Galasi Likhala Nsanja Yatsopano Yopangira Zinthu

Galasi likuyamba kukhalazipangizo za papulatifomukwa misika yomaliza yotsogozedwa ndimalo osungira detandikulumikizana kwa mafoniMkati mwa malo osungira deta, imayambitsa zonyamulira ziwiri zazikulu zosungiramo zinthu:zomangamanga za chipndicholowetsa/chotulutsa cha kuwala (I/O).


Zakekuchuluka kochepa kwa kutentha (CTE)ndizonyamulira magalasi zogwirizana ndi deep ultraviolet (DUV)zathandizamgwirizano wosakanizidwandiKukonza kumbuyo kwa 300 mm woonda-waferkuti zikhale njira zoyendetsera zinthu zokhazikika.

Pamene ma switch ndi ma accelerator modules akukula kupitirira kukula kwa wafer-stepper,zonyamulira mapanelomsika wamagalasi oyambira (GCS)akuyembekezeka kufika$460 miliyoni pofika chaka cha 2030, ndi malingaliro abwino omwe akusonyeza kuti anthu ambiri ayamba kugwiritsa ntchito2027–2028Pakadali pano,magalasi olumikiziranaakuyembekezeka kupitiriraMadola miliyoni 400ngakhale pansi pa malingaliro osamala, ndipogawo lokhazikika la chonyamulira galasiikuyimira msika wa pafupifupiMadola miliyoni 500.

In ma CD apamwamba, galasi lasintha kuchoka pa kukhala chinthu chosavuta kufika pa kukhala chinthubizinesi ya nsanjaKwazonyamulira magalasikupeza ndalama kukusintha kuchoka pamitengo pa gulu lililonse to zachuma pa nthawi iliyonse, komwe phindu limadalirakugwiritsanso ntchito ma cycle, Kutulutsa ma laser/UV kumabala zipatso, phindu la ndondomekondikuchepetsa kuwonongeka kwa m'mphepeteIzi zimapindulitsa kwambiri ogulitsa omwe amaperekaMa portfolio olembedwa ndi CTE, opereka ma bundlekugulitsa mitolo yophatikizidwa yachonyamulira + chomatira/LTHC + chochotserandiogulitsa zinthu m'madera osiyanasiyanaakatswiri odziwa bwino ntchito yotsimikizira khalidwe la kuwala.

Makampani omwe ali ndi luso lapamwamba la magalasi—mongaNdondomeko Yoyenera, wodziwika chifukwa chazonyamulira zazitalindima geometries opangidwa mwalusondikutumiza kolamulidwa—zili pamalo abwino kwambiri mu unyolo wamtengo wapatali uwu.

Magalasi oyambira tsopano akutsegula mphamvu zopangira ma panel owonetsera kuti apindule kudzera muTGV (Kudzera mu Galasi), RDL yabwino (Gawo Logawanso)ndinjira zomangiraAtsogoleri a msika ndi omwe amadziwa bwino njira zofunika kwambiri:

  • Kubowola/kudula TGV kopindulitsa kwambiri

  • Kudzaza mkuwa kopanda kanthu

  • Lithography ya gulu lokhala ndi mawonekedwe osinthika

  • 2/2 µm L/S (mzere/malo)kupanga mapangidwe

  • Ukadaulo wowongolera mapanelo wozungulira

Ogulitsa zinthu zapansi ndi OSAT omwe akugwirizana ndi opanga magalasi owonetsera akusinthamphamvu ya dera lalikulumuubwino wa mtengo wopangira ma boardboard.


Kuchokera ku Chonyamulira Kupita ku Zida Zopangidwa ndi Pulatifomu Yonse

Galasi lasintha kuchoka pachonyamulira kwakanthawimunsanja yokwanira yazinthuchifukwa chama CD apamwamba, mogwirizana ndi ma megatrends mongakuphatikiza kwa chiplet, kuyika pagulu, kuyika molunjikandimgwirizano wosakanizidwa—pamenenso akulimbitsa bajeti yamakina, kutenthandichipinda choyeretsamagwiridwe antchito.

