Mutu: Kodi FOUP mu Kupanga Ma Chip ndi Chiyani?

M'ndandanda wazopezekamo

1. Chidule ndi Ntchito Zazikulu za FOUP

2.​​Makhalidwe ndi Kapangidwe ka FOUP​

3. Malangizo Ogwiritsira Ntchito ndi Kugawa FOUP

4. Ntchito ndi Kufunika kwa FOUP mu Kupanga Ma Semiconductor​

5.​Mavuto a Ukadaulo ndi Zochitika Zachitukuko Zamtsogolo​

Mayankho Opangidwa Mwamakonda a 6.XKH ndi Chithandizo cha Utumiki​

Mu njira yopangira ma semiconductor, Front Opening Unified Pod (FOUP) ndi chidebe chofunikira kwambiri chomwe chimagwiritsidwa ntchito kuteteza, kunyamula, ndi kusunga ma wafer. Mkati mwake mutha kusunga zidutswa 25 za ma wafer a 300mm, ndipo zigawo zake zazikulu zimaphatikizapo chidebe chotsegulira kutsogolo ndi chimango cha chitseko chotsegulira ndi kutseka. FOUP ndi chonyamulira chachikulu mu dongosolo loyendetsa lokha mkati mwa ma wafer a mainchesi 12. Nthawi zambiri imanyamulidwa mu mkhalidwe wotsekedwa ndipo imatsegulidwa kokha ikakankhidwira ku doko lonyamula katundu wa zida, zomwe zimapangitsa kuti ma wafer asamutsidwe kupita ku doko lokweza/kutsitsa katundu la zida.

Kapangidwe ka FOUP kamakonzedwa kuti kagwirizane ndi zofunikira za malo ozungulira. Ili ndi mipata kumbuyo kuti ilowetse wafer, ndipo chivindikirocho chapangidwa makamaka kuti chigwirizane ndi chomangira cha chotsegulira. Maloboti ogwiritsira ntchito wafer amagwira ntchito pamalo oyera a Class 1, kuonetsetsa kuti wafers sizikuipitsidwa panthawi yotumizira. Kuphatikiza apo, FOUP imasunthidwa pakati pa zida zoyendetsera ntchito kudzera mu automated material handling system (AMHS). Ma wafer fab amakono nthawi zambiri amagwiritsa ntchito njira za njanji zoyendera pamwamba pa sitima, pomwe ma wab angapo akale angagwiritse ntchito magalimoto oyendetsedwa ndi automated based ground (AGVs).

FOUP sikuti imangothandiza kusamutsa ma wafer okha komanso imagwira ntchito yosungira. Chifukwa cha njira zambiri zopangira, ma wafer angatenge miyezi kuti amalize njira yonse yoyendetsera ntchito. Kuphatikiza ndi kuchuluka kwa kupanga pamwezi, izi zikutanthauza kuti ma wafer ambiri mkati mwa fakitale nthawi zonse amakhala akusungidwa kwakanthawi kapena kwakanthawi nthawi iliyonse. Posungira, ma FOUP nthawi ndi nthawi amatsukidwa ndi nayitrogeni kuti zinthu zodetsa zisakhudze ma wafer, zomwe zimapangitsa kuti njira yopangira ikhale yoyera komanso yodalirika.

1. Ntchito ndi Kufunika kwa FOUP

Ntchito yaikulu ya FOUP ndikuteteza ma wafers ku mantha akunja ndi kuipitsidwa, makamaka kupewa kukhudzidwa ndi kukolola panthawi yosamutsa. Imaletsa chinyezi bwino kudzera munjira monga kutsuka mpweya ndi Local Atmosphere Control (LAC), kuonetsetsa kuti ma wafers amakhalabe otetezeka pamene akuyembekezera gawo lotsatira lopangira. Dongosolo lake lotsekedwa komanso lolamulidwa limalola zinthu zofunikira zokha kulowa, zomwe zimachepetsa kwambiri zotsatira zoyipa za VOCs, mpweya, ndi chinyezi pa ma wafers.

Popeza FOUP yodzaza ndi ma wafer 25 imatha kulemera mpaka makilogalamu 9, mayendedwe ake ayenera kudalira Automated Material Handling System (AMHS). Kuti izi zitheke, FOUP idapangidwa ndi mitundu yosiyanasiyana ya ma coupling plates, ma pin, ndi mabowo, ndipo ili ndi ma RFID electronic tag kuti idziwike mosavuta komanso igawane magulu. Kugwira ntchito kumeneku kumafuna pafupifupi ntchito yamanja, kuchepetsa kwambiri kuchuluka kwa zolakwika ndikuwonjezera chitetezo ndi kulondola kwa njira yopangira.

2. Kapangidwe ndi Kugawa kwa FOUP​

Miyeso yodziwika bwino ya FOUP ndi pafupifupi 420 mm m'lifupi, 335 mm kuya, ndi 335 mm kutalika. Zigawo zake zazikulu zimaphatikizapo: OHT yapamwamba (mutu wa bowa) yonyamulira chogwirira pamwamba; Chitseko chakutsogolo cholowera chogwirira zida; Zogwirira zam'mbali, zomwe nthawi zambiri zimakhala ndi utoto wosiyanasiyana kuti zisiyanitse madera omwe ali ndi milingo yosiyanasiyana ya kuipitsidwa; Malo a Khadi oyika makadi otumizira uthenga; ndi chizindikiro cha RFID cha pansi chomwe chimagwira ntchito ngati chizindikiro chapadera cha FOUP, zomwe zimathandiza zida ndi zogwirira pamwamba kuzizindikira. Pansi pake palinso mabowo anayi ozindikiritsa ndi kuyikapo kuti agwirizane ndi zida ndi madera ozindikiritsa.

Kutengera ndi kagwiritsidwe ntchito, ma FOUP amagawidwa m'magulu atatu: PRD (yopangira), ENG (ya ma wafer aukadaulo), ndi MON (ya ma wafer owunikira). Ma PRD FOUP angagwiritsidwe ntchito popanga zinthu, mitundu ya ENG ndi yoyenera kafukufuku ndi chitukuko kapena zoyeserera, ndipo mitundu ya MON imadzipereka kuwunikira njira monga CMP ndi DIFF. Ndikofunikira kudziwa kuti ma PRD FOUP angagwiritsidwe ntchito pa zolinga za ENG ndi MON, ndipo mitundu ya ENG ingagwiritsidwe ntchito pa MON, koma ntchito yobwerera m'mbuyo imabweretsa zoopsa.

Potengera kuchuluka kwa kuipitsidwa, ma FOUP amatha kugawidwa m'magulu awiri: FE FOUP (njira yoyambira, yopanda zitsulo), BE FOUP (njira yoyambira kumbuyo, yokhala ndi zitsulo), ndi omwe amapangidwa makamaka pazinthu zinazake zachitsulo monga NI FOUP, CU FOUP, ndi CO FOUP. Ma FOUP azinthu zosiyanasiyana nthawi zambiri amasiyanitsidwa ndi mtundu wa zogwirira zam'mbali kapena mapanelo a zitseko. Ma FOUP ochokera kuzinthu zoyambira angagwiritsidwe ntchito pazinthu zoyambira kumbuyo, koma ma FOUP a kumbuyo sayenera kugwiritsidwa ntchito pazinthu zoyambira kutsogolo, chifukwa izi zingayambitse ngozi ya kuipitsidwa.

Monga kampani yofunika kwambiri pakupanga zinthu zopangidwa ndi ma semiconductor, FOUP, kudzera mu automation yapamwamba komanso kuletsa kuipitsidwa, imaonetsetsa kuti ma wafers ndi otetezeka komanso aukhondo panthawi yopanga, zomwe zimapangitsa kuti akhale maziko ofunikira kwambiri mu ma wafers amakono.

Mapeto

XKH yadzipereka kupatsa makasitomala mayankho a Front-Opening Unified Pod (FOUP) okonzedwa bwino kwambiri, kutsatira zofunikira zanu za ndondomeko ndi mawonekedwe a zida. Pogwiritsa ntchito ukadaulo wapamwamba wazinthu ndi njira zopangira molondola, timaonetsetsa kuti chinthu chilichonse cha FOUP chimapereka mpweya wabwino, ukhondo, komanso kukhazikika kwa makina. Gulu lathu laukadaulo lili ndi ukadaulo waukulu m'makampani, limapereka chithandizo chokwanira cha moyo wonse—kuyambira kufunsira kusankha ndi kukonza kapangidwe kake mpaka kuyeretsa ndi kukonza—kutsimikizira kuphatikizana bwino komanso mgwirizano wabwino pakati pa FOUP ndi Automated Material Handling System (AMHS) yanu komanso zida zogwirira ntchito. Nthawi zonse timaika patsogolo chitetezo cha ma wafers ndi kukulitsa phindu la kupanga monga zolinga zathu zazikulu. Kudzera muzinthu zatsopano ndi ntchito zaukadaulo zonse, timapereka chitsimikizo champhamvu cha njira zanu zopangira ma semiconductor, pamapeto pake timalimbikitsa magwiridwe antchito opanga ndi phindu la zinthu.