuna zida zambiri ndi zinthu zina zogwiritsidwa ntchito pamene ikupanga malo ovuta komanso oipitsa (fumbi, madzi otayira).

Pofuna kuthana ndi mavutowa, gulu la Pulofesa Xiu Xiangqian ku Nanjing University lapanga zida zodulira laser zolondola kwambiri za SiC, pogwiritsa ntchito ukadaulo wa laser wothamanga kwambiri kuti achepetse zolakwika ndikuwonjezera zokolola. Pa ingot ya 20-mm SiC, ukadaulo uwu umachulukitsa kawiri kuchuluka kwa wafer poyerekeza ndi kudula waya kwachikhalidwe. Kuphatikiza apo, ma wafer odulira laser amawonetsa kufanana kwabwino kwambiri, zomwe zimathandiza kuchepetsa makulidwe kufika pa 200 μm pa wafer iliyonse ndikuwonjezera mphamvu yotulutsa.

Ubwino Waukulu:

• Kafukufuku ndi Kukonzanso Komaliza pa zipangizo zazikulu zoyesera, zovomerezeka kuti zidule ma wafer a SiC a mainchesi 4–6 ndi ma ingot a SiC oyendetsera magetsi a mainchesi 6.
• Kudula kwa ingot ya mainchesi 8 kukutsimikiziridwa.
• Kudula nthawi yochepa kwambiri, kutulutsa kochuluka pachaka, komanso kukweza zokolola >50%.

Gawo la XKH la SiC la mtundu wa 4H-N

Kuthekera kwa Msika:

Zipangizozi zikukonzekera kukhala njira yothandiza kwambiri yodulira ma ingot a mainchesi 8 a SiC, omwe pakadali pano akulamulidwa ndi zinthu zochokera ku Japan zomwe zimakhala ndi mtengo wokwera komanso zoletsa kutumiza kunja. Kufunika kwa zipangizo zodulira/kuchepetsa ma laser m'dziko muno kumaposa mayunitsi 1,000, komabe palibe njira zina zamakono zopangidwa ku China. Ukadaulo wa Nanjing University uli ndi phindu lalikulu pamsika komanso kuthekera kwachuma.

Kugwirizana kwa Zinthu Zambiri​​:

Kupatula SiC, chipangizochi chimathandizira kukonza gallium nitride (GaN), aluminium oxide (Al₂O₃), ndi diamondi pogwiritsa ntchito laser, zomwe zimapangitsa kuti ntchito zake zamafakitale ziwonjezeke.

Mwa kusintha njira yopangira ma wafer a SiC, luso limeneli likuyang'ana pa zovuta zazikulu pakupanga ma semiconductor pomwe likugwirizana ndi zomwe zikuchitika padziko lonse lapansi pankhani ya zipangizo zogwira ntchito bwino komanso zosagwiritsa ntchito mphamvu zambiri.

Mapeto​

Monga mtsogoleri wamakampani opanga zinthu za silicon carbide (SiC), ​​XKH imadziwika kwambiri popereka zinthu za SiC zazikulu 2-12-inch (kuphatikiza 4H-N/SEMI-type, 4H/6H/3C-type) zopangidwa kuti zigwirizane ndi magawo omwe akukulirakulira monga magalimoto atsopano amphamvu (NEVs), kusungira mphamvu za photovoltaic (PV), ndi kulumikizana kwa 5G. Pogwiritsa ntchito ukadaulo waukulu wodula slicing wafer wotsika kwambiri komanso ukadaulo wokonza molondola kwambiri, tapanga zinthu zambiri za 8-inch substrates ndi kupita patsogolo mu ukadaulo wokulitsa kristalo wa SiC wa mainchesi 12, kuchepetsa kwambiri ndalama za chip pa unit. Patsogolo, tipitiliza kukonza njira zodula laser za ingot-level ndi njira zowongolera kupsinjika kuti tikweze phindu la 12-inch substrate kukhala pamlingo wopikisana padziko lonse lapansi, kupatsa mphamvu makampani aku SiC kuti aswe maulamuliro apadziko lonse lapansi ndikufulumizitsa ntchito zokulira m'malo apamwamba monga ma chips agalimoto ndi magetsi a AI server.

Gawo la XKH la SiC la mtundu wa 4H-N