Mongachonyamulira(wafer ndi panel),galasi lowonekera, lotsika la CTEzimathandizakulinganiza kochepetsa kupsinjikandikuchotsa ma glu a laser/UV, kukweza zokolola zama wafer a sub-50 µm, kuyenda kwa njira yakumbuyondimapanelo omangidwanso, motero kukwaniritsa kugwiritsa ntchito ndalama zambiri moyenera.

Mongagalasi loyambira, imalowa m'malo mwa organic cores ndikuthandizirakupanga zinthu pamlingo wa panel.

  • Ma TGVperekani mphamvu yolimba yoyimirira komanso njira yotumizira zizindikiro.

  • SAP RDLamakankhira malire a mawaya ku2/2 µm.

  • Malo athyathyathya, osinthika ndi CTEkuchepetsa kuwononga tsamba.

  • Kuwonekera bwinoamakonzekera nthaka yama optics ophatikizidwa pamodzi (CPO).
    Pakadali pano,kutayira kutenthamavuto amathetsedwa kudzera mundege zamkuwa, ma vias osokedwa, maukonde operekera mphamvu kumbuyo (BSPDN)ndikuziziritsa mbali ziwiri.

Mongacholumikizira galasi, nkhaniyi ikuyenda bwino pansi pa njira ziwiri zosiyana:

  • Mawonekedwe osagwira ntchito, zomwe zimathandiza kuti ma 2.5D AI/HPC ndi ma switch architectures akuluakulu azikwaniritsa kuchuluka kwa mawaya ndi kuchuluka kwa ma bump komwe sikungapezeke ndi silicon pamtengo wofanana ndi dera.

  • Mawonekedwe ogwira ntchitokuphatikizaSIW/zosefera/antennandingalande zopangidwa ndi zitsulo kapena mafunde olembedwa ndi lasermkati mwa substrate, kupindika njira za RF ndikuyendetsa I/O yowunikira kupita ku periphery popanda kutayika kwakukulu.


Chiyembekezo cha Msika ndi Kusintha kwa Makampani

Malinga ndi kusanthula kwaposachedwa kwaGulu la Yole, zipangizo zagalasi zakhalaChofunika kwambiri pa kusintha kwa ma phukusi a semiconductor, chifukwa cha zochitika zazikulu muluntha lochita kupanga (AI), makompyuta ogwira ntchito bwino kwambiri (HPC), Kulumikizana kwa 5G/6Gndima optics ophatikizidwa pamodzi (CPO).

Akatswiri akugogomezera kuti magalasikatundu wapadera—kuphatikizapo zakeCTE yotsika, kukhazikika kwapamwamba kwambirindikuwonekera bwino kwa kuwala—pangani kuti zikhale zofunikira kwambiri kuti mukwaniritsezofunikira pa makina, zamagetsi, ndi kutenthama phukusi a m'badwo wotsatira.

Yole akunenanso kutimalo osungira detanditelefonikhalanibeinjini zoyambira kukulakuti magalasi agwiritsidwe ntchito m'mabokosi, pomwemagalimoto, chitetezondizamagetsi apamwamba kwambiriMagawo awa amadalira kwambirikuphatikiza kwa chiplet, mgwirizano wosakanizidwandikupanga zinthu pamlingo wa panel, komwe galasi silimangowonjezera magwiridwe antchito komanso limachepetsa mtengo wonse.

Pomaliza, kuonekera kwamaunyolo atsopano ogulitsa ku Asia—makamaka muChina, South Korea, ndi Japan—imadziwika kuti ndi chinthu chofunikira kwambiri chothandizira kukulitsa kupanga ndi kulimbitsachilengedwe chapadziko lonse lapansi cha magalasi apamwamba opaka.


Nthawi yotumizira: Okutobala-23-2